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New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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SR215 3205U

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000745
€79.59

SR215 3205U

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QDFX1500MTHNA2

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000755
€35.77

QDFX-1500MT-HN-A2

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SR2Z6 N3450

SR2Z6 N3450

Part Number SR2Z6 N3450 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000757
€41.03

SR2Z6 N3450

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LCRT4 ESR Meter Transistor Tester Diode Triode Capacitance SCR Inductance MOS

Add detection starting voltage;Automatic detection of NPN and PNP transistors, N-channel and P-channel MOSFET, diodes (including double diode), thyristors, transistors, resistors and capacitors and other components, automatic test the pin member and the LCD

It can be detected to determine the emitter voltage of transistor forward bias transistor, MOSFET protection diode and the amplification factor of the base

Measuring the threshold voltage of the gate and the gate capacitance of the MOSFET; 1602 LCD display uses LCD (12864 LCD with backlight)

High speed test valid test components: 2 seconds (except in the large capacitor large capacity measurement also takes a long time, the measured time of one minute is normal)

One button operation, power-on test, get a key.

Power: less than 20 nA

Auto-off function to prevent unnecessary spending, saving battery power, improving battery life.

Resistance: 0.1?-50M

Capacitor: 25 pF-100000uF

Inductance: 0.01mH - 20H

Working power: DV-9V

Standby current: 0.02uA

Operating Current: 25mA

Size: 105mmx87x28.6mm / 4.1 "X3.4" X1.1 "

Color: Blue, transparent, black (random)

Package includes:

1 x LCR-T4 Transistor Tester (no battery)

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

CH002926
€12.31

LCR-T4 ESR Meter Transistor Tester Diode Triode Capacitance SCR Inductance MOS

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N10MGS2SA2 G210M

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000778
€20.18

N10M-GS2-S-A2 G210M

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Apple BIOS MBP13 2015 A1502 8204924 EMC2835

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001950
€32.08

Apple BIOS MBP13 2015 A1502 820-4924 EMC2835

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

wishlist
Compare

SR215 3205U

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000745
€79.59

SR215 3205U

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Compare

QDFX1500MTHNA2

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000755
€35.77

QDFX-1500MT-HN-A2

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SR2Z6 N3450

SR2Z6 N3450

Part Number SR2Z6 N3450 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000757
€41.03

SR2Z6 N3450

wishlist
Compare

LCRT4 ESR Meter Transistor Tester Diode Triode Capacitance SCR Inductance MOS

Add detection starting voltage;Automatic detection of NPN and PNP transistors, N-channel and P-channel MOSFET, diodes (including double diode), thyristors, transistors, resistors and capacitors and other components, automatic test the pin member and the LCD

It can be detected to determine the emitter voltage of transistor forward bias transistor, MOSFET protection diode and the amplification factor of the base

Measuring the threshold voltage of the gate and the gate capacitance of the MOSFET; 1602 LCD display uses LCD (12864 LCD with backlight)

High speed test valid test components: 2 seconds (except in the large capacitor large capacity measurement also takes a long time, the measured time of one minute is normal)

One button operation, power-on test, get a key.

Power: less than 20 nA

Auto-off function to prevent unnecessary spending, saving battery power, improving battery life.

Resistance: 0.1?-50M

Capacitor: 25 pF-100000uF

Inductance: 0.01mH - 20H

Working power: DV-9V

Standby current: 0.02uA

Operating Current: 25mA

Size: 105mmx87x28.6mm / 4.1 "X3.4" X1.1 "

Color: Blue, transparent, black (random)

Package includes:

1 x LCR-T4 Transistor Tester (no battery)

Note: Light shooting and different displays may cause the color of the item in the picture a little different from the real thing. The measurement allowed error is +/- 1-3cm.

CH002926
€12.31

LCR-T4 ESR Meter Transistor Tester Diode Triode Capacitance SCR Inductance MOS

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N10MGS2SA2 G210M

N10M-GS2-S-A2 G210M

Part Number N10M-GS2-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1116

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000778
€20.18

N10M-GS2-S-A2 G210M

wishlist
Compare

Apple BIOS MBP13 2015 A1502 8204924 EMC2835

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001950
€32.08

Apple BIOS MBP13 2015 A1502 820-4924 EMC2835

wishlist
Compare
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