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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: EFI Rom Cable
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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i7 I74650U BTOCTO

PO000057
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i7 I7-4650U BTO/CTO

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GFGO7600SENB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000471
€5.40

GF-GO7600-SE-N-B1 Stencil Template

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i5 I54250U MD760LLA

PO000058
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i5 I5-4250U MD760LL/A

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i74720HQ SR1Q8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000483
€8.70

i7-4720HQ SR1Q8 Stencil Template

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N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i7 I74650U BTOCTO

PO000059
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i7 I7-4650U BTO/CTO

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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i5 I54260U MD711LLB

PO000060
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i5 I5-4260U MD711LL/B

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i7 I74650U MF067LLA

PO000061
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i7 I7-4650U MF067LL/A

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GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Early 2014 Core i7 I74650U MF068LLA

PO000063
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Early 2014 Core i7 I7-4650U MF068LL/A

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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i7 I74650U BTOCTO

PO000057
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i7 I7-4650U BTO/CTO

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GFGO7600SENB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000471
€5.40

GF-GO7600-SE-N-B1 Stencil Template

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i5 I54250U MD760LLA

PO000058
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i5 I5-4250U MD760LL/A

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i74720HQ SR1Q8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000483
€8.70

i7-4720HQ SR1Q8 Stencil Template

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Compare

N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

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Compare
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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Mid2013 Core i7 I74650U BTOCTO

PO000059
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Mid-2013 Core i7 I7-4650U BTO/CTO

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Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i5 I54260U MD711LLB

PO000060
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i5 I5-4260U MD711LL/B

wishlist
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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

wishlist
Compare

GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

wishlist
Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i7 I74650U MF067LLA

PO000061
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i7 I7-4650U MF067LL/A

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Compare

GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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Compare
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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Early 2014 Core i7 I74650U MF068LLA

PO000063
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Early 2014 Core i7 I7-4650U MF068LL/A

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