Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0729051 HD4670

Part Number 216-0729051 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Hantek6022BL

Login to Download: * User Manual Buy Probe Accessories

20MHz Bandwidth; 48MSa/s Sample Rate; 16 Channels Logic Analyzer; Excellent industrial design-the same anodised aluminium casing as iPad, which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface, and has good heat resistance and strong wearability. Standard USBXI (TM) interface, easyly inserts into USBXI (TM) housing to make up a combination instrument.

Features

Excellent industrial design-the same anodised aluminium casing as iPad, which is not only beautiful and tasteful but also greatly enhanced the hardness of aluminum alloy surface, and has good heat resistance and strong wearability.

Standard USBXITM interface, easily inserts into USBXITM housing to make up a combination instrument.

USB2.0 interface, no external power source required, easy to use.

Be suitable for notebook computer, product line maintenance, be used easily on business.

Dimensions (mm):205(L) x120(W) x35(H), be carried easily.

High performance, 48MS/s real-time sampling, 20MHz bandwidth.

16Channels Logic Analyzer, 10MHz Bandwidth;

Operating System: Windows8, Windows 7, Windows NT, Windows 2000, Windows XP, VISTA.

23 measurement functions, PASS/FAIL Check, be suitable for technical application.

Waveform average, persistence, intensity, invert, addition, subtraction, multiplication, division, X-Y plot.

Save waveform in the following: text file, jpg/bmp graphic file, MS excel/word file.

FFT

One computer can connect many DSO, extend channel easily.

Labview\VB\VC Second Design instance.

Parameters

Model Hantek6022BL

Oscilloscope Features

Bandwidth 20MHz

Channel 2(Digital)+16(Logic)

Sample Rate 48MSa/s

Memory Depth 1M

Rise Time 17.5ns

Time Base Precision 50ppm

Time Base Range 4ns/div-1h/div (Step by1-2-4)

Input Impendence 1MO 25pF

Input Sensitivity 20mV/div~5V/div

Vertical Resolution 8Bit

Vertical Position Range 20mV ~ 5V/div @ x1 probe; 200mV ~ 50V/div @ x10 probe;

2V ~ 500V/div @ x100 probe; 20V ~ 5KV/div @ x1000 probe

DC Accuracy 3%

Bandwidth Limited 20MHz

Trigger Type Edge, Alternative

Trigger Source CH1, CH2

Math +,-,x,,FFT, Invert

Cursor Measurement Cross, Trace, Horizontal, Vertical

Auto Measurement Vpp, Vamp, Vmax, Vmin, Vtop, Vmid, Vbase, Vavg, Vrms, Vcrms, Preshoot, Overshoot, Frequency, Period, Rise Time, Fall Time, Positive Width, Negative Width, Duty Cycle

Logic Analyzer Features

Logical channel 16

Max. Impendance 1MO(C=7.5pF)

Max. Voltage 0V~5.5V

Max. Sample 48M

Bandwidth 10MHz

Compatible Input TTL, LVTTL, CMOS

Memory Depth 1M/CH

General Features

Power USB Port

Demensions 200mm x100mm x 35mm

Weight 0.3KG

Standard Probe 2 x PP80

Package will include

1 x Hantek 6022BL

1 x USB cord

2 x Clip Probes

1 x User Manual

G94-650-A1 9600MGS

Part Number G94-650-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0910

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * User Manual Download

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

G96-632-C1 9600MGT

Part Number G96-632-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: * Software & User Manual

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

AF82801JIB SLB8R

Part Number AF82801JIB SLB8R Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1130

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock