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2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Early 2014 Core i7 I74650U MF068LLA

PO000063
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Early 2014 Core i7 I7-4650U MF068LL/A

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2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

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N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

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A1465 EMC 2924 Bios Chip EFI Firmware 820-00164 Early 2015 Core i7 I75650U BTOCTO

PO000065
€18.00 €22.50

A1465 EMC 2924 Bios EFI Firmware 820-00164 Early 2015 Core i7 I7-5650U BTO/CTO

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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i5 I55250U MJVE2LLA

PO000066
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i5 I5-5250U MJVE2LL/A

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N3150 SR2A8 Stencil Template

N3150 SR2A8 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000514
€6.22

N3150 SR2A8 Stencil Template

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N11PLP2A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000519
€5.40

N11P-LP2-A3 Stencil Template

  • -20%
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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i7 I75650U BTOCTO

PO000067
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i7 I7-5650U BTO/CTO

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i35010U SR23Z Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000520
€9.97

i3-5010U SR23Z Stencil Template 90*90

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A1466 EMC 3178 Bios Chip EFI Firmware 820-00165 13inch 2017 Core i5 I55350U MQD32LLA

PO000068
€18.00 €22.50

A1466 EMC 3178 Bios EFI Firmware 820-00165 13-inch, 2017 Core i5 I5-5350U MQD32LL/A

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i54200H SR15G Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000523
€9.52

i5-4200H SR15G Stencil Template 90*90

2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

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  • -20%

A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Early 2014 Core i7 I74650U MF068LLA

PO000063
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Early 2014 Core i7 I7-4650U MF068LL/A

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2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

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Compare

N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

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  • -20%

A1465 EMC 2924 Bios Chip EFI Firmware 820-00164 Early 2015 Core i7 I75650U BTOCTO

PO000065
€18.00 €22.50

A1465 EMC 2924 Bios EFI Firmware 820-00164 Early 2015 Core i7 I7-5650U BTO/CTO

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  • -20%

A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i5 I55250U MJVE2LLA

PO000066
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i5 I5-5250U MJVE2LL/A

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N3150 SR2A8 Stencil Template

N3150 SR2A8 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000514
€6.22

N3150 SR2A8 Stencil Template

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Compare

N11PLP2A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000519
€5.40

N11P-LP2-A3 Stencil Template

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  • -20%

A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i7 I75650U BTOCTO

PO000067
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i7 I7-5650U BTO/CTO

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i35010U SR23Z Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000520
€9.97

i3-5010U SR23Z Stencil Template 90*90

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Compare
  • -20%

A1466 EMC 3178 Bios Chip EFI Firmware 820-00165 13inch 2017 Core i5 I55350U MQD32LLA

PO000068
€18.00 €22.50

A1466 EMC 3178 Bios EFI Firmware 820-00165 13-inch, 2017 Core i5 I5-5350U MQD32LL/A

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i54200H SR15G Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000523
€9.52

i5-4200H SR15G Stencil Template 90*90

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