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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
  • Categories: Laptop Parts, Repair tool
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M5Y71 SR23Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
€7.46

M-5Y71 SR23Q Stencil Template

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H99261 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
€14.92

H99261 Stencil Template 90*90

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DC Power Jack Part PJ057

Toshiba Portege M900 Signature Series DC Power Jack Connector: M900, M900-xxxx, M900-D3212, M900-D335T, M900-D336T, M900-D337T, M900-S3314, M900-S3315, M900-S337, PSU9FL-007006, PSU9RL-002002, PSU9RL-003002

Toshiba Satellite M500 M500D Series DC Power Jack Connector: M500, M500-STxxxx, M500-ST54E2, M500-ST54X1, M500D, M500D-xxxxx, PSMKCA-009007, PSMLY-14HD2CSV

Toshiba Satellite M505 M505D Series DC Power Jack Connector: M505, M505-xxxx, M505-S1401, M505-S4020, M505-S4022, M505-S4940, M505-S4945, M505-S4947, M505-S4972, M505-S4975, M505-S4980, M505-S4982, M505-S4985, M505-S4990, M505-S4991, M505D, M505D-xxxxx, M505D-S70, M505D-S80, M505D-S4000, M505D-S4930, M505D-S4970, PSMLYU-00D002

Toshiba Satellite U500 U500D Series DC Power Jack Connector: U500, U500-xxxx, U500-1DZ, U500-11C, U500-11D, U500-11E, U500-11F, U500-11G, U500-12C, U500-12D, U500-12E, U500-12G, U500-12J, U500-17D, U500-17E, U500-17F, U500-17T, U500-17V, U500-17X, U500-18E, U500-18F, U500-18K, U500-18J, U500-18L, U500-18N, U500-18T, U500-18Q, U500-18U, U500-18V, U500-1DV, U500-1F0, U500-1G0, U500-1G8, U500-20K, U500D, U500D-xxxx

Toshiba Satellite U505 U505D Series DC Power Jack Connector: U505, U505-xxxxx, U505-16, U505-S2002, U505-S2005, U505-S2006, U505-S2008, U505-S2010, U505-S2012, U505-S2930, U505-S2940, U505-S2950xx, U505-S2960, U505-S2970, U505-S2975, U505D, U505D-xxxxx

Toshiba Satellite P205 Series DC Power Jack Connector: P205-S6237, P205-S6247, P205-S6257, P205-S6267, P205-S6277, P205-S6287, P205-S6297, P205-S6298, P205-S6307, P205-S6337, P205-S6347, P205-S6348, P205-S7469, P205-S7476, P205D-S7429, P205D-S7438, P205D-S7439, P205D-S7454, P205D-S7479

Note: This is the Jack only and does not include the harness. You will need to reuse your harness.

CH001945
€7.21

DC Power Jack, Part #PJ057

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MCP79MXTB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
€5.40

MCP79MXT-B3 Stencil Template

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i7620M Q4CB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000425
€5.40

i7-620M Q4CB Stencil Template

M5Y71 SR23Q Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000417
€7.46

M-5Y71 SR23Q Stencil Template

wishlist
Compare

H99261 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000418
€14.92

H99261 Stencil Template 90*90

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Compare

DC Power Jack Part PJ057

Toshiba Portege M900 Signature Series DC Power Jack Connector: M900, M900-xxxx, M900-D3212, M900-D335T, M900-D336T, M900-D337T, M900-S3314, M900-S3315, M900-S337, PSU9FL-007006, PSU9RL-002002, PSU9RL-003002

Toshiba Satellite M500 M500D Series DC Power Jack Connector: M500, M500-STxxxx, M500-ST54E2, M500-ST54X1, M500D, M500D-xxxxx, PSMKCA-009007, PSMLY-14HD2CSV

Toshiba Satellite M505 M505D Series DC Power Jack Connector: M505, M505-xxxx, M505-S1401, M505-S4020, M505-S4022, M505-S4940, M505-S4945, M505-S4947, M505-S4972, M505-S4975, M505-S4980, M505-S4982, M505-S4985, M505-S4990, M505-S4991, M505D, M505D-xxxxx, M505D-S70, M505D-S80, M505D-S4000, M505D-S4930, M505D-S4970, PSMLYU-00D002

Toshiba Satellite U500 U500D Series DC Power Jack Connector: U500, U500-xxxx, U500-1DZ, U500-11C, U500-11D, U500-11E, U500-11F, U500-11G, U500-12C, U500-12D, U500-12E, U500-12G, U500-12J, U500-17D, U500-17E, U500-17F, U500-17T, U500-17V, U500-17X, U500-18E, U500-18F, U500-18K, U500-18J, U500-18L, U500-18N, U500-18T, U500-18Q, U500-18U, U500-18V, U500-1DV, U500-1F0, U500-1G0, U500-1G8, U500-20K, U500D, U500D-xxxx

Toshiba Satellite U505 U505D Series DC Power Jack Connector: U505, U505-xxxxx, U505-16, U505-S2002, U505-S2005, U505-S2006, U505-S2008, U505-S2010, U505-S2012, U505-S2930, U505-S2940, U505-S2950xx, U505-S2960, U505-S2970, U505-S2975, U505D, U505D-xxxxx

Toshiba Satellite P205 Series DC Power Jack Connector: P205-S6237, P205-S6247, P205-S6257, P205-S6267, P205-S6277, P205-S6287, P205-S6297, P205-S6298, P205-S6307, P205-S6337, P205-S6347, P205-S6348, P205-S7469, P205-S7476, P205D-S7429, P205D-S7438, P205D-S7439, P205D-S7454, P205D-S7479

Note: This is the Jack only and does not include the harness. You will need to reuse your harness.

CH001945
€7.21

DC Power Jack, Part #PJ057

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MCP79MXTB3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000421
€5.40

MCP79MXT-B3 Stencil Template

wishlist
Compare

i7620M Q4CB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000425
€5.40

i7-620M Q4CB Stencil Template

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