• Show Sidebar

There are 5244 products.

Active filters

wishlist
Compare
Quickview

ATMEL AT26DF081ASU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002066
€3.45

ATMEL AT26DF081A-SU

wishlist
Compare
Quickview

PGA 370 FCPGA to CPU Adapter Card

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002067
€11.06

PGA 370 FC-PGA to CPU Adapter Card

wishlist
Compare
Quickview

PS3 HDMI Port Socket Connector Replacement Part for Sony Playstation 4

Compatibility:

HDMI Port Connector Socket For Sony PlayStation 3 PS3 Slim CECH-2001A, Serie 20XX.

Description:

* New.

* (As shows in the picture).

* Replace your damaged or defective HDMI Port Connector Socket For Sony PlayStation 3 PS3 Slim CECH-2001A 20XX.

Other:

* Professional installation recommended.

* Bulk packaging.

* Tools & Hinge NOT included.

* Instructions NOT included.

Package Includes:

* 01 x HDMI Port Connector Socket For Sony PlayStation 3 PS3 Slim CECH-2001A 20XX.

CH002068
€3.61

PS3 HDMI Port Socket Connector Replacement Part for Sony Playstation 4

wishlist
Compare
Quickview

USB HD Support web camera 1080P video microphone resolution BUILTIN

Description:

This USB HD webcam is designed with 12.0M pixels, can provide 1080P video resolution.

The camera angle can be adjusted up and down in 30 degree.

Auto focus design, plug-and-play, easy and convenient to use.

USB 2.0 design, fast data transmission.The webcam is fit for video meeting, video chart, etc..

Compartible with most computer operation system, you don't need to manual install any drivers.

Specification:

Material: ABS.

Color: Show as picture.

Image Sensor: CMOS

Lens: Glass Lens

Pixel: 12.0M Pixels

Resolution: 1920x1080.

Frame Rate: 30fps.

Interface: USB 2.0.

Size: 8x3x11cm.

Note

There might be a bit color distortions due to different computer resolutions.

There might be a slight errors due to different hand measurement.

Package included:

1x Webcam.

1x USB manual.

CH002069
€12.31

USB HD Support web camera 1080P video microphone resolution BUILT-IN

wishlist
Compare
Quickview

SR1SF N2920

SR1SF N2920

Part Number SR1SF N2920 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SF N2920 FH8065301616203 Intel Pentium CPU BGA1170 1.86 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002070
€57.93

SR1SF N2920

wishlist
Compare
Quickview

i56200U SR2EY Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002071
€17.14

i5-6200U SR2EY Stencil Template 90*90

wishlist
Compare
Quickview

SR1SG N2820

SR1SG N2820

Part Number SR1SG N2820 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SG N2820 FH8065301616603 Intel Pentium CPU BGA1170 2.13 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002072
€45.95

SR1SG N2820

wishlist
Compare
Quickview

Realtek ALC259

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002073
€3.45

Realtek ALC259

wishlist
Compare
Quickview

Intersil ISL6262

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002074
€3.45

Intersil ISL6262

wishlist
Compare
Quickview

2160772000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002075
€5.40

216-0772000 Stencil Template

wishlist
Compare
Quickview

Intersil ISL6567CRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002077
€3.45

Intersil ISL6567CRZ

ATMEL AT26DF081ASU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002066
€3.45

ATMEL AT26DF081A-SU

wishlist
Compare

PGA 370 FCPGA to CPU Adapter Card

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002067
€11.06

PGA 370 FC-PGA to CPU Adapter Card

wishlist
Compare

PS3 HDMI Port Socket Connector Replacement Part for Sony Playstation 4

Compatibility:

HDMI Port Connector Socket For Sony PlayStation 3 PS3 Slim CECH-2001A, Serie 20XX.

Description:

* New.

* (As shows in the picture).

* Replace your damaged or defective HDMI Port Connector Socket For Sony PlayStation 3 PS3 Slim CECH-2001A 20XX.

Other:

* Professional installation recommended.

* Bulk packaging.

* Tools & Hinge NOT included.

* Instructions NOT included.

Package Includes:

* 01 x HDMI Port Connector Socket For Sony PlayStation 3 PS3 Slim CECH-2001A 20XX.

CH002068
€3.61

PS3 HDMI Port Socket Connector Replacement Part for Sony Playstation 4

wishlist
Compare

USB HD Support web camera 1080P video microphone resolution BUILTIN

Description:

This USB HD webcam is designed with 12.0M pixels, can provide 1080P video resolution.

The camera angle can be adjusted up and down in 30 degree.

Auto focus design, plug-and-play, easy and convenient to use.

USB 2.0 design, fast data transmission.The webcam is fit for video meeting, video chart, etc..

Compartible with most computer operation system, you don't need to manual install any drivers.

Specification:

Material: ABS.

Color: Show as picture.

Image Sensor: CMOS

Lens: Glass Lens

Pixel: 12.0M Pixels

Resolution: 1920x1080.

Frame Rate: 30fps.

Interface: USB 2.0.

Size: 8x3x11cm.

Note

There might be a bit color distortions due to different computer resolutions.

There might be a slight errors due to different hand measurement.

Package included:

1x Webcam.

1x USB manual.

CH002069
€12.31

USB HD Support web camera 1080P video microphone resolution BUILT-IN

wishlist
Compare

SR1SF N2920

SR1SF N2920

Part Number SR1SF N2920 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SF N2920 FH8065301616203 Intel Pentium CPU BGA1170 1.86 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002070
€57.93

SR1SF N2920

wishlist
Compare

i56200U SR2EY Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002071
€17.14

i5-6200U SR2EY Stencil Template 90*90

wishlist
Compare

SR1SG N2820

SR1SG N2820

Part Number SR1SG N2820 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1342

Package/Case 240 PCS Description Original new

SR1SG N2820 FH8065301616603 Intel Pentium CPU BGA1170 2.13 GHz Cores2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002072
€45.95

SR1SG N2820

wishlist
Compare

Realtek ALC259

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002073
€3.45

Realtek ALC259

wishlist
Compare

Intersil ISL6262

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002074
€3.45

Intersil ISL6262

wishlist
Compare

2160772000 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002075
€5.40

216-0772000 Stencil Template

wishlist
Compare

Intersil ISL6567CRZ

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002077
€3.45

Intersil ISL6567CRZ

wishlist
Compare
Back to top