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G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

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A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

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iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

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i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

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A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

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A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y51 MF865LLA

PO000028
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y51 MF865LL/A

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G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

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eMMC BGA153 BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

eMMC153/169 test socket USB Reader IC size 11.5x13mm nand flash test

Login to Download: Download software Data Recovery Tutorial

Limit frame specification: 11.5*13mm

Buy Limit Frame: * 12*16mm, 12*18mm, 14*18mm

Description:

BGA169/BGA153 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 11.5x13mm

It is designed for test, debug, validation, data recovery and programming of eMMC.

It provides a compact test solution for eMMC used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC devices.

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

Feature:

1) This eMMC socket is for BGA 169 and BGA 153 testing.

2) The main control chip is ITE IT1327, which is a USB 2.0 with multi partition of SD/MMC card reader controller, T1327 built-in SD/MMC card power supply. It also integrates 5v to 3.3v voltage regulator, high speed USB 2.0 interface and downward compatible with USB 1.1.

3) Support hot swap and a separate power supply switch.

4) Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

5) eMMC data could be read and written fastly.

6) With 30 pins and pin pictch 0.5mm.

7) eMMC size of this product is 11.5x13mm , we also provide size 12x16mm ,12x18mm , 14x18mm , please see more products in our store .

Apply to eMMC thickness of 0.8mm and 1.5mm.

Just insert the USB into your PC, it is easy use.

Accurate positioning on flat bottom pad and solder of eMMC.

Life cycle is around 25,000 times.

CH000981
€82.00

eMMC BGA153/BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

G86603A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000369
€5.40

G86-603-A2 Stencil Template

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  • -20%

A1347 EMC 2840 Bios Chip EFI Firmware 820-5509 Late 2014 Core i7 I74578U BTOCTO

PO000026
€18.00 €22.50

A1347 EMC 2840 Bios EFI Firmware 820-5509 Late 2014 Core i7 I7-4578U BTO/CTO

wishlist
Compare

iphone8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000372
€5.72

iphone8 Stencil Template

wishlist
Compare

i54200U SR170 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000387
€5.47

i5-4200U SR170 Stencil Template

wishlist
Compare
  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y31 MF855LLA

PO000027
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y31 MF855LL/A

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  • -20%

A1534 EMC 2746 Bios Chip EFI Firmware 820-00045 Early 2015 Core M M5Y51 MF865LLA

PO000028
€18.00 €22.50

A1534 EMC 2746 Bios EFI Firmware 820-00045 Early 2015 Core M M-5Y51 MF865LL/A

wishlist
Compare

G86751A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000393
€5.40

G86-751-A2 Stencil Template

wishlist
Compare

eMMC BGA153 BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

eMMC153/169 test socket USB Reader IC size 11.5x13mm nand flash test

Login to Download: Download software Data Recovery Tutorial

Limit frame specification: 11.5*13mm

Buy Limit Frame: * 12*16mm, 12*18mm, 14*18mm

Description:

BGA169/BGA153 programming adatapter is an easy use tool to connect chip and PC. Just like a U disk!

Includes size limiter: 11.5x13mm

It is designed for test, debug, validation, data recovery and programming of eMMC.

It provides a compact test solution for eMMC used in applications such as mobile, data recorder, the Internet of things, etc.

1) Test, debug, validation, and programming of eMMC devices.

2) Failure analysis / System and wafer test.

3) Package and Chip qualification.

4) Production prototype / Data recovery.

Feature:

1) This eMMC socket is for BGA 169 and BGA 153 testing.

2) The main control chip is ITE IT1327, which is a USB 2.0 with multi partition of SD/MMC card reader controller, T1327 built-in SD/MMC card power supply. It also integrates 5v to 3.3v voltage regulator, high speed USB 2.0 interface and downward compatible with USB 1.1.

3) Support hot swap and a separate power supply switch.

4) Apply to eMMC of Samsung, Sandisk, Toshiba, Hynix, Micron, HTC, MTK and Intel.

5) eMMC data could be read and written fastly.

6) With 30 pins and pin pictch 0.5mm.

7) eMMC size of this product is 11.5x13mm , we also provide size 12x16mm ,12x18mm , 14x18mm , please see more products in our store .

Apply to eMMC thickness of 0.8mm and 1.5mm.

Just insert the USB into your PC, it is easy use.

Accurate positioning on flat bottom pad and solder of eMMC.

Life cycle is around 25,000 times.

CH000981
€82.00

eMMC BGA153/BGA169 test socket USB Reader IC size 11.5x13mm NAND Flash Test

wishlist
Compare
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