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  • Categories: Bios Chip Programming
  • Categories: Other BGA Chips & ICs
  • Categories: Pin Holder
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A1466 EMC 3178 Bios Chip EFI Firmware 820-00165 13inch 2017 Core i5 I55350U MQD32LLA

PO000068
€18.00 €22.50

A1466 EMC 3178 Bios EFI Firmware 820-00165 13-inch, 2017 Core i5 I5-5350U MQD32LL/A

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RICHTEK RT8167B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000538
€3.45

RICHTEK RT8167B

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Diodes APL3510BXI TRG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000542
€3.45

Diodes APL3510BXI TRG

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Realtek RTL8100CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000546
€3.45

Realtek RTL8100CL

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A1278 EMC 2326 Bios Chip EFI Firmware 820-2530 Mid2009 13 Core 2 Duo P7550 MB990LLA

PO000070
€18.00 €22.50

A1278 EMC 2326 Bios EFI Firmware 820-2530 Mid-2009 13 Core 2 Duo P7550 MB990LL/A

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ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000547
€3.45

ITE IT8572E AXS

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A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8600 MC374LLA

PO000072
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8600 MC374LL/A

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88E1145BBM MARVELL

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000549
€10.33

88E1145-BBM MARVELL

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Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

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A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8800 MC375LLA

PO000073
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8800 MC375LL/A

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A1278 EMC 2419 Bios Chip EFI Firmware 820-2936 Early 2011 13 Core i5 I52415M MC700LLA

PO000074
€18.00 €22.50

A1278 EMC 2419 Bios EFI Firmware 820-2936 Early 2011 13 Core i5 I5-2415M MC700LL/A

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PEF20571FV31

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000559
€31.77

PEF20571FV3.1

  • -20%

A1466 EMC 3178 Bios Chip EFI Firmware 820-00165 13inch 2017 Core i5 I55350U MQD32LLA

PO000068
€18.00 €22.50

A1466 EMC 3178 Bios EFI Firmware 820-00165 13-inch, 2017 Core i5 I5-5350U MQD32LL/A

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RICHTEK RT8167B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000538
€3.45

RICHTEK RT8167B

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Diodes APL3510BXI TRG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000542
€3.45

Diodes APL3510BXI TRG

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Compare

Realtek RTL8100CL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000546
€3.45

Realtek RTL8100CL

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Compare
  • -20%

A1278 EMC 2326 Bios Chip EFI Firmware 820-2530 Mid2009 13 Core 2 Duo P7550 MB990LLA

PO000070
€18.00 €22.50

A1278 EMC 2326 Bios EFI Firmware 820-2530 Mid-2009 13 Core 2 Duo P7550 MB990LL/A

wishlist
Compare

ITE IT8572E AXS

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000547
€3.45

ITE IT8572E AXS

wishlist
Compare
  • -20%

A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8600 MC374LLA

PO000072
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8600 MC374LL/A

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88E1145BBM MARVELL

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000549
€10.33

88E1145-BBM MARVELL

wishlist
Compare

Realtek RTD2045L

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000558
€3.45

Realtek RTD2045L

wishlist
Compare
  • -20%

A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8800 MC375LLA

PO000073
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8800 MC375LL/A

wishlist
Compare
  • -20%

A1278 EMC 2419 Bios Chip EFI Firmware 820-2936 Early 2011 13 Core i5 I52415M MC700LLA

PO000074
€18.00 €22.50

A1278 EMC 2419 Bios EFI Firmware 820-2936 Early 2011 13 Core i5 I5-2415M MC700LL/A

wishlist
Compare

PEF20571FV31

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000559
€31.77

PEF20571FV3.1

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