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  • Categories: CPU and Graphic Chips
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  • Categories: Pin Holder

GFGO7400TBNA3

GF-GO7400T-B-N-A3

Part Number GF-GO7400T-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1211

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001116
€29.54

GF-GO7400T-B-N-A3

TVPCVGAHDMIUSB Keypad LVDS Cable V29V56V59 RR850303C Universal TV Controller Driver Board

Description:

- Universal LCD TV driver board, TV board

- VGA interface: can be connected to a computer

- HDMI HD interface: can play 1080P

- AV interface: can be connected to the set-top box

- Audio input: can be connected to a computer

- Audio output: can be connected to headphones, audio

- USB interface: play pictures, MP3, video, text

- TV interface: can connect to cable TV

CH003878
€22.25

TV/PC/VGA/HDMI/USB Keypad LVDS Cable V29V56V59 RR8503-03C Universal TV Controller Driver Board

N16EGXA1 GTX980M

N16E-GX-A1 GTX980M

Part Number N16E-GX-A1 (GM204-700-A1) Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001132
€160.82

N16E-GX-A1 GTX980M

N12EGSA1 GTX560M

N12E-GS-A1 GTX560M

Part Number N12E-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001145
€54.15

N12E-GS-A1 GTX560M

2160749001 HD5470

216-0749001 HD5470

Part Number 216-0749001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001152
€16.54

216-0749001 HD5470

2180755042 HD6650

218-0755042 HD6650

Part Number 218-0755034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001194
€20.90

218-0755042 HD6650

BD82H55 SLGZX

BD82H55 SLGZX

Part Number BD82H55 SLGZX Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001196
€24.62

BD82H55 SLGZX

GFGO7400TBNA3

GF-GO7400T-B-N-A3

Part Number GF-GO7400T-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1211

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001116
€29.54

GF-GO7400T-B-N-A3

TVPCVGAHDMIUSB Keypad LVDS Cable V29V56V59 RR850303C Universal TV Controller Driver Board

Description:

- Universal LCD TV driver board, TV board

- VGA interface: can be connected to a computer

- HDMI HD interface: can play 1080P

- AV interface: can be connected to the set-top box

- Audio input: can be connected to a computer

- Audio output: can be connected to headphones, audio

- USB interface: play pictures, MP3, video, text

- TV interface: can connect to cable TV

CH003878
€22.25

TV/PC/VGA/HDMI/USB Keypad LVDS Cable V29V56V59 RR8503-03C Universal TV Controller Driver Board

N16EGXA1 GTX980M

N16E-GX-A1 GTX980M

Part Number N16E-GX-A1 (GM204-700-A1) Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001132
€160.82

N16E-GX-A1 GTX980M

N12EGSA1 GTX560M

N12E-GS-A1 GTX560M

Part Number N12E-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001145
€54.15

N12E-GS-A1 GTX560M

2160749001 HD5470

216-0749001 HD5470

Part Number 216-0749001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001152
€16.54

216-0749001 HD5470

2180755042 HD6650

218-0755042 HD6650

Part Number 218-0755034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001194
€20.90

218-0755042 HD6650

BD82H55 SLGZX

BD82H55 SLGZX

Part Number BD82H55 SLGZX Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001196
€24.62

BD82H55 SLGZX