GF-GO7400T-B-N-A3

Part Number GF-GO7400T-B-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1211

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

OTS-20-1.27-01 Programmer Adapter Double SOP8-DIP8(SOP16-DIP20)Socket (200mil)

N16E-GX-A1 GTX980M

Part Number N16E-GX-A1 (GM204-700-A1) Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

XGecu T56 Universal Programmer Support NAND/EMMC/MCU/ISP

Login to Download: Download software Device Support List instruction manual EDID code Reading & Writing Use

Programmer Overview

1.1 Performance Introduction

Carefully built low-cost professional programmer, high-density chip production process, a

unified user interface, easy to use, functional integrity, application software, reliable

operation, code small, faster execution. supported operating system:

WINXP WIN2003 WIN2008 VISTA WIN7 WIN8 WIN10 32-bit or 64-bit operating system

? The programming speed is greatly improved. It is suitable for small batch production and supports 4 programmers for one computer.

? A wide range of chip support, the initial version supports the chip 15000+, supports a variety of 24 25 26 27 28 29 37 39 49 50 series of serial and parallel memory chips, microcontroller 51 series, ATMEL AVR ATMEGA AT90 series, MICROCHIP PIC10 PIC12 PIC16 PIC18 series microcontroller , GAL programmable logic device programming, SRAM test, 54/74 and CMOS4000 integrated circuit integrated functional test.

Support NAND Flash chip, the function is complete and comprehensive, the capacity supports to 8Gbits.

25 series Nor Flash capacity support to 512Mbits.

? Pin contact check function, poor contact pin can pinpoint

? Ultra-low power consumption: the entire programmer uses ultra-low-power chips, using USB interface, the first truly all chip programming

without external power integrated programmer. Portable performance super: the world's smallest volume, size 10CM * 6CM * 2.5CM, only the size of the driver's license.

? Programmable VCC from 1.8V to 6.5V, VPP from 1.8V to 18V chip

? Chip serial number secondary development functions: Programmer built a variety of commonly used automatic numbering function. And can use a custom algorithm to achieve any sequence number through DLL dynamic library. This feature allows you to produce

a unique identification info rmation for each chip in mass production. The logo can also be encrypted with a custom algorithm to more effectively protect your product's rights.

? Universal serial programming interface ICSP (to support both high-voltage parallel programming and low-volt age serial programming). Note: ICSP now supports 24-Series 25 Series 93 Series Serial Integrated Circuits, ATMEL89S51,52, AVR ATMEGAxxx Full

Series, and MICROCHIP PIC10Fxxx 12Fxxx 16Fxxx 18Fxxx Full Series, and the new series of SYNCMOS SM59Dxx SM59Rxx fu ll range chips for in-circuit serial programming.

? Powerful 54 / 74F / LS / HC CMOS4000 Series Integrated Functionality Tests: The First Development Programmer to Test Common Logic ICs True, Test Errors Locating Logic Gate Circuits, Test Arbitrary Possible input combinations.

1.2 Programmer chip support range

? Variety of 26 27 28 29 37 39 49 50 series of parallel ROM, EPROM, EEPROM

Fast, full support. Support TSOP32 TSOP40 TSOP48 chips to 64MBits, will join the TSOP56 pin support.

(TL866II programming voltage VPP only supports up to 18V, for early 27C series ROM, the

chip with 21V 25V VPP voltage no longer supports writing, but can be read. If it is used,

the VPP with the same type of programming voltage can be used as 13V or 12V chip replacement, for example: 27C32 21V or 13V Vpp chip,Pay attention to the VPP voltage)

? 24 25 35 45 85 93 95 Series Serial EEPROM

Serial Series Chip Support Full, Supports Chip Capacity 25 Series 8 or 16PIN to 512MBits (64M Bytes)

? NAND FLASH chip supports up to 8Gbits

? MCU series, hundreds of models of 51 series of microcomputer

? AVR microcontroller package scratch ATMEGA series ATtiny series AT90XXX series of microcontrollers, all AVR ATMEGAxxx chip also supports the ICSP interface for SPI serial download programming. Support AVR one-to-one soft-key with RC correction byte.

? MICROCHIP PIC10 PIC12 PIC16 PIC18 Series Microcontroller:

PIC series of more than 300 models, more than 900 package chip support, currently supports

one of the most complete PIC chip integrated programmer. For vario

us types of PIC monolithic, in strict accordance with the manufacturer's manual requirements, the optimal programming, programming speed is excellent. The vast majority of chips support both ISCP online programming and programming through programming sockets.

? GAL programmable logic device programming

? SRAM test

Support for common 24 61 62 DS12 series SRAM test, respectively, to data line testing,

address line testing, memory unit incremental testing and unit testing.

? Super performance 54 / 74F / LS / HC CMO

S4000 series integrated circuit integrated

Function test:

The first development-type programmer to really test common logic ICs to test for errors

that can be located to logic gates, and to test any possible combinations of inputs in an integrated circuit when testing.

Packing List:

1 * XGecu T56 universal programmer.

1 * BGA48 Adapter(LFBGA48, 8*6mm, spacing 0.8mm)

1 * BGA63 Adapter(11*9mm)

1 * XG-ADP-BGA64A-1.0 Adapter(11*13mm,10*13mm,10*15mm)

1 * BGA169 Adapter(11.5*13mm,11*10mm,12*16mm,14*18mm)

1 * TSOP56/48/40/32 Adapter

1 * ADP-SSO-056-0.8 Adapter

1 * LCD LED screen EDID Cable

N12E-GS-A1 GTX560M

Part Number N12E-GS-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 210 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

216-0749001 HD5470

Part Number 216-0749001 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

Top 6 Reasons To Get FGTech Galletto 4

1. Latest Version: V54

2. Supported Operating System: windows XP. more friendly than Fgtech v53 , much easier to operate

3. Unlock Version: Can Use Directly. No Need To Activate

4. FGTECH V54 PCB board

5. Supported Language: English, Italian, German, French, Spanish, Portuguese, Czech, Turkish

6. Support Tricore Function

FG Tech Galletto 4-Master V54 BDM-OBD is a famous chip tuning tool for all cars, trucks, motorcycles, Marine, BDM MPCxx, BDM Boot Mode , checksum. This item cannot only work as FGTech Galletto 4-Master, but can also work for BDM-OBD.

FGTech Galletto 4-Master this new system developed with high-speed USB2 technology is the fastest and most secure product on the market, it is easy to install and use by anyone. Our system comes furnished complete with all Car, Truck, Motorbyke, Marine, BDM MPCxx , BDM Boot Mode, checksum.

Boot Mode System:

Infineon Sak TC1766

Infineon Sak TC1767

Infineon Sak TC1792

Infineon Sak TC1796

Infineon Sak TC1797

NEW JTAG - BDM - MOTOROLA - FREESCALE - INFINEON

Freescale MPC 5553/5554/5565/5566 NEXSUS PORT New IAW MJD 8F2 - Mair 8GMF

New Delphy DCM3.5xx DCM3.7xx TRW

Motorola Freescale MPC 555/556/561/562/563/564/565

Motorola MC 68332 - MC YQQCU - MC 68377 Trionic 5/7/8 GM-OPEL-SAAB

Motorola MC 68376 Campi 01 Lamborghini - Lotus

Motorola MC 68336 MEMS D5 ROVER

Motorola ZC 439615 - ZC 439507 IAW FIAT - VAG

New Line OBD protocols VPM GM - Hummer-Corvette-Munstang-Blazer-Cadilac

New Line OBD protocols Tx-Rx - Subaru - Mitsubischi - Hitachi - Denso ecu

All EDC17 MED17 is good always modify with Boot Mode .

Automatic Checksum:

All old protocols included from Bosch MExx / EDCxx / Marelli / Siemens / Delpy / Lucas / Denso

Boot Mode C167x / ST10, Boot Mode Infineon With password Bosch , Siemens

Motorola MC68332 - MCYQQCU - MC68377 , MC68376 , MC68336, ZC439615 ,ZC439507

Motorola Freescale MPC 555/556/561/562/563/564/565

Freescale MPC 5553/5554/5565/5566

BDM .

5-30V Car / Industrial Vehicles, L line / K line KWP, CAN

Can Bus V2.0 50Kb > 1000Kb

J1850 VPW PWM GM -FORD

Rx Tx RS232,

RS 485,

Automatic setup Pull up K-L line 250, 500, 1000 ohm,

Automatic setup termination Can bus 0, 60,120 ohm,

Master Version:

Recovery Mode Completa

Funzione scan tool per eliminare i DTC

Function scan tool for erase the DTC

Controllo tensione di batteria auto in tempo reale

Check tension of battery car in real time

Package including:

1pc x New version main interface

1pc x ECU cable for boot

1pc x Adapter for BDM to CMD with bdm cables

3pcs x BDM adapters

6pcs x BDM connectors

2pcs x Power cable

1pc x OBD2 cable

1pc x USB cable (1.5meter)

1pc x CD (2012 version SW -MASTER, documents pdf, pictures, etc.)

IC Chip Extractor Motherboard Circuit Board Component Puller Tool

218-0755042 HD6650

Part Number 218-0755034 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 11+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

RT809H special seat mobile phone EMMC jumping seat EMMC153 seat EMMC169 adapter seat reading and writing seat mobile phone repair seat

Limit frame specification: 11.5*13mm, 11*10mm, 12*16mm, 14*18mm

Buy Limit Frame: * 11*10mm, 12*16mm, 14*18mm

BD82H55 SLGZX

Part Number BD82H55 SLGZX Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 1115

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

N13P-GLR-A1 GT635M

Part Number N13P-GLR-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1304

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock