• Show Sidebar

There are 761 products.

Active filters

  • Categories: CPU and Graphic Chips
  • Categories: Car Service Equipment
  • Categories: DC Jacks, Connector
  • Categories: EFI Rom Cable
wishlist
Compare
Quickview

215CDABKA15FG

215CDABKA15FG

Part Number AC82GL40 SLGGM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1139

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001025
€16.54

215CDABKA15FG

wishlist
Compare
Quickview

DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

wishlist
Compare
Quickview

N17EG1A1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
€349.80

N17E-G1-A1 GTX1060

wishlist
Compare
Quickview

G86731A2 8400MGS

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001042
€54.97

G86-731-A2 8400MGS

wishlist
Compare
Quickview

G92751B1

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001048
€37.74

G92-751-B1

wishlist
Compare
Quickview

AM5000IBJ44HM A45000

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001067
€35.84

AM5000IBJ44HM A4-5000

wishlist
Compare
Quickview

DC Power Jack Part PJ085

Alienware M14x Series DC Power Jack Connector: M14x

Alienware M17x Series DC Power Jack Connector: M17x R1, M17x R2

Alienware M18x Series DC Power Jack Connector: M18x

Dell Precision Mobile WorkStation M4700 DC Power Jack Connector: M4700

Dell Precision Mobile WorkStation M6400 DC Power Jack Connector: M6400

Dell Precision Mobile WorkStation M6500 DC Power Jack Connector: M6500

Dell Precision Mobile WorkStation M6600 DC Power Jack Connector: M6600

Dell Precision Mobile WorkStation M6700 DC Power Jack Connector: M6700

CH002412
€7.27

DC Power Jack, Part #PJ085

wishlist
Compare
Quickview

BD82HM65 SLJ4P

BD82HM65 SLJ4P

Part Number BD82HM65 SLJ4P Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1145

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001081
€45.95

BD82HM65 SLJ4P

DC Power Jack Part PJ054

IBM ThinkPad DC Power Jack Connector: T40, T41, T42, T43, R50, R51, R52

Note: This is the Jack only and does not include the harness. You will need to reuse your harness.

CH002380
€6.96

DC Power Jack, Part #PJ054

wishlist
Compare

215CDABKA15FG

215CDABKA15FG

Part Number AC82GL40 SLGGM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1139

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001025
€16.54

215CDABKA15FG

wishlist
Compare

DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

wishlist
Compare

N17EG1A1 GTX1060

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001036
€349.80

N17E-G1-A1 GTX1060

wishlist
Compare

G86731A2 8400MGS

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001042
€54.97

G86-731-A2 8400MGS

wishlist
Compare

G92751B1

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001048
€37.74

G92-751-B1

wishlist
Compare

AM5000IBJ44HM A45000

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001067
€35.84

AM5000IBJ44HM A4-5000

wishlist
Compare

DC Power Jack Part PJ085

Alienware M14x Series DC Power Jack Connector: M14x

Alienware M17x Series DC Power Jack Connector: M17x R1, M17x R2

Alienware M18x Series DC Power Jack Connector: M18x

Dell Precision Mobile WorkStation M4700 DC Power Jack Connector: M4700

Dell Precision Mobile WorkStation M6400 DC Power Jack Connector: M6400

Dell Precision Mobile WorkStation M6500 DC Power Jack Connector: M6500

Dell Precision Mobile WorkStation M6600 DC Power Jack Connector: M6600

Dell Precision Mobile WorkStation M6700 DC Power Jack Connector: M6700

CH002412
€7.27

DC Power Jack, Part #PJ085

wishlist
Compare

BD82HM65 SLJ4P

BD82HM65 SLJ4P

Part Number BD82HM65 SLJ4P Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1145

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001081
€45.95

BD82HM65 SLJ4P

wishlist
Compare
Back to top