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GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

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2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

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N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

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N3150 SR2A8 Stencil Template

N3150 SR2A8 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000514
€6.22

N3150 SR2A8 Stencil Template

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Freescale BDM USBDM 81632 bit 3in1 smart car driver

Freescale USBDM 8/16/32 bit 3 in 1 Emulator

Login to Download: Download software

Features:

1. SupportFull range of HCS08 , HCS12 (X) full range , Coldfire V1 full range, Can be downloaded online , single-step debugging , simulation, observe all registers and global variables values

2. Support the development environment :

CodeWarrior V10.1 V10.2

CodeWarrior V5.0 V5.1 (16Bit microcontroller development environment)

CodeWarrior V6.2 V6.3(8Bit microcontroller development environment)

3. Environment : WINXP / WIN7 32/64 bit

4.BDM clock up40M

5. Support FirmwareOnline Upgrade

6.BDM interface is the official standard version , is defined as follows :

1.BKGD 3.NC 5.NC

2.GND 4.RST 6.VDD

Support chips:

HCS08 8Full range of

MC9S08AC128, MC9S08AC16, MC9S08AC32, MC9S08AC48, MC9S08AC60, MC9S08AC8, MC9S08AC96, MC9S08AW16, MC9S08AW16A, MC9S08AW32, MC9S08AW48, MC9S08AW60, MC9S08AW8A

MC9S08DE32, MC9S08DE60, MC9S08DN16, MC9S08DN32, MC9S08DN48, MC9S08DN60, MC9S08DV128, MC9S08DV16, MC9S08DV32, MC9S08DV48, MC9S08DV60, MC9S08DV96, MC9S08DZ128, MC9S08DZ16, MC9S08DZ32, MC9S08DZ48, MC9S08DZ60, MC9S08DZ96

MC9S08EN16, MC9S08EN32

MC9S08EL16, MC9S08EL32

MC9S08GB32, MC9S08GB32A, MC9S08GB60, MC9S08GB60A, MC9S08GT16, MC9S08GT16A, MC9S08GT32, MC9S08GT32A, MC9S08GT60, MC9S08GT60A, MC9S08GT8A

MC9S08JM16, MC9S08JM32, MC9S08JM60, MC9S08JM8

MC9S08JR12

MC9S08LC36, MC9S08LC60

MC9S08QA4, MC9S08QD2, MC9S08QD4, MC9S08QE128, MC9S08QE16, MC9S08QE32, MC9S08QE32, MC9S08QE4, MC9S08QE64, MC9S08QE8, MC9S08QE96, MC9S08QG4, MC9S08QG8

MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RC8, MC9S08RD16, MC9S08RD32, MC9S08RD60, MC9S08RD8, MC9S08RE16, MC9S08RE32, MC9S08RE60, MC9S08RE8, MC9S08RG32, MC9S08RG60

MC9S08SG16, MC9S08SG32, MC9S08SG4, MC9S08SG8

MC9S08SH16, MC9S08SH32, MC9S08SH4, MC9S08SH8

MC9S08SLL16, MC9S08SLL8

HCS12 (X) 16Full range of

MC9S12A128B, MC9S12A256B, MC9S12A32, MC9S12A64, MC9S12A512

MC9S12B64, MC9S12B128

MC9S12C32, MC9S12C64, MC9S12C96

MC9S12D32, MC9S12D64, MC9S12DB128A, MC9S12DB128B, MC9S12DG128B, MC9S12DG256B, MC9S12DJ128B, MC9S12DJ256B, MC9S12DJ64, MC9S12DP256B, MC9S12DJ64, MC9S12DP256B, MC9S12DP512, MC9S12DT128B, MC9S12DT256, MC9S12DT256B

MC9S12E32, MC9S12E64, MC9S12E128, MC9S12E256

MC9S12G96, MC9S12G128

MC9S12GC16, MC9S12GC32, MC9S12GC128

MC9S12H128, MC9S12H256, MC9S12HN64, MC9S12HZ64, MC9S12HZ128, MC9S12HZ256

MC9S12HA32, MC9S12HA48, MC9S12HZ64

MC9S12HY32, MC9S12HY48, MC9S12HY64

MC9S12I32, MC9S12I128

MC9S12KC64, MC9S12KC128, MC9S12KG64, MC9S12KG128, MC9S12KG256, MC9S12KL64, MC9S12KL128, MC9S12KT128, MC9S12KT256

MC9S12NE64

MC9S12P32, MC9S12P64, MC9S12P96, MC9S12P128

MC9S12Q32, MC9S12Q64, MC9S12Q96, MC9S12Q128

MC9S12T64

MC9S12UF32

MC9S12XA128, MC9S12XA256, MC9S12XA512

MC9S12XB128, MC9S12XB256

MC9S12XD64, MC9S12XD128, MC9S12XD256, MC9S12XDG128, MC9S12XDP512, MC9S12XDQ256, MC9S12XDT256, MC9S12XDT384, MC9S12XDT512

MC9S12XEG128, MC9S12XEP100, MC9S12XEP768, MC9S12XEQ384, MC9S12XEQ512, MC9S12XET256

MC9S12XFR128

MC9S12XHY128, MC9S12XHY256

MC9S12XS64, MC9S12XS128, MC9S12XS256

CH001367
€14.79

Freescale BDM USBDM 8/16/32 bit 3in1 smart car driver

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N11PLP2A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000519
€5.40

N11P-LP2-A3 Stencil Template

GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

wishlist
Compare

2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

wishlist
Compare

N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

wishlist
Compare

N3150 SR2A8 Stencil Template

N3150 SR2A8 Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000514
€6.22

N3150 SR2A8 Stencil Template

wishlist
Compare

Freescale BDM USBDM 81632 bit 3in1 smart car driver

Freescale USBDM 8/16/32 bit 3 in 1 Emulator

Login to Download: Download software

Features:

1. SupportFull range of HCS08 , HCS12 (X) full range , Coldfire V1 full range, Can be downloaded online , single-step debugging , simulation, observe all registers and global variables values

2. Support the development environment :

CodeWarrior V10.1 V10.2

CodeWarrior V5.0 V5.1 (16Bit microcontroller development environment)

CodeWarrior V6.2 V6.3(8Bit microcontroller development environment)

3. Environment : WINXP / WIN7 32/64 bit

4.BDM clock up40M

5. Support FirmwareOnline Upgrade

6.BDM interface is the official standard version , is defined as follows :

1.BKGD 3.NC 5.NC

2.GND 4.RST 6.VDD

Support chips:

HCS08 8Full range of

MC9S08AC128, MC9S08AC16, MC9S08AC32, MC9S08AC48, MC9S08AC60, MC9S08AC8, MC9S08AC96, MC9S08AW16, MC9S08AW16A, MC9S08AW32, MC9S08AW48, MC9S08AW60, MC9S08AW8A

MC9S08DE32, MC9S08DE60, MC9S08DN16, MC9S08DN32, MC9S08DN48, MC9S08DN60, MC9S08DV128, MC9S08DV16, MC9S08DV32, MC9S08DV48, MC9S08DV60, MC9S08DV96, MC9S08DZ128, MC9S08DZ16, MC9S08DZ32, MC9S08DZ48, MC9S08DZ60, MC9S08DZ96

MC9S08EN16, MC9S08EN32

MC9S08EL16, MC9S08EL32

MC9S08GB32, MC9S08GB32A, MC9S08GB60, MC9S08GB60A, MC9S08GT16, MC9S08GT16A, MC9S08GT32, MC9S08GT32A, MC9S08GT60, MC9S08GT60A, MC9S08GT8A

MC9S08JM16, MC9S08JM32, MC9S08JM60, MC9S08JM8

MC9S08JR12

MC9S08LC36, MC9S08LC60

MC9S08QA4, MC9S08QD2, MC9S08QD4, MC9S08QE128, MC9S08QE16, MC9S08QE32, MC9S08QE32, MC9S08QE4, MC9S08QE64, MC9S08QE8, MC9S08QE96, MC9S08QG4, MC9S08QG8

MC9S08RC16, MC9S08RC32, MC9S08RC60, MC9S08RC8, MC9S08RD16, MC9S08RD32, MC9S08RD60, MC9S08RD8, MC9S08RE16, MC9S08RE32, MC9S08RE60, MC9S08RE8, MC9S08RG32, MC9S08RG60

MC9S08SG16, MC9S08SG32, MC9S08SG4, MC9S08SG8

MC9S08SH16, MC9S08SH32, MC9S08SH4, MC9S08SH8

MC9S08SLL16, MC9S08SLL8

HCS12 (X) 16Full range of

MC9S12A128B, MC9S12A256B, MC9S12A32, MC9S12A64, MC9S12A512

MC9S12B64, MC9S12B128

MC9S12C32, MC9S12C64, MC9S12C96

MC9S12D32, MC9S12D64, MC9S12DB128A, MC9S12DB128B, MC9S12DG128B, MC9S12DG256B, MC9S12DJ128B, MC9S12DJ256B, MC9S12DJ64, MC9S12DP256B, MC9S12DJ64, MC9S12DP256B, MC9S12DP512, MC9S12DT128B, MC9S12DT256, MC9S12DT256B

MC9S12E32, MC9S12E64, MC9S12E128, MC9S12E256

MC9S12G96, MC9S12G128

MC9S12GC16, MC9S12GC32, MC9S12GC128

MC9S12H128, MC9S12H256, MC9S12HN64, MC9S12HZ64, MC9S12HZ128, MC9S12HZ256

MC9S12HA32, MC9S12HA48, MC9S12HZ64

MC9S12HY32, MC9S12HY48, MC9S12HY64

MC9S12I32, MC9S12I128

MC9S12KC64, MC9S12KC128, MC9S12KG64, MC9S12KG128, MC9S12KG256, MC9S12KL64, MC9S12KL128, MC9S12KT128, MC9S12KT256

MC9S12NE64

MC9S12P32, MC9S12P64, MC9S12P96, MC9S12P128

MC9S12Q32, MC9S12Q64, MC9S12Q96, MC9S12Q128

MC9S12T64

MC9S12UF32

MC9S12XA128, MC9S12XA256, MC9S12XA512

MC9S12XB128, MC9S12XB256

MC9S12XD64, MC9S12XD128, MC9S12XD256, MC9S12XDG128, MC9S12XDP512, MC9S12XDQ256, MC9S12XDT256, MC9S12XDT384, MC9S12XDT512

MC9S12XEG128, MC9S12XEP100, MC9S12XEP768, MC9S12XEQ384, MC9S12XEQ512, MC9S12XET256

MC9S12XFR128

MC9S12XHY128, MC9S12XHY256

MC9S12XS64, MC9S12XS128, MC9S12XS256

CH001367
€14.79

Freescale BDM USBDM 8/16/32 bit 3in1 smart car driver

wishlist
Compare

N11PLP2A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000519
€5.40

N11P-LP2-A3 Stencil Template

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