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FAIRCHILD FAN7311

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001920
€3.45

FAIRCHILD FAN7311

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GM206251A1 GXT950

GM206-251-A1 GXT950

Part Number GM206-251-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1612

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001921
€172.31

GM206-251-A1 GXT950

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Maxim MAX8743EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001922
€3.45

Maxim MAX8743EEI

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N2820 SR1SG Stencil Template

N2820 SR1SG Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001924
€6.22

N2820 SR1SG Stencil Template

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HC06 Wireless Bluetooth Arduino PI JYMCU Serial RF 5V Transeiver Module

Features:

100% brand new and high quality HC-06 bluetooth RF transceiver module

With VCC, GND, TXD, RXD foot for the bluetooth.

With LED indicator light.

3.3V LDO baseboard.

Input voltage 3.3-6V, the input voltage more than 7V is prohibited.

Unpaired current is about 30mA, matched current is about 10mA.

Interface level 3.3 V, can be connected directly to a variety of single chip microcomputer (51, AVR, PIC, ARM, MSP430, etc.)

5V microcontroller can also be connected directly, without MAX232 nor through MAX232.

Open to effective distance of 10 meters, over 10 meters is also possible, but not of this the quality of the connection of the distance do to ensure

The pair later when full-duplex serial use, do not need to know anything about the Bluetooth protocol, but only supports 8 data bits, 1 stop bit, no parity communication format, which is the most commonly used communication format does not support other formats.

Support to establish a Bluetooth connection through AT commands set the baud rate, passkey, set parameters are saved after.

Specifications:

Size: Approx. 43mm x 15mm

Input voltage: 3.6-6V

Working current: matching for 30 mA, matching the communication for 10 mA

Output Power Class: Class 2

Package Includes:

1 piece HC-06 bluetooth RF transceiver module

CH001925
€7.46

HC-06 Wireless Bluetooth Arduino PI JY-MCU Serial RF 5V Transeiver Module

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AMDCPU 05MM Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001926
€5.40

AMD-CPU 0.5MM Stencil Template

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New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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GF9300J1B2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001928
€5.40

GF-9300J-1-B2 Stencil Template

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G84400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001929
€5.40

G84-400-A2 Stencil Template

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GK104425A2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001930
€17.14

GK104-425-A2 Stencil Template 90*90

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UPI uP7711U8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001931
€3.45

UPI uP7711U8

FAIRCHILD FAN7311

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001920
€3.45

FAIRCHILD FAN7311

wishlist
Compare

GM206251A1 GXT950

GM206-251-A1 GXT950

Part Number GM206-251-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1612

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001921
€172.31

GM206-251-A1 GXT950

wishlist
Compare

Maxim MAX8743EEI

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001922
€3.45

Maxim MAX8743EEI

wishlist
Compare

N2820 SR1SG Stencil Template

N2820 SR1SG Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001924
€6.22

N2820 SR1SG Stencil Template

wishlist
Compare

HC06 Wireless Bluetooth Arduino PI JYMCU Serial RF 5V Transeiver Module

Features:

100% brand new and high quality HC-06 bluetooth RF transceiver module

With VCC, GND, TXD, RXD foot for the bluetooth.

With LED indicator light.

3.3V LDO baseboard.

Input voltage 3.3-6V, the input voltage more than 7V is prohibited.

Unpaired current is about 30mA, matched current is about 10mA.

Interface level 3.3 V, can be connected directly to a variety of single chip microcomputer (51, AVR, PIC, ARM, MSP430, etc.)

5V microcontroller can also be connected directly, without MAX232 nor through MAX232.

Open to effective distance of 10 meters, over 10 meters is also possible, but not of this the quality of the connection of the distance do to ensure

The pair later when full-duplex serial use, do not need to know anything about the Bluetooth protocol, but only supports 8 data bits, 1 stop bit, no parity communication format, which is the most commonly used communication format does not support other formats.

Support to establish a Bluetooth connection through AT commands set the baud rate, passkey, set parameters are saved after.

Specifications:

Size: Approx. 43mm x 15mm

Input voltage: 3.6-6V

Working current: matching for 30 mA, matching the communication for 10 mA

Output Power Class: Class 2

Package Includes:

1 piece HC-06 bluetooth RF transceiver module

CH001925
€7.46

HC-06 Wireless Bluetooth Arduino PI JY-MCU Serial RF 5V Transeiver Module

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Compare

AMDCPU 05MM Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001926
€5.40

AMD-CPU 0.5MM Stencil Template

wishlist
Compare

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

Description:

Attach bottom case to top case

Whats Included:

Two (2) P5 pentalobe screws - 8.9mm in length, 0.4mm thread pitch

Eight (8) P5 pentalobe screws - 2.6mm in length, 0.4mm thread pitch

Compatibility:

MacBook Air 13 A1369

MacBookAir3,2 Late 2010: MC503LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC504LL/A (1.86 GHz Core 2 Duo)

MacBookAir3,2 Late 2010: MC905LL/A (2.13 GHz Core 2 Duo)

MacBookAir4,2 Mid 2011: MC965LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MC966LL/A (1.7 GHz Core i5)

MacBookAir4,2 Mid 2011: MD226LL/A (1.8 GHz Core i7)

MacBook Air 13 A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Early 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Early 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

CH001927
€3.73

New Bottom Screw 10pcs Macbook Air 13 A1369 1370 A1465 A1466

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Compare

GF9300J1B2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001928
€5.40

GF-9300J-1-B2 Stencil Template

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Compare

G84400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001929
€5.40

G84-400-A2 Stencil Template

wishlist
Compare

GK104425A2 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001930
€17.14

GK104-425-A2 Stencil Template 90*90

wishlist
Compare

UPI uP7711U8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001931
€3.45

UPI uP7711U8

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