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ITE IT8502E NXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000521
€3.45

ITE IT8502E (NXA)

Intersil ISL6258A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000524
€3.45

Intersil ISL6258A

KESS V2 OBD2 V5017 EU Version SW V253

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

CH001316
€94.48

KESS V2 OBD2 V5.017 EU Version SW V2.53

VIA VN800

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000526
€10.33

VIA VN800

Realtek ALC3223

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000527
€3.45

Realtek ALC3223

Intersil ISL62881HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000528
€3.45

Intersil ISL62881HRTZ

ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000532
€3.45

ITE IT8572E (AXS)

ITE IT8502E NXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000521
€3.45

ITE IT8502E (NXA)

Intersil ISL6258A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000524
€3.45

Intersil ISL6258A

KESS V2 OBD2 V5017 EU Version SW V253

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

CH001316
€94.48

KESS V2 OBD2 V5.017 EU Version SW V2.53

VIA VN800

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000526
€10.33

VIA VN800

Realtek ALC3223

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000527
€3.45

Realtek ALC3223

Intersil ISL62881HRTZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000528
€3.45

Intersil ISL62881HRTZ

ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000532
€3.45

ITE IT8572E (AXS)