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N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

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Ethernet Shield W5100 Network Expansion Board For Arduino UNO R3 Mega 2560

Ethernet Shield W5100 Network Expansion Board For Arduino UNO R3 Mega 2560

Description:

With this Ethernet Shield, your Arduino board can be used to connect to internet.

Can be used as server or client.

Directly plug puzzle board, no soldering required.

This is the latest version of the ethernet shield.

Fits all version of Arduino main board, 2009, UNO, mega 1280, mega 2560.

This Arduino Ethernet Shield which is based on the Wiznet W5100 ethernet chip gives you an easy way to get your Arduino online.

Specification:

Controller: w5100

Size: 7.4 x 5.4 x 2.4 (2.91 x 2.12 x 0.94inch)

MAC address: 0xDE, 0xAD, 0xBE, 0xEF, 0xFE, 0xED byte mac[] = { 0xDE, 0xAD, 0xBE, 0xEF, 0xFE, 0xED }

Feature:

It is directly supported by Arduino official Ethernet Library.

It adds a micro-SD card slot, which can be used to store files for serving over the network.

It is compatible with the Arduino Duemilanove (168 or 328), UNO as well as Mega (1280/2560) and can be accessed using the SD library.

The Wiznet W5100 provides a network (IP) stack capable of both TCP and UDP.

It supports up to four simultaneous socket connections.

Use the Ethernet library to write sketches which connect to the internet using the shield.

Package included:

1 x W5100 ethernet shield

CH000679
€7.46

Ethernet Shield W5100 Network Expansion Board For Arduino UNO R3 Mega 2560

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

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GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

wishlist
Compare
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8PK366NG ProsKit DESOLDERING PUMP

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000706
€14.79

8PK-366N-G Pro-sKit DESOLDERING PUMP

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2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

wishlist
Compare

Ethernet Shield W5100 Network Expansion Board For Arduino UNO R3 Mega 2560

Ethernet Shield W5100 Network Expansion Board For Arduino UNO R3 Mega 2560

Description:

With this Ethernet Shield, your Arduino board can be used to connect to internet.

Can be used as server or client.

Directly plug puzzle board, no soldering required.

This is the latest version of the ethernet shield.

Fits all version of Arduino main board, 2009, UNO, mega 1280, mega 2560.

This Arduino Ethernet Shield which is based on the Wiznet W5100 ethernet chip gives you an easy way to get your Arduino online.

Specification:

Controller: w5100

Size: 7.4 x 5.4 x 2.4 (2.91 x 2.12 x 0.94inch)

MAC address: 0xDE, 0xAD, 0xBE, 0xEF, 0xFE, 0xED byte mac[] = { 0xDE, 0xAD, 0xBE, 0xEF, 0xFE, 0xED }

Feature:

It is directly supported by Arduino official Ethernet Library.

It adds a micro-SD card slot, which can be used to store files for serving over the network.

It is compatible with the Arduino Duemilanove (168 or 328), UNO as well as Mega (1280/2560) and can be accessed using the SD library.

The Wiznet W5100 provides a network (IP) stack capable of both TCP and UDP.

It supports up to four simultaneous socket connections.

Use the Ethernet library to write sketches which connect to the internet using the shield.

Package included:

1 x W5100 ethernet shield

CH000679
€7.46

Ethernet Shield W5100 Network Expansion Board For Arduino UNO R3 Mega 2560

wishlist
Compare

N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

wishlist
Compare

GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

wishlist
Compare

GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

wishlist
Compare

2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

wishlist
Compare

8PK366NG ProsKit DESOLDERING PUMP

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000706
€14.79

8PK-366N-G Pro-sKit DESOLDERING PUMP

wishlist
Compare

2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

wishlist
Compare
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