G96-632-C1 9600MGT

Part Number G96-632-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

XELTEK SuperPro 7500 High Speed Stand-Alone Universal Device Programmer:

Login to Download: Download software

Features:

> Until now,Support 310 IC manufacturer, 77083 pcs devices and keeps growing.

> Support devices with Vcc from 1.2V to 5V.

> The programming speed up further increase 30% compared to SUPERPRO 5000.

> The programmer support files up to 256 GBytes

> Built with 144 universal pin-drivers. Universal adaptors are available for varies packages up to 144 pins. New device support will be easier.

> PC hosted mode and stand-alone mode. Under PC hosted mode the programmer is controlled by a PC via USB2.0 (high speed) to program a chip. Under stand-alone mode the programmer is controlled via the 6-KEY keypad and the 20 character by 4 line LCD display. A SD card is used to store the project files.

User can operate multiple units to construct a concurrent multiprogramming system thank for the stand-alone mode.

> Only IC manufacturer approved programming algorithms are used for high reliability. (+5%~-5%) and (10%~-10%) Vcc verification enhances programming reliability.

> Advanced and powerful functions.

Production mode start chip operation at the moment the chip is inserted in the socket properly.

Project function simplifies processes such as device selection, file loading, device configuration setting, program option, and batch file setting into one touch step.

Password can be set for project files and production volume control

Batch command combines device operations like program, verify, security into a single command at any sequence.

Serial numbers generators are available as standard or customer-specific functions.

Log file is useful for quality tracking.

> ver-current and over-voltage protection for safety of the chip and programmer hardware.

> WINDOWS XP/Vista/Win7/Win8/Win10 32/64bit compatibility

Program Speed table

Manufacturer Device 3968MB (P+V) 1984MB (P+V) 1024MB (P+V)

TOSHIBA THGBM6D1KBAIL 221s 98 s 52 s

SANDISK SDIN7DU2-32G 314 s 155 s 56 s

SAMSUNG KLMCG8GE4A 320 s 158 s 58 s

SAMSUNG KLMAG4FEKA 318 s 160 s 62 s

Device Updates:

XELTEK updates software and device algorithm regularly.

View the latestDevice List .

Download the current software version free of charge .

Updates are available by mail at a nominal charge.

XELTEK also adds devices upon customer's request at its option.

Warranty Support:

Programmer is warranted to be free of manufacturing or workmanship defects for one year from the date of purchase.

Online Technical Support is also available 24 hours or you may call us during our business hours through Friday 8:30am to 5:30pm (Beijing Time).

Hardware & Electrical Specifications:

Supported devices: EPROM, Paged EPROM, Parallel and Serial EEPROM, FPGA Configuration PROM, FLASH memory (NOR & NAND)n, BPROM, NVRAM, SPLD, CPLD, EPLD, Firmware HUB, Microcontroller, MCU.

Packages supported: DIP, SDIP, PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, TSOP, SOP, TSOPII, PSOP, TSSOP, SON, EBGA, FBGA, VFBGA, uBGA, CSP, SCSP, ...

PC interface: USB2.0 LAN

Stand-alone Feature: Supported, SD Card .

Electrical spec. of the AC adapter: AC input 90V to 250V, 50/60Hz, DC output 12V/1.5A; power:15W

Mechanical parameter: Main unit: Size: 181*138*90 mm Weight: 1.2Kg.

Packing Box: Size 310*240*140 mm Weight: 1.9 Kg.

Accessories:

Main unit, AC adaptor, USB2.0 cable, software CD (user manual), register card

Optional accessories: ZIF48 Socket, adaptor in varies packages, SD card for stand-alone operation.

Buy Tweezers Set: * VETUS ESD-10 ESD-11 ESD-12 ESD-13 ESD-14 ESD-15 ESD-16

Features:

Made of high quality titanium alloy, strong and stretching, strong corrosion and magnetic resistance, long service life.

Hard, sharp and accurate, picks up 0.02mm flying lines.

Options:

Type: Straight/Bend

Material: Titanium alloy

Length: Approx.14cm/5.51in

Edge: 0.15mm

Net weight: Approx.14g

Package includes:

1pc. Industrial tweezers

AF82801JIB SLB8R

Part Number AF82801JIB SLB8R Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1130

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * User Manual

Features:

Model: Camera with HDMI USB2.0 two output

Image format: jpg

Image resolution: 34 MegaPixel

Video format: MP4(for TF card)

Video recorder: 2K@30FPS, 1080P@60FPS

HDMI Video resolution: 1920*1080 @ 60FPS

USB Video resolution: 1920*1080@30FPS; 1280*720@30FPS; 640*480@30FPS; 320*240@30FPS

White Balance: Auto/Manual

Light: Auto/Manual

Exposure: Auto/Manual, value adjustable

Color: Color

Morror: Left/right,Up/Down

Freeze: Support

OSD: English/Chinese/French/Spanish/Japanese/German

Line: different color,5 horizontal line , 5 vertical line,any positions

Specification:

Image sensor: 34 megapixel CMOS sensor 1/2.33 inch

Effective pixel: 34 megapixel

Pixel size:1.335m 1.335m

Frame rate:60fps

Definition:FULL HD

Housing:metal

Lens:C/CS

Video format: MOV

Digital Zoom:Support

Brightness control:Auto/manual

Color:R/G/B adjustable

Film and record:Support

Cross cursor:Support multi-color, size adjustable

Transverse and vertical line:

Support multi-color, 5 pcs of transverse lines/vertical lines, moveable

Different color,5 horizontal line , 5 vertical line,any positions

TF card interface:Max 64G

HDMI interface:Standard HDMI output (Type A)

USB interface:Standard usb2.0 interface (Type B)

Input Voltage: DC 12V

180X C-MOUNT Lens:

Working distance: 95mm

Zoom c-mount Lens

0.5X C-mount adapter

Zoom ratios: 6.5:1

Objective Magnification Power by 0.7 - 4.5X(about 10 - 180X on the display)

Size: 180mm(L) * 50mm(DIA)

60 LED Ring Light:

Provides intense and focused shadow-free illumination

60 bright white LED bulbs

Lighting direction changeable

Variable intensity control

Intense and focused shadow-free illumination

100,000 hours of life

Power input: 100-240V, 50-60HZ, auto switching

Inside diameter of the ring light: 1.0" (27mm)

Overall outside diameter: 1.77" (45mm)

Working Distance: 27mm-45mm

Package including:

1 x 34MP Microscope Camera

1 x 180X C-mount lens

1 x 60 LED light

1 x Power supply

1 x USB line

1 x HDMI line

1 x Software DISC

1 x Remote Control

1 x Big Boom Stand. Size:375*245*25mm

SR1EB i7-4510U

Part Number SR1EB i7-4510U Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1330

Package/Case 440 PCS Description Original new

SR1EB i7-4510U CL8064701477301 Intel Core i7 Mobile CPU BGA1168 2.0 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OTS-16-03 Programmer Adapter SOP8-DIP8 Socket (150mil)

SR215 3205U

Part Number SR215 3205U Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1440

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CPU FAN for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Description Brand new

Product Description

Product Type: CPU Fan for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Power connection:4 Pins

Package: One piece CPU Fan (3-PIN)for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

Compatible Models & Part Numbers

for Dell Latitude E5430 BATA0613R5H DC28000AFVL 82JH0 4PIN

SOP44 to DIP48 Programmer Converter Adapter Socket SOP44-1.27-TP01NT for TL866CS TL866A TL866II

Part Number SOP44-1.27-TP01NT Manufacturer XinGong TECH

Type SOP44 to DIP48 Date Code 16+

Package/Case 1 PCS Adapters Description Original new

QDFX-1500MT-HN-A2

Part Number QDFX-1500MT-HN-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Limit frame specification: 10.5*13mm