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  • Categories: Bios Chip Programming
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IT8519GCXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000447
€3.45

IT8519G-CXS

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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

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TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

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A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

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RICHTEK RT8202MZQW JJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000472
€3.45

RICHTEK RT8202MZQW JJ=

  • -20%
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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

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FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

  • -20%
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A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

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TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

  • -20%
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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

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BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

  • -20%
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A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

IT8519GCXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000447
€3.45

IT8519G-CXS

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  • -20%

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9400 MC233LLA

PO000040
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9400 MC233LL/A

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TI TPS51220A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000460
€3.45

TI TPS51220A

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  • -20%

A1304 EMC 2334 Bios Chip EFI Firmware 820-2375 Mid2009 Core 2 Duo SL9600 MC234LLA

PO000041
€18.00 €22.50

A1304 EMC 2334 Bios EFI Firmware 820-2375 Mid-2009 Core 2 Duo SL9600 MC234LL/A

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RICHTEK RT8202MZQW JJ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000472
€3.45

RICHTEK RT8202MZQW JJ=

wishlist
Compare
  • -20%

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LLA

PO000042
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9400 MC505LL/A

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Compare

FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

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Compare
  • -20%

A1370 EMC 2393 Bios Chip EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LLA

PO000043
€18.00 €22.50

A1370 EMC 2393 Bios EFI Firmware 820-2796 Late 2010 Core 2 Duo SU9600 MC906LL/A

wishlist
Compare

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

wishlist
Compare
  • -20%

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LLA

PO000044
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9400 MC503LL/A

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Compare

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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Compare
  • -20%

A1369 EMC 2392 Bios Chip EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LLA

PO000045
€18.00 €22.50

A1369 EMC 2392 Bios EFI Firmware 820-2838 Late 2010 Core 2 Duo SL9600 MC905LL/A

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Compare
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