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  • Categories: Bios Chip Programming
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TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

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Hantek 6022BL USB Oscilloscope 20MHz 48MSas 16 Channels Logic Analyzer

Hantek6022BL

Login to Download: * User Manual Buy Probe Accessories

20MHz Bandwidth; 48MSa/s Sample Rate; 16 Channels Logic Analyzer; Excellent industrial design-the same anodised aluminium casing as iPad, which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface, and has good heat resistance and strong wearability. Standard USBXI (TM) interface, easyly inserts into USBXI (TM) housing to make up a combination instrument.

Features

Excellent industrial design-the same anodised aluminium casing as iPad, which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface, and has good heat resistance and strong wearability.

Standard USBXITM interface, easily inserts into USBXITM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance, be used easily on business.

Dimensions (mm):205(L) x120(W) x35(H), be carried easily.

High performance, 48MS/s real-time sampling, 20MHz bandwidth.

16Channels Logic Analyzer, 10MHz Bandwidth;

Operating System: Windows8, Windows 7, Windows NT, Windows 2000, Windows XP, VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity, invert, addition, subtraction, multiplication, division, X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

Labview\VB\VC Second Design instance.

Parameters

Model Hantek6022BL

Oscilloscope Features

Bandwidth 20MHz

Channel 2(Digital)+16(Logic)

Sample Rate 48MSa/s

Memory Depth 1M

Rise Time 17.5ns

Time Base Precision 50ppm

Time Base Range 4ns/div-1h/div (Step by1-2-4)

Input Impendence 1MO 25pF

Input Sensitivity 20mV/div~5V/div

Vertical Resolution 8Bit

Vertical Position Range 20mV ~ 5V/div @ x1 probe; 200mV ~ 50V/div @ x10 probe;

2V ~ 500V/div @ x100 probe; 20V ~ 5KV/div @ x1000 probe

DC Accuracy 3%

Bandwidth Limited 20MHz

Trigger Type Edge, Alternative

Trigger Source CH1, CH2

Math +,-,x,,FFT, Invert

Cursor Measurement Cross, Trace, Horizontal, Vertical

Auto Measurement Vpp, Vamp, Vmax, Vmin, Vtop, Vmid, Vbase, Vavg, Vrms, Vcrms, Preshoot, Overshoot, Frequency, Period, Rise Time, Fall Time, Positive Width, Negative Width, Duty Cycle

Logic Analyzer Features

Logical channel 16

Max. Impendance 1MO(C=7.5pF)

Max. Voltage 0V~5.5V

Max. Sample 48M

Bandwidth 10MHz

Compatible Input TTL, LVTTL, CMOS

Memory Depth 1M/CH

General Features

Power USB Port

Demensions 200mm x100mm x 35mm

Weight 0.3KG

Standard Probe 2 x PP80

Package will include

1 x Hantek 6022BL

1 x USB cord

2 x Clip Probes

1 x User Manual

CH002320
€75.71

Hantek 6022BL USB Oscilloscope 20MHz 48MSa/s 16 Channels Logic Analyzer

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

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NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

  • -20%
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A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

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apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

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TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

  • -20%
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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

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ITE IT8512E NXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000389
€3.45

ITE IT8512E NXS

TI TPS51125A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000381
€3.45

TI TPS51125A

wishlist
Compare

Hantek 6022BL USB Oscilloscope 20MHz 48MSas 16 Channels Logic Analyzer

Hantek6022BL

Login to Download: * User Manual Buy Probe Accessories

20MHz Bandwidth; 48MSa/s Sample Rate; 16 Channels Logic Analyzer; Excellent industrial design-the same anodised aluminium casing as iPad, which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface, and has good heat resistance and strong wearability. Standard USBXI (TM) interface, easyly inserts into USBXI (TM) housing to make up a combination instrument.

Features

Excellent industrial design-the same anodised aluminium casing as iPad, which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface, and has good heat resistance and strong wearability.

Standard USBXITM interface, easily inserts into USBXITM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance, be used easily on business.

Dimensions (mm):205(L) x120(W) x35(H), be carried easily.

High performance, 48MS/s real-time sampling, 20MHz bandwidth.

16Channels Logic Analyzer, 10MHz Bandwidth;

Operating System: Windows8, Windows 7, Windows NT, Windows 2000, Windows XP, VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity, invert, addition, subtraction, multiplication, division, X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

Labview\VB\VC Second Design instance.

Parameters

Model Hantek6022BL

Oscilloscope Features

Bandwidth 20MHz

Channel 2(Digital)+16(Logic)

Sample Rate 48MSa/s

Memory Depth 1M

Rise Time 17.5ns

Time Base Precision 50ppm

Time Base Range 4ns/div-1h/div (Step by1-2-4)

Input Impendence 1MO 25pF

Input Sensitivity 20mV/div~5V/div

Vertical Resolution 8Bit

Vertical Position Range 20mV ~ 5V/div @ x1 probe; 200mV ~ 50V/div @ x10 probe;

2V ~ 500V/div @ x100 probe; 20V ~ 5KV/div @ x1000 probe

DC Accuracy 3%

Bandwidth Limited 20MHz

Trigger Type Edge, Alternative

Trigger Source CH1, CH2

Math +,-,x,,FFT, Invert

Cursor Measurement Cross, Trace, Horizontal, Vertical

Auto Measurement Vpp, Vamp, Vmax, Vmin, Vtop, Vmid, Vbase, Vavg, Vrms, Vcrms, Preshoot, Overshoot, Frequency, Period, Rise Time, Fall Time, Positive Width, Negative Width, Duty Cycle

Logic Analyzer Features

Logical channel 16

Max. Impendance 1MO(C=7.5pF)

Max. Voltage 0V~5.5V

Max. Sample 48M

Bandwidth 10MHz

Compatible Input TTL, LVTTL, CMOS

Memory Depth 1M/CH

General Features

Power USB Port

Demensions 200mm x100mm x 35mm

Weight 0.3KG

Standard Probe 2 x PP80

Package will include

1 x Hantek 6022BL

1 x USB cord

2 x Clip Probes

1 x User Manual

CH002320
€75.71

Hantek 6022BL USB Oscilloscope 20MHz 48MSa/s 16 Channels Logic Analyzer

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  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73615QM MD389LLA

PO000021
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3615QM MD389LL/A

wishlist
Compare

NEC 2R5102

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000385
€3.45

NEC 2R5102

wishlist
Compare
  • -20%

A1347 EMC 2570 Bios Chip EFI Firmware 820-3228 Late 2012 Core i7 I73720QM BTOCTO

PO000022
€18.00 €22.50

A1347 EMC 2570 Bios EFI Firmware 820-3228 Late 2012 Core i7 I7-3720QM BTO/CTO

wishlist
Compare

apple 338S1077

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000386
€7.94

apple 338S1077

wishlist
Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54260U MGEM2LLA

PO000023
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4260U MGEM2LL/A

wishlist
Compare

TI BQ2084

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000388
€3.45

TI BQ2084

wishlist
Compare
  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i5 I54278U MGEN2LLA

PO000024
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i5 I5-4278U MGEN2LL/A

wishlist
Compare

ITE IT8512E NXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000389
€3.45

ITE IT8512E NXS

wishlist
Compare
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