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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i7 I74650U MF067LLA

PO000061
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i7 I7-4650U MF067LL/A

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G92751B1

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001048
€37.74

G92-751-B1

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AM5000IBJ44HM A45000

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001067
€35.84

AM5000IBJ44HM A4-5000

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Early 2014 Core i7 I74650U MF068LLA

PO000063
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Early 2014 Core i7 I7-4650U MF068LL/A

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BD82HM65 SLJ4P

BD82HM65 SLJ4P

Part Number BD82HM65 SLJ4P Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1145

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001081
€45.95

BD82HM65 SLJ4P

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N16EGXXA1

N16E-GXX-A1

Part Number N16E-GXX-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001111
€196.92

N16E-GXX-A1

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A1465 EMC 2924 Bios Chip EFI Firmware 820-00164 Early 2015 Core i7 I75650U BTOCTO

PO000065
€18.00 €22.50

A1465 EMC 2924 Bios EFI Firmware 820-00164 Early 2015 Core i7 I7-5650U BTO/CTO

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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i5 I55250U MJVE2LLA

PO000066
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i5 I5-5250U MJVE2LL/A

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GFGO7400TBNA3

GF-GO7400T-B-N-A3

Part Number GF-GO7400T-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1211

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001116
€29.54

GF-GO7400T-B-N-A3

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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i7 I75650U BTOCTO

PO000067
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i7 I7-5650U BTO/CTO

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N16EGXA1 GTX980M

N16E-GX-A1 GTX980M

Part Number N16E-GX-A1 (GM204-700-A1) Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001132
€160.82

N16E-GX-A1 GTX980M

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N12EGSA1 GTX560M

N12E-GS-A1 GTX560M

Part Number N12E-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001145
€54.15

N12E-GS-A1 GTX560M

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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Early 2014 Core i7 I74650U MF067LLA

PO000061
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Early 2014 Core i7 I7-4650U MF067LL/A

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G92751B1

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001048
€37.74

G92-751-B1

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AM5000IBJ44HM A45000

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001067
€35.84

AM5000IBJ44HM A4-5000

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A1466 EMC 2632 Bios Chip EFI Firmware 820-3437 Early 2014 Core i7 I74650U MF068LLA

PO000063
€18.00 €22.50

A1466 EMC 2632 Bios EFI Firmware 820-3437 Early 2014 Core i7 I7-4650U MF068LL/A

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BD82HM65 SLJ4P

BD82HM65 SLJ4P

Part Number BD82HM65 SLJ4P Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1145

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001081
€45.95

BD82HM65 SLJ4P

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N16EGXXA1

N16E-GXX-A1

Part Number N16E-GXX-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001111
€196.92

N16E-GXX-A1

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A1465 EMC 2924 Bios Chip EFI Firmware 820-00164 Early 2015 Core i7 I75650U BTOCTO

PO000065
€18.00 €22.50

A1465 EMC 2924 Bios EFI Firmware 820-00164 Early 2015 Core i7 I7-5650U BTO/CTO

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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i5 I55250U MJVE2LLA

PO000066
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i5 I5-5250U MJVE2LL/A

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GFGO7400TBNA3

GF-GO7400T-B-N-A3

Part Number GF-GO7400T-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1211

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001116
€29.54

GF-GO7400T-B-N-A3

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A1466 EMC 2925 Bios Chip EFI Firmware 820-00165 Early 2015 Core i7 I75650U BTOCTO

PO000067
€18.00 €22.50

A1466 EMC 2925 Bios EFI Firmware 820-00165 Early 2015 Core i7 I7-5650U BTO/CTO

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N16EGXA1 GTX980M

N16E-GX-A1 GTX980M

Part Number N16E-GX-A1 (GM204-700-A1) Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001132
€160.82

N16E-GX-A1 GTX980M

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N12EGSA1 GTX560M

N12E-GS-A1 GTX560M

Part Number N12E-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001145
€54.15

N12E-GS-A1 GTX560M

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