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RICHTEK RT8202MZQW JJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000472
€3.45

RICHTEK RT8202MZQW JJ=

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FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

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Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega256016AU Board For Arduino TFG

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

CH000598
€12.00

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino TFG

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TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

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BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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Teensy 20 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502+Cable

Features:

USB can be any type of device.

AVR processor, 16 MHz.

Single pushbutton programming.

Easy to use Teensy Loader application.

Free software development tools.

Works with Mac OS X, Linux & Windows.

Tiny size, perfect for many projects.

Available with pins for solderless breadboard.

Specifications:

Chip model AT90USB1286, the ARV the SCM software developers learn the best experimental board, Bootloader program is installed, you can download the application directly by an ordinary USB interface code, very helpful for beginners SCM.

Usage: Can be directly downloaded from the Internet Flip_Installer-3.4.1 software installation, use comes with usb drive, erase, programming, and checksum. Do not need to buy another burner Pleiades expensive.

Package includes:

1set x Teensy ++ 2.0 USB AVR development board

CH000617
€35.81

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

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Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

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VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

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ITE IT8512F EXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000482
€3.45

ITE IT8512F (EXS)

RICHTEK RT8202MZQW JJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000472
€3.45

RICHTEK RT8202MZQW JJ=

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Compare

FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

wishlist
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Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega256016AU Board For Arduino TFG

Mega 2560 R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

Description:

Manufactured By Good supplier

Microcontroller: ATmega2560.Operating Voltage 5V.Input Voltage (recommended) 7-12V.

Input Voltage (limits) 6-20V.Digital I/O Pins 54 (of which 14 provide PWM output).

Analog Input Pins 16.DC Current per I/O Pin 40 mA.

DC Current for 3.3V Pin 50 mA.Flash Memory 256 KB of which 8 KB used by bootloader.SRAM 8 KB.

EEPROM 4 KB.Clock Speed 16 MHz.

Package included:

1xWireless R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino

CH000598
€12.00

Arduino R3 Mega2560 R3 MEGA2560 REV3 ATmega2560-16AU Board For Arduino TFG

wishlist
Compare

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

wishlist
Compare

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

wishlist
Compare

Teensy 20 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502+Cable

Features:

USB can be any type of device.

AVR processor, 16 MHz.

Single pushbutton programming.

Easy to use Teensy Loader application.

Free software development tools.

Works with Mac OS X, Linux & Windows.

Tiny size, perfect for many projects.

Available with pins for solderless breadboard.

Specifications:

Chip model AT90USB1286, the ARV the SCM software developers learn the best experimental board, Bootloader program is installed, you can download the application directly by an ordinary USB interface code, very helpful for beginners SCM.

Usage: Can be directly downloaded from the Internet Flip_Installer-3.4.1 software installation, use comes with usb drive, erase, programming, and checksum. Do not need to buy another burner Pleiades expensive.

Package includes:

1set x Teensy ++ 2.0 USB AVR development board

CH000617
€35.81

Teensy++ 2.0 USB Keyboard Mouse AVR Arduino Board AT90USB1286 U Disk TE502 POP

wishlist
Compare

Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

wishlist
Compare

VT1311MF

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000481
€3.45

VT1311MF

wishlist
Compare

ITE IT8512F EXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000482
€3.45

ITE IT8512F (EXS)

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