Size: 200mm*100m*0.06mm

Condition: New

Material: Polyethylene

Feature:

Use this non sticky film to protect smartphone glass/digitizer/LCD screen from scratches and dusts while repairing or to clean up the small dusts on the LCD before applying a new glass/digitizer.

Bright and clean, to prevent the product from pollution, corrosion, scratch when product, storage, transport.

Leaves no glue residue and no take sticky after peeling off.

Widely used For LCD, Screen, Display protective, with more than 95% transmittance.

Good adsorption capacity.

Package include:

1x Roll 200mm*100m Protective Sticky Film Tape

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3012 Adapter for XELTEK SuperPro 6100N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3045 Adapter for XELTEK SuperPro 6100N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

215-0752007 RX881

Part Number 215-0752007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Sony PCG-K Series DC Power Jack Connector: PCG-K12, PCG-K12P, PCG-K13, PCG-K13F, PCG-K14, PCG-K15, PCG-K15F (PCG-9P6L), PCG-K17, (PCG-9P6L), PCG-K23, PCG-K25, PCG-K27, VGN-K31, VGN-K31B, PCG-K33, PCG-K33P, PCG-K33F, PCG-K33Q, PCG-K34FP, PCG-K35, PCG-K35F, PCG-K37 (PCG-9S1L), PCG-K45, PCG-K43F, PCG-K43Q, PCG-K44FP, PCG-K45F, PCG-K47, PCG-K64, PCG-K66P, VGN-K71B, PCG-K86P, PCG-K86SP, PCG-K315B, PCG-K315M, PCG-K315S, PCG-K315Z, PCG-K415B, PCG-K415S

Sony PCG-GRT Series DC Power Jack Connector: PCG-GRT100 (PCG-8M2R), PCG-GRT100K, PCG-GRT100P (PCG-8M1R), PCG-GRT150 (PCG-8M3L), PCG-GRT160 (PCG-8M4L), PCG-GRT170 (PCG-8M2L), PCG-GRT190, PCG-GRT230 (PCG-8N2L), PCG-GRT240, PCG-GRT250, PCG-GRT250K, PCG-GRT250P, PCG-GRT260, PCG-GRT270, PCG-GRT270G, PCG-GRT270K, PCG-GRT270P (PCG-8N1L), PCG-GRT280ZG (PCG-8N3L), PCG-GRT290Z, PCG-GRT290ZP. PCG-GRT350, PCG-GRT360ZG, PCG-GRT380ZG, PCG-GRT390Z, PCG-GRT390ZP

Sony PCG-NV Series DC Power Jack Connector: PCG-NV100, PCG-NV100P, PCG-NV170, PCG-NV170P, PCG-NV190, PCG-NV190P, PCG-NV200, PCG-NV290

Sony VGN-A Series DC Power Jack Connector: VGN-A19, VGN-A21, VGN-A51PS1, VGN-A51PS2, VGN-A51S1, VGN-A51S2, VGN-A61B, VGN-A71PS, VGN-A71S, VGN-A100, VGN-A130 (PCG-8Q8L), VGN-A130B, VGN-A130P (PCG-8Q9L), VGN-A140, VGN-A140P, VGN-A150, VGN-A160, VGN-A170 (PCG-8Q1L), VGN-A170B, VGN-A170P (PCG-8Q4L), VGN-A190 (PCG-8Q5L), VGN-A215M, VGN-A215Z, VGN-A217M, VGN-A230, VGN-A230B, VGN-A230P (PCG-8R9L), VGN-A240, VGN-A240B, VGN-A240P, VGN-A250, VGN-A260 (PCG-8R7L), VGN-A270, VGN-A270B, VGN-A270P (PCG-8R1L), VGN-A290, VGN-A290F (PCG-8R4L), VGN-A295HP, VGN-A297XP, VGN-A600, VGN-A600B, VGN-A600P (PCG-8S3L), VGN-A690 (PCG-8S4L), VGN-A790 (PCG-8T2L)

Sony VGN-AR Series DC Power Jack Connector: VGN-AR130G, VGN-AR150G, VGN-AR170, VGN-AR170G, VGN-AR170GU1, VGN-AR170GX1, VGN-AR170P, VGN-AR190G, VGN-AR230G, VGN-AR250G, VGN-AR270G, VGN-AR270GA, VGN-AR270P, VGN-AR290G, VGN-AR320E, VGN-AR350E, VGN-AR370, VGN-AR390CE, VGN-AR390E, VGN-AR520E, VGN-AR550E, VGN-AR550U, VGN-AR570, VGN-AR570N, VGN-AR570U, VGN-AR590CE, VGN-AR590E, VGN-AR605E, VGN-AR610E, VGN-AR620E, VGN-AR630E, VGN-AR650U, VGN-AR660U, VGN-AR670, VGN-AR670N, VGN-AR690CU, VGN-AR690U, VGN-AR705E/B, VGN-AR710E/B, VGN-AR720E, VGN-AR720E/B, VGN-AR730E/B, VGN-AR750E/B, VGN-AR760U/B, VGN-AR770, VGN-AR770CU, VGN-AR770E, VGN-AR790U/B, VGN-AR810E, VGN-AR830E, VGN-AR840E, VGN-AR870, VGN-AR870NA, VGN-AR870NB, VGN-AR870NC, VGN-AR870ND, VGN-AR890U, PCG-8V1L, PCG-8V2L, PCG-8W1L, PCG-8W2L, PCG-8X1L, PCG-8X2L, PCG-8Y1L, PCG-8Y2L, PCG-8Z1L, PCG-8Z2L

Sony VGN-AW Series DC Power Jack Connector: PCG-8152L, VGN-AW110D, VGN-AW110J, VGN-AW110JH, VGN-AW110N, VGN-AW110NH, VGN-AW120D, VGN-AW120J, VGN-AW120JH, VGN-AW125J, VGN-AW125JH, VGN-AW130J, VGN-AW130JH, VGN-AW150, VGN-AW150J, VGN-AW150Y, VGN-AW150YH, VGN-AW160J, VGN-AW170C, VGN-AW170Y, VGN-AW180AU, VGN-AW180Y, VGN-AW190, VGN-AW190C, VGN-AW190CE, VGN-AW190CJ, VGN-AW190CN, VGN-AW190CU, VGN-AW190CY, VGN-AW190E, VGN-AW190J, VGN-AW190JAH, VGN-AW190N, VGN-AW190NAB, VGN-AW190NBB, VGN-AW190NCB, VGN-AW190U, VGN-AW190Y, VGN-AW190YAB, VGN-AW190YBB, VGN-AW190YCB, VGN-AW210JH, VGN-AW220J, VGN-AW220JB, VGN-AW220JH, VGN-AW230J, VGN-AW230JB, VGN-AW230JH, VGN-AW235J, VGN-AW235JB, VGN-AW290, VGN-AW290J, VGN-AW290JAH, VGN-AW290Y, VGN-AW310D, VGN-AW310JH, VGN-AW330JH, VGN-AW335JH, VGN-AW350JB, VGN-AW350JH, VGN-AW360JB, VGN-AW360JH, VGN-AW390, VGN-AW390JAH, VGN-AW390JBH, VGN-AW390JCH, VGN-AW390JDH, VGN-AW390JEH, VGN-AW420F, VGN-AW420F/H, VGN-AW450F, VGN-AW450F/H

Sony VGN-AX Series DC Power Jack Connector: VGN-AX570G, VGN-AX580G

Sony VGN-BX Series DC Power Jack Connector: VGN-BX540, VGN-BX540B, VGN-BX540B/H, VGN-BX540BW, VGN-BX540W, VGN-BX541B, VGN-BX543B, VGN-BX546B, VGN-BX546BW, VGN-BX560, VGN-BX560B, VGN-BX560B/H, VGN-BX561B, VGN-BX563B, VGN-BX565B, VGN-BX567B, VGN-BX570B, VGN-BX570B/H, VGN-BX575B, VGN-BX640P (PCG-9X5L), VGN-BX645P, VGN-BX660P, VGN-BX665P, VGN-BX670P, VGN-BX675P, VGN-BX740, VGN-BX740N, VGN-BX740P, VGN-BX760, VGN-BX760N, VGN-BX760P

Sony VGN-CS Series DC Power Jack Connector: PCG-3C2L, PCG-3G1L, PCG-3G2L, PCG-3G3L, PCG-3G4L, PCG-3G5L, PCG-3G6L, VGN-CS107D, VGN-CS107DP, VGN-CS107DW, VGN-CS107E, VGN-CS107EP, VGN-CS107ER, VGN-CS107EW, VGN-CS108D, VGN-CS108DR, VGN-CS108E, VGN-CS108EP, VGN-CS108ER, VGN-CS108EW, VGN-CS109E, VGN-CS109EP, VGN-CS109ER, VGN-CS109EW, VGN-CS110D, VGN-CS110DP, VGN-CS110DR, VGN-CS110DW, VGN-CS110E, VGN-CS110EP, VGN-CS110ER, VGN-CS110EW, VGN-CS115D, VGN-CS115DP, VGN-CS115DR, VGN-CS115DW, VGN-CS115J, VGN-CS115JP, VGN-CS115JR, VGN-CS115JW, VGN-CS118E, VGN-CS118EP, VGN-CS118ER, VGN-CS118EW, VGN-CS120J, VGN-CS120JP, VGN-CS120JR, VGN-CS120JW, VGN-CS160A, VGN-CS160AP, VGN-CS160AR, VGN-CS160AW, VGN-CS160J, VGN-CS160JP, VGN-CS160JR, VGN-CS160JW, VGN-CS180J, VGN-CS180JP, VGN-CS180JR, VGN-CS180JW, VGN-CS190, VGN-CS190C, VGN-CS190CE, VGN-CS190CN, VGN-CS190CU, VGN-CS190E, VGN-CS190J, VGN-CS190N, VGN-CS190NU, VGN-CS190Y, VGN-CS204JR, VGN-CS204JW, VGN-CS205J, VGN-CS205JP, VGN-CS205JR, VGN-CS205JW, VGN-CS209J, VGN-CS209JP, VGN-CS209JR, VGN-CS209JW, VGN-CS215J, VGN-CS215JP, VGN-CS215JR, VGN-CS215JW, VGN-CS220J, VGN-CS220JP, VGN-CS220JR, VGN-CS220JT, VGN-CS220JW, VGN-CS230J, VGN-CS230JP, VGN-CS230JR, VGN-CS230JW, VGN-CS260J, VGN-CS260JP, VGN-CS260JR, VGN-CS260JW, VGN-CS280J, VGN-CS280JP, VGN-CS280JR, VGN-CS290, VGN-CS290J, VGN-CS290JEP, VGN-CS290N, VGN-CS290Y, VGN-CS308J, VGN-CS308J/P, VGN-CS308J/Q, VGN-CS310J, VGN-CS310J/P, VGN-CS310J/Q, VGN-CS310J/R, VGN-CS310J/W, VGN-CS320J, VGN-CS320J/P, VGN-CS320J/Q, VGN-CS320J/R, VGN-CS320J/W, VGN-CS325J, VGN-CS325J/P, VGN-CS325J/Q, VGN-CS325J/R, VGN-CS325J/W, VGN-CS385J, VGN-CS385J/P, VGN-CS385J/Q, VGN-CS385J/R, VGN-CS390, VGN-CS390D, VGN-CS390DBB, VGN-CS390DCB, VGN-CS390DDB, VGN-CS390DEB, VGN-CS390DFB, VGN-CS390DGB, VGN-CS390DHB, VGN-CS390J, VGN-CS390JAB, VGN-CS390JBB, VGN-CS390JCP, VGN-CS390JCQ, VGN-CS390JCR, VGN-CS390JCW, VGN-CS390JDV, VGN-CS390JKI, VGN-CS390JKJ, VGN-CS390JKU, VGN-CS390JKV

Note: This is the Jack only, you will need to reuse your harness.

Buy Limit Frame: * 11.5*13mm, 12*16mm, 12*18mm, 14*18mm

Product Characteristics

1. Using standard SD interface mode, the corresponding operation such as test or burning can be realized by connecting card reader with computer or through SD interface of programmer.

2. Compatible with ball-and-ball testing, IC limit frame is molded in one. It can be replaced by different size limit frame according to IC, so that IC of different size can be used universally.

3. Supporting hot plug-in and testing for PIN connection through SD interface or through connection with board row;

4. PCB adopts four-layer circuit structure to reduce the instability of test caused by signal interference. The golden finger is plated with thick gold to ensure durability and contact.

5. At the same time compatible: Toshiba, Samsung, Hynix, Intel, Sandisk and other brand IC;

6. Compatible with 153-FBGA 169-FBGA;

7. The shrapnel is stamped by imported beryllium copper through high precision die, the head-shaped probe is designed, and the later stage is hardened and plated with thick gold layer to ensure the stability and durability of the product.

8. The whole structure of the contact module reduces the repetitive positioning problem, ensures the precise alignment between the contact point and the IC PAD, and has a high pass rate in one test.

9. The through-hole welding structure is adopted to ensure good contact, and the positioning holes of SOCKET and PCBA are precisely positioned to facilitate replacement.

10. The top-window structure is adopted, which is compatible with manual and automatic testing and easy to operate.

11. Pressure IC adopts self-adapting structure of integral moulding and spring, which ensures that IC with different thickness does not need any adjustment to ensure good contact and wide universality of IC for testing.

12. The structure is formed by injection moulding, with precise positioning, easy access to IC and higher working efficiency.

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock