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GM206250A1 GTX950

GM206-250-A1 GTX950

Part Number GM206-250-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000831
€163.77

GM206-250-A1 GTX950

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XELTEK SuperPro 610P Universal Programmer with 16 Adapter plus EDID code

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Technical Specifications

Input/Output built-in 48 pin connector

Package Types DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP

Interface USB 2.0

Software compatible OS Windows XP, Windows Vista, Windows 7, Windows 8 (32/64 bit)

Power Supply Input 90 V-250 V AC, output 12 V DC/1.5 A

Size, L W H 178 130 40 mm

Weight 0.38 kg (without package)

Package Contents

1 * XELTEK SuperPro 610P Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * PLCC44-DIP44 2.54mm (1060mil) Adaptador

1 * PLCC32-DIP32 2.54mm Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 (150mil) Adaptador

1 * SOP16-DIP16 (150mil) Adaptador

1 * Double SOP8-DIP16 (208mil) Adaptador

1 * SOP20-DIP20 (200mil) Adaptador

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH001085
€486.00

XELTEK SuperPro 610P Universal Programmer with 16 Adapter EDID code

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2160707011 HD3470

216-0707011 HD3470

Part Number 216-0707011 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1024

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000835
€17.41

216-0707011 HD3470

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N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

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N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

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XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

GM206250A1 GTX950

GM206-250-A1 GTX950

Part Number GM206-250-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000831
€163.77

GM206-250-A1 GTX950

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XELTEK SuperPro 610P Universal Programmer with 16 Adapter plus EDID code

XELTEK SuperPRO 610P Universal Programmer can use for items list:

Login to Download: Download software

Xeltek SuperPro 610P is a device for programming EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR, NAND), BPROM, NVRAM, SPLD, CPLD, EPLD, FWH, microcontrollers, standard micrologic circuits.

Features

Universal 48-pin driver supports today's most complex devices.

Possibility to connect 99% of the existing microelectronic circuits in case you buy a corresponding adapter.

Programs devices with Vcc as low as 1.2V.

In-system programming (ISP / ICP) capability.

Programming / testing features for TTL/CMOS logic ICs and memories.

Software updates.

RoHS compatible, CE, ISO 9001, ISO 14001 certificates.

Application

Device repair ? re-flashing microchips, microcontrollers.

Flashing new microchips.

Serial manufacturing - microchips, microcontrollers programming.

Restoring data from microchips of solid-state drive.

Technical Specifications

Input/Output built-in 48 pin connector

Package Types DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, BGA, CSP, SCSP

Interface USB 2.0

Software compatible OS Windows XP, Windows Vista, Windows 7, Windows 8 (32/64 bit)

Power Supply Input 90 V-250 V AC, output 12 V DC/1.5 A

Size, L W H 178 130 40 mm

Weight 0.38 kg (without package)

Package Contents

1 * XELTEK SuperPro 610P Programmer

1 * AC Adapter: Input AC 100V- 240V; Output: 12V/1.5A

1 * USB Cable

1 * CD Software

1 * TSOP48 Adapter1 * TSOP48 Adapter

1 * SOP44-DIP44 1.27mm (530mil) Adaptador

1 * PLCC44-DIP44 2.54mm (1060mil) Adaptador

1 * PLCC32-DIP32 2.54mm Adaptador

1 * TSSOP16-DIP16 (170mil) Adaptador

1 * TSSOP28-DIP28 (170mil) Adaptador

1 * SOP28-DIP28 (300mil) Adaptador

1 * SSOP34-DIP34 (220mil) Adaptador

1 * SOP8-DIP8 (150mil) Adaptador

1 * SOP16-DIP16 (150mil) Adaptador

1 * Double SOP8-DIP16 (208mil) Adaptador

1 * SOP20-DIP20 (200mil) Adaptador

1 * SOP8-DIP8 Simple Adaptador

1 * QFN8 WSON8 Simple Adaptador

1 * SOP16/8-DIP8 REV4 Simple Adaptador

1 * MSOP8/SSOP8/SOP8/SOP16-DIP16 Simple Adaptador

1 * SSOP4-28PIN 0.65mm / SOP4-28PIN 1.27mm Simple Adaptador

1 * LCD LED screen EDID code

1 * SOP8 Clamp Test

1 * IC Chip Extractor

CH001085
€486.00

XELTEK SuperPro 610P Universal Programmer with 16 Adapter EDID code

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2160707011 HD3470

216-0707011 HD3470

Part Number 216-0707011 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1024

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000835
€17.41

216-0707011 HD3470

wishlist
Compare

N11MGE1BA3 G210M

N11M-GE1-B-A3 G210M

Part Number N11M-GE1-B-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1216

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000836
€19.69

N11M-GE1-B-A3 G210M

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Compare

N16SGTSA2

N16S-GT-S-A2

Part Number N16S-GT-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000837
€25.93

N16S-GT-S-A2

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N10PGE1 GT130M

N10P-GE1 GT130M

Part Number N10P-GE1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1134

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000843
€25.93

N10P-GE1 GT130M

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G86631A2 8400MGS

G86-631-A2 8400MGS

Part Number G86-631-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000857
€16.08

G86-631-A2 8400MGS

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Compare

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

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