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  • Categories: Programmer & Sockets

N17EG1A1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
€349.80

N17E-G1-A1 GTX1060

KESS V2 OBD2 V5017 EU Version SW V253

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

CH001316
€94.48

KESS V2 OBD2 V5.017 EU Version SW V2.53

G86731A2 8400MGS

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001042
€54.97

G86-731-A2 8400MGS

G92751B1

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001048
€37.74

G92-751-B1

AM5000IBJ44HM A45000

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001067
€35.84

AM5000IBJ44HM A4-5000

BD82HM65 SLJ4P

BD82HM65 SLJ4P

Part Number BD82HM65 SLJ4P Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1145

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001081
€45.95

BD82HM65 SLJ4P

N16EGXXA1

N16E-GXX-A1

Part Number N16E-GXX-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001111
€196.92

N16E-GXX-A1

N17EG1A1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
€349.80

N17E-G1-A1 GTX1060

KESS V2 OBD2 V5017 EU Version SW V253

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

CH001316
€94.48

KESS V2 OBD2 V5.017 EU Version SW V2.53

G86731A2 8400MGS

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001042
€54.97

G86-731-A2 8400MGS

G92751B1

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001048
€37.74

G92-751-B1

AM5000IBJ44HM A45000

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001067
€35.84

AM5000IBJ44HM A4-5000

BD82HM65 SLJ4P

BD82HM65 SLJ4P

Part Number BD82HM65 SLJ4P Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1145

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001081
€45.95

BD82HM65 SLJ4P

N16EGXXA1

N16E-GXX-A1

Part Number N16E-GXX-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001111
€196.92

N16E-GXX-A1