• Show Sidebar

There are 5244 products.

Active filters

170 Models 8500pcs RC0603 SMD FR07 Series YAGEO Resistor 1 Accuracy Sample Book Assortment Kit

SMD YAGEO Resistor kit: * RC0201 RC0402 RC0603 RC0805 RC1206

Specification:

Material: Faux leather, Plastic, Paper

Size: 18.5cm x 13cm x 3cm/7.3'' x 5.1'' x 1.2''

Color: Black

Feature:

0603 1%(except 0 ohm) SMD 1/10W resistors,170 values 50 pcs/value, total 8500pcs.

Just the same size as an ordinary book, small but put everything in its place, so saves space and is easy to carry.

Clear label on the front and on the back of every paper taping, never mixed up.

Beginner hobbyists and veteran electronics experts alike will appreciate the variety and organization of components included with this kit.

Notice:

1. Please allow 1-3cm error due tomanualmeasurement. Please make sure you do not mind before you bid.

2. The color may have different as the difference display, please understand.

Package includes:

1 x 0603 1% SMD Resistor 170 Values 8500pcs Sample Book

CH001847
€37.97

170 Models 8500pcs RC0603 SMD FR-07 Series YAGEO Resistor 1% Accuracy Sample Book Assortment Kit

LE82Q35 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001849
€5.40

LE82Q35 Stencil Template

2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001850
€43.53

216-0732025 HD4850M

TI TPS51123ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001851
€3.45

TI TPS51123ATI

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable crocodileClip

More Similar Products

1 Pair 1000V 20A Universal Digital Multimeter Meter Probe Test Leads 3mm Pin Red + Black

Features :

100% brand new and high quality.

The anterior gold-plated design, in the test, the sensitivity of pens and higher and more accurate.

22mm Plug Insertion Depth.

Up to 20A / 1000V

Material: PVC and Alloy

Color: Black + Red

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

1 x crocodileClip

CH001852
€2.70

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable + crocodileClip

mPGA478B Foxconn BGA Socket Intel CPU Base New Model 478pin

mPGA478B Foxconn BGA Socket Intel CPU Base New Model 478pin

Part Number mPGA478B Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001854
€3.73

mPGA478B Foxconn BGA Socket Intel CPU Base New Model 478pin

GFGO6600A4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001856
€5.40

GF-GO6600-A4 Stencil Template

Maxim MAX17005e

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001857
€4.77

Maxim MAX17005e

170 Models 8500pcs RC0603 SMD FR07 Series YAGEO Resistor 1 Accuracy Sample Book Assortment Kit

SMD YAGEO Resistor kit: * RC0201 RC0402 RC0603 RC0805 RC1206

Specification:

Material: Faux leather, Plastic, Paper

Size: 18.5cm x 13cm x 3cm/7.3'' x 5.1'' x 1.2''

Color: Black

Feature:

0603 1%(except 0 ohm) SMD 1/10W resistors,170 values 50 pcs/value, total 8500pcs.

Just the same size as an ordinary book, small but put everything in its place, so saves space and is easy to carry.

Clear label on the front and on the back of every paper taping, never mixed up.

Beginner hobbyists and veteran electronics experts alike will appreciate the variety and organization of components included with this kit.

Notice:

1. Please allow 1-3cm error due tomanualmeasurement. Please make sure you do not mind before you bid.

2. The color may have different as the difference display, please understand.

Package includes:

1 x 0603 1% SMD Resistor 170 Values 8500pcs Sample Book

CH001847
€37.97

170 Models 8500pcs RC0603 SMD FR-07 Series YAGEO Resistor 1% Accuracy Sample Book Assortment Kit

LE82Q35 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001849
€5.40

LE82Q35 Stencil Template

2160732025 HD4850M

216-0732025 HD4850M

Part Number 216-0732025 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 360 Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001850
€43.53

216-0732025 HD4850M

TI TPS51123ATI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001851
€3.45

TI TPS51123ATI

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable crocodileClip

More Similar Products

1 Pair 1000V 20A Universal Digital Multimeter Meter Probe Test Leads 3mm Pin Red + Black

Features :

100% brand new and high quality.

The anterior gold-plated design, in the test, the sensitivity of pens and higher and more accurate.

22mm Plug Insertion Depth.

Up to 20A / 1000V

Material: PVC and Alloy

Color: Black + Red

Package includeds :

1 x Pair of Digital Multimeter Meter Probe

1 x crocodileClip

CH001852
€2.70

1 Pair 1000V 20A Universal Digital Multimeter Multi Meter Test Lead Probe Wire Pen Cable + crocodileClip

mPGA478B Foxconn BGA Socket Intel CPU Base New Model 478pin

mPGA478B Foxconn BGA Socket Intel CPU Base New Model 478pin

Part Number mPGA478B Manufacturer Foxconn

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001854
€3.73

mPGA478B Foxconn BGA Socket Intel CPU Base New Model 478pin

GFGO6600A4 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001856
€5.40

GF-GO6600-A4 Stencil Template

Maxim MAX17005e

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001857
€4.77

Maxim MAX17005e