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RICHTEK RT8209MGQW A5

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001969
€3.45

RICHTEK RT8209MGQW A5=

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QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP6405REV2 TypeU adapter socket

Model:

QFP64/LQFP64/TQFP64-0.5 (compatible with XWDZ-QFP64-0.5/FPQ-64-0.5-06)

Product use:

Programming block and test stand, burning and testing the IC chip of QFP64.

Suitable for packaging:

QFP64 LQFP64 TQFP64 CQFP64 pin Pitch 0.5mm

Characteristic:

The bottom pin is fully led out by the chip, which is convenient for the two development.

Overall size of the seat:

Long 57mm, wide 50mm

Common: STM32 QFP64 encapsulation

STM32L1xxR series (e.g. STM32L151R8, STM32L152RB)

STM32F0xxR series (e.g. STM32F051RC, STM32F051RB)

STM32F1xxR series (e.g. STM32F103RC, STM32F100RB)

STM32F2xxR series (e.g. STM32F207RC, STM32F215RB)

STM32F3xxR series (e.g. STM32F303R8, STM32F373RB)

STM32F4xxR series (e.g. STM32F407RC, STM32F415RB)

CH001970
€28.00

QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2 Type-U adapter socket

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RICHTEK RT8068AZQW 13 FD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001971
€3.45

RICHTEK RT8068AZQW (13 FD)

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1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

Adapt to

Winbond:

W25Q10EW, W25Q20EW, W25Q20BW, W25Q40EW, W25Q40BW, W25Q80EW, W25Q80BW, W25Q16DW, W25Q16FW, W25Q32DW, W25Q32FW, W25Q64DW, W25Q64FW, W25F128FW...

MXIC:

MX25U5121E,MX25R512F,MX25U1001E,MX25R1035F,MX25U2033E,MX25R2035F,MX25U4035,

MX25U4033E,MX25U4032E,MX25R4035F,MX25U8035,MX25U8035E,MX25U8033E,MX25U8032E,

MX25R8035F,MX25U1635E,MX25V1635F,MX25U1635F,MX25R1635F,MX25U3235E,MX25U3235F,

MX25R3235F,MX25U6473F,MX25U6435F,MX25R6435F,MX25U12873F,MX25U12835F,

MX25U25635F,MX25U51245G,MX25UM51245G,MX66U51235F...

CH000087
€4.96

1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

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2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

wishlist
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MICROCHIP 24LC65

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001975
€3.45

MICROCHIP 24LC65

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GL82H170 SR2C8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001976
€17.14

GL82H170 SR2C8 Stencil Template 90*90

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i74720HQ SR1Q8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001977
€17.81

i7-4720HQ SR1Q8 Stencil Template 90*90

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RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

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i56267U SR2JK Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001980
€17.14

i5-6267U SR2JK Stencil Template 90*90

RICHTEK RT8209MGQW A5

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001969
€3.45

RICHTEK RT8209MGQW A5=

wishlist
Compare

QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP6405REV2 TypeU adapter socket

Model:

QFP64/LQFP64/TQFP64-0.5 (compatible with XWDZ-QFP64-0.5/FPQ-64-0.5-06)

Product use:

Programming block and test stand, burning and testing the IC chip of QFP64.

Suitable for packaging:

QFP64 LQFP64 TQFP64 CQFP64 pin Pitch 0.5mm

Characteristic:

The bottom pin is fully led out by the chip, which is convenient for the two development.

Overall size of the seat:

Long 57mm, wide 50mm

Common: STM32 QFP64 encapsulation

STM32L1xxR series (e.g. STM32L151R8, STM32L152RB)

STM32F0xxR series (e.g. STM32F051RC, STM32F051RB)

STM32F1xxR series (e.g. STM32F103RC, STM32F100RB)

STM32F2xxR series (e.g. STM32F207RC, STM32F215RB)

STM32F3xxR series (e.g. STM32F303R8, STM32F373RB)

STM32F4xxR series (e.g. STM32F407RC, STM32F415RB)

CH001970
€28.00

QFP64 to DIP64 CHIP PROGRAMMER SOCKET QFP64-0.5-REV2 Type-U adapter socket

wishlist
Compare

RICHTEK RT8068AZQW 13 FD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001971
€3.45

RICHTEK RT8068AZQW (13 FD)

wishlist
Compare

1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

Adapt to

Winbond:

W25Q10EW, W25Q20EW, W25Q20BW, W25Q40EW, W25Q40BW, W25Q80EW, W25Q80BW, W25Q16DW, W25Q16FW, W25Q32DW, W25Q32FW, W25Q64DW, W25Q64FW, W25F128FW...

MXIC:

MX25U5121E,MX25R512F,MX25U1001E,MX25R1035F,MX25U2033E,MX25R2035F,MX25U4035,

MX25U4033E,MX25U4032E,MX25R4035F,MX25U8035,MX25U8035E,MX25U8033E,MX25U8032E,

MX25R8035F,MX25U1635E,MX25V1635F,MX25U1635F,MX25R1635F,MX25U3235E,MX25U3235F,

MX25R3235F,MX25U6473F,MX25U6435F,MX25R6435F,MX25U12873F,MX25U12835F,

MX25U25635F,MX25U51245G,MX25UM51245G,MX66U51235F...

CH000087
€4.96

1.8V Conversion Block 25 series low voltage chip adapter Apple LCD Tablet PC BIOS

wishlist
Compare

2160728014 HD4500

216-0728014 HD4500

Part Number 216-0728014 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 400 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001973
€36.22

216-0728014 HD4500

wishlist
Compare

MICROCHIP 24LC65

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001975
€3.45

MICROCHIP 24LC65

wishlist
Compare

GL82H170 SR2C8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001976
€17.14

GL82H170 SR2C8 Stencil Template 90*90

wishlist
Compare

i74720HQ SR1Q8 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001977
€17.81

i7-4720HQ SR1Q8 Stencil Template 90*90

wishlist
Compare

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

In package included: 

1pcs x socket RT-BGA100-01 V2.5

1pcs x Frame 14x18

 

Technical information:

1. Life span: ≥30,000 times

2. Material: PEI & PES

3. Temperature: -55°C~+170°C

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:
  
 If you are not from Europe, please inquire about customs tax, VAT of your country.
 We send products in Russia only via registered POST (12-20 days).
 Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.
 
 Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.
 Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH001979
€89.00

RT-BGA100-01 POS NAND MCP Adapter For RT809H Programmer

wishlist
Compare

i56267U SR2JK Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001980
€17.14

i5-6267U SR2JK Stencil Template 90*90

wishlist
Compare
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