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  • Categories: Bios Chip Programming
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A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

Intersil ISL95835HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000423
€3.45

Intersil ISL95835HRZ

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i7 I77Y75 BTOCTO

PO000035
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i7 I7-7Y75 BTO/CTO

Winbond W25Q32FW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000426
€3.45

Winbond W25Q32FW

Infineon SLB 9635 TT 12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
€3.97

Infineon SLB 9635 TT 1.2

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

SMSC LPC47N250MD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
€3.45

SMSC LPC47N250-MD

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTOCTO

PO000037
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTO/CTO

RENESAS RJK03E1DNS HWSON8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
€3.45

RENESAS RJK03E1DNS HWSON-8

A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LLA

PO000038
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LL/A

A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LLA

PO000039
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LL/A

OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
€3.45

OZ129TN

  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i5 I57Y54 MNYG2LLA

PO000034
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i5 I5-7Y54 MNYG2LL/A

Intersil ISL95835HRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000423
€3.45

Intersil ISL95835HRZ

  • -20%

A1534 EMC 3099 Bios Chip EFI Firmware 820-00687 Mid2017 Core i7 I77Y75 BTOCTO

PO000035
€18.00 €22.50

A1534 EMC 3099 Bios EFI Firmware 820-00687 Mid-2017 Core i7 I7-7Y75 BTO/CTO

Winbond W25Q32FW

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000426
€3.45

Winbond W25Q32FW

Infineon SLB 9635 TT 12

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000438
€3.97

Infineon SLB 9635 TT 1.2

  • -20%

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LLA

PO000036
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7500 MB003LL/A

SMSC LPC47N250MD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000441
€3.45

SMSC LPC47N250-MD

  • -20%

A1237 EMC 2142 Bios Chip EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTOCTO

PO000037
€18.00 €22.50

A1237 EMC 2142 Bios EFI Firmware 820-2179 MacBook Air Core 2 Duo P7700 BTO/CTO

RENESAS RJK03E1DNS HWSON8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000442
€3.45

RENESAS RJK03E1DNS HWSON-8

  • -20%

A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LLA

PO000038
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9300 MB543LL/A

  • -20%

A1304 EMC 2253 Bios Chip EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LLA

PO000039
€18.00 €22.50

A1304 EMC 2253 Bios EFI Firmware 820-2375 Late 2008 Core 2 Duo SL9400 MB940LL/A

OZ129TN

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000443
€3.45

OZ129TN