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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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G92270A2

G92-270-A2

Part Number G92-270-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001005
€49.03

G92-270-A2

  • -20%
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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i5 I54250U MD711LLA

PO000056
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i5 I5-4250U MD711LL/A

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2150674034 RX781

215-0674034 RX781

Part Number 215-0674034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1407

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001015
€39.18

215-0674034 RX781

  • -20%
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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i7 I74650U BTOCTO

PO000057
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i7 I7-4650U BTO/CTO

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2160774007 HD5470

216-0774007 HD5470

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001019
€67.57

216-0774007 HD5470

  • -20%
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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i5 I54250U MD760LLA

PO000058
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i5 I5-4250U MD760LL/A

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SR405

SR405

Part Number SR405 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001024
€42.63

SR405

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215CDABKA15FG

215CDABKA15FG

Part Number AC82GL40 SLGGM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1139

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001025
€16.54

215CDABKA15FG

  • -20%
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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i7 I74650U BTOCTO

PO000059
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i7 I7-4650U BTO/CTO

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N17EG1A1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
€349.80

N17E-G1-A1 GTX1060

  • -20%
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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i5 I54260U MD711LLB

PO000060
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i5 I5-4260U MD711LL/B

  • -20%
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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i7 I74650U MF067LLA

PO000061
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i7 I7-4650U MF067LL/A

G92270A2

G92-270-A2

Part Number G92-270-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001005
€49.03

G92-270-A2

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  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i5 I54250U MD711LLA

PO000056
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i5 I5-4250U MD711LL/A

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2150674034 RX781

215-0674034 RX781

Part Number 215-0674034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1407

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001015
€39.18

215-0674034 RX781

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Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i7 I74650U BTOCTO

PO000057
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i7 I7-4650U BTO/CTO

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2160774007 HD5470

216-0774007 HD5470

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001019
€67.57

216-0774007 HD5470

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Compare
  • -20%

A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i5 I54250U MD760LLA

PO000058
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i5 I5-4250U MD760LL/A

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Compare

SR405

SR405

Part Number SR405 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001024
€42.63

SR405

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Compare

215CDABKA15FG

215CDABKA15FG

Part Number AC82GL40 SLGGM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1139

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001025
€16.54

215CDABKA15FG

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Compare
  • -20%

A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i7 I74650U BTOCTO

PO000059
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i7 I7-4650U BTO/CTO

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Compare

N17EG1A1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
€349.80

N17E-G1-A1 GTX1060

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Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i5 I54260U MD711LLB

PO000060
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i5 I5-4260U MD711LL/B

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Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i7 I74650U MF067LLA

PO000061
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i7 I7-4650U MF067LL/A

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