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  • Categories: BGA Reballing Kits, Stencils
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A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

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N16EGXXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000450
€9.97

N16E-GXX-A1 Stencil Template 90*90

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A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

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SR3MD Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000453
€9.97

SR3MD Stencil Template 90*90

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GP106300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000454
€7.46

GP106-300-A1 Stencil Template

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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BD82H77 SLJ88 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000455
€5.40

BD82H77 SLJ88 Stencil Template

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AM963PAEY44AB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000457
€4.35

AM963PAEY44AB Stencil Template

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

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i53337U SR0XL Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000461
€9.97

i5-3337U SR0XL Stencil Template 90*90

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i5 I52467M MC968LLA

PO000046
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i5 I5-2467M MC968LL/A

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N16EGXXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000450
€9.97

N16E-GXX-A1 Stencil Template 90*90

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Compare
  • -20%

A1370 EMC 2471 Bios Chip EFI Firmware 820-3024 Mid2011 Core i7 I72677M MD214LLA

PO000047
€18.00 €22.50

A1370 EMC 2471 Bios EFI Firmware 820-3024 Mid-2011 Core i7 I7-2677M MD214LL/A

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SR3MD Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000453
€9.97

SR3MD Stencil Template 90*90

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GP106300A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000454
€7.46

GP106-300-A1 Stencil Template

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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Compare

BD82H77 SLJ88 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000455
€5.40

BD82H77 SLJ88 Stencil Template

wishlist
Compare

AM963PAEY44AB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000457
€4.35

AM963PAEY44AB Stencil Template

wishlist
Compare
  • -20%

A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

wishlist
Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

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Compare

i53337U SR0XL Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000461
€9.97

i5-3337U SR0XL Stencil Template 90*90

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Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

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Compare
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