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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

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2160707009 HD3470

216-0707009 HD3470

Part Number 216-0707009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1025

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000979
€29.57

216-0707009 HD3470

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

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2160732026

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1143

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000985
€43.53

216-0732026

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MCP67MDA2

MCP67MD-A2

Part Number MCP67MD-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0733

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000989
€66.46

MCP67MD-A2

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

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A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i7 I73667U MD846LLA

PO000055
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i7 I7-3667U MD846LL/A

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G92270A2

G92-270-A2

Part Number G92-270-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001005
€49.03

G92-270-A2

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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i5 I54250U MD711LLA

PO000056
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i5 I5-4250U MD711LL/A

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2150674034 RX781

215-0674034 RX781

Part Number 215-0674034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1407

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001015
€39.18

215-0674034 RX781

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A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i7 I74650U BTOCTO

PO000057
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i7 I7-4650U BTO/CTO

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A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i5 I53317U MD223LLA

PO000051
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i5 I5-3317U MD223LL/A

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  • -20%

A1465 EMC 2558 Bios Chip EFI Firmware 820-3208 Mid2012 Core i7 I73667U MD845LLA

PO000052
€18.00 €22.50

A1465 EMC 2558 Bios EFI Firmware 820-3208 Mid-2012 Core i7 I7-3667U MD845LL/A

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2160707009 HD3470

216-0707009 HD3470

Part Number 216-0707009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1025

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000979
€29.57

216-0707009 HD3470

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Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53317U MD628LLA

PO000053
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3317U MD628LL/A

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2160732026

216-0732026

Part Number 216-0732026 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1143

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000985
€43.53

216-0732026

wishlist
Compare

MCP67MDA2

MCP67MD-A2

Part Number MCP67MD-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0733

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000989
€66.46

MCP67MD-A2

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  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i5 I53427U MD231LLA

PO000054
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i5 I5-3427U MD231LL/A

wishlist
Compare
  • -20%

A1466 EMC 2559 Bios Chip EFI Firmware 820-3209 Mid2012 Core i7 I73667U MD846LLA

PO000055
€18.00 €22.50

A1466 EMC 2559 Bios EFI Firmware 820-3209 Mid-2012 Core i7 I7-3667U MD846LL/A

wishlist
Compare

G92270A2

G92-270-A2

Part Number G92-270-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001005
€49.03

G92-270-A2

wishlist
Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i5 I54250U MD711LLA

PO000056
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i5 I5-4250U MD711LL/A

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Compare

2150674034 RX781

215-0674034 RX781

Part Number 215-0674034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1407

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001015
€39.18

215-0674034 RX781

wishlist
Compare
  • -20%

A1465 EMC 2631 Bios Chip EFI Firmware 820-3435 Mid2013 Core i7 I74650U BTOCTO

PO000057
€18.00 €22.50

A1465 EMC 2631 Bios EFI Firmware 820-3435 Mid-2013 Core i7 I7-4650U BTO/CTO

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Compare
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