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  • Categories: BGA Reballing Kits, Stencils
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i32377M SR0CW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000466
€5.40

i3-2377M SR0CW Stencil Template

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i73820QM SR0MK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000469
€5.40

i7-3820QM SR0MK Stencil Template

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GFGO7600SENB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000471
€5.40

GF-GO7600-SE-N-B1 Stencil Template

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i74720HQ SR1Q8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000483
€8.70

i7-4720HQ SR1Q8 Stencil Template

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DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

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N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

i32377M SR0CW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000466
€5.40

i3-2377M SR0CW Stencil Template

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i73820QM SR0MK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000469
€5.40

i7-3820QM SR0MK Stencil Template

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GFGO7600SENB1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000471
€5.40

GF-GO7600-SE-N-B1 Stencil Template

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DC Power Jack Part PJ054

IBM ThinkPad DC Power Jack Connector: T40, T41, T42, T43, R50, R51, R52

Note: This is the Jack only and does not include the harness. You will need to reuse your harness.

CH002380
€6.96

DC Power Jack, Part #PJ054

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i74720HQ SR1Q8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000483
€8.70

i7-4720HQ SR1Q8 Stencil Template

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DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

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N4100 SR3S0 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000487
€14.92

N4100 SR3S0 Stencil Template 90*90

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

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