Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

Top 6 Reasons To Get FGTech Galletto 4

1. Latest Version: V54

2. Supported Operating System: windows XP. more friendly than Fgtech v53 , much easier to operate

3. Unlock Version: Can Use Directly. No Need To Activate

4. FGTECH V54 PCB board

5. Supported Language: English, Italian, German, French, Spanish, Portuguese, Czech, Turkish

6. Support Tricore Function

FG Tech Galletto 4-Master V54 BDM-OBD is a famous chip tuning tool for all cars, trucks, motorcycles, Marine, BDM MPCxx, BDM Boot Mode , checksum. This item cannot only work as FGTech Galletto 4-Master, but can also work for BDM-OBD.

FGTech Galletto 4-Master this new system developed with high-speed USB2 technology is the fastest and most secure product on the market, it is easy to install and use by anyone. Our system comes furnished complete with all Car, Truck, Motorbyke, Marine, BDM MPCxx , BDM Boot Mode, checksum.

Boot Mode System:

Infineon Sak TC1766

Infineon Sak TC1767

Infineon Sak TC1792

Infineon Sak TC1796

Infineon Sak TC1797

NEW JTAG - BDM - MOTOROLA - FREESCALE - INFINEON

Freescale MPC 5553/5554/5565/5566 NEXSUS PORT New IAW MJD 8F2 - Mair 8GMF

New Delphy DCM3.5xx DCM3.7xx TRW

Motorola Freescale MPC 555/556/561/562/563/564/565

Motorola MC 68332 - MC YQQCU - MC 68377 Trionic 5/7/8 GM-OPEL-SAAB

Motorola MC 68376 Campi 01 Lamborghini - Lotus

Motorola MC 68336 MEMS D5 ROVER

Motorola ZC 439615 - ZC 439507 IAW FIAT - VAG

New Line OBD protocols VPM GM - Hummer-Corvette-Munstang-Blazer-Cadilac

New Line OBD protocols Tx-Rx - Subaru - Mitsubischi - Hitachi - Denso ecu

All EDC17 MED17 is good always modify with Boot Mode .

Automatic Checksum:

All old protocols included from Bosch MExx / EDCxx / Marelli / Siemens / Delpy / Lucas / Denso

Boot Mode C167x / ST10, Boot Mode Infineon With password Bosch , Siemens

Motorola MC68332 - MCYQQCU - MC68377 , MC68376 , MC68336, ZC439615 ,ZC439507

Motorola Freescale MPC 555/556/561/562/563/564/565

Freescale MPC 5553/5554/5565/5566

BDM .

5-30V Car / Industrial Vehicles, L line / K line KWP, CAN

Can Bus V2.0 50Kb > 1000Kb

J1850 VPW PWM GM -FORD

Rx Tx RS232,

RS 485,

Automatic setup Pull up K-L line 250, 500, 1000 ohm,

Automatic setup termination Can bus 0, 60,120 ohm,

Master Version:

Recovery Mode Completa

Funzione scan tool per eliminare i DTC

Function scan tool for erase the DTC

Controllo tensione di batteria auto in tempo reale

Check tension of battery car in real time

Package including:

1pc x New version main interface

1pc x ECU cable for boot

1pc x Adapter for BDM to CMD with bdm cables

3pcs x BDM adapters

6pcs x BDM connectors

2pcs x Power cable

1pc x OBD2 cable

1pc x USB cable (1.5meter)

1pc x CD (2012 version SW -MASTER, documents pdf, pictures, etc.)

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

IC Chip Extractor Motherboard Circuit Board Component Puller Tool

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

RT809H special seat mobile phone EMMC jumping seat EMMC153 seat EMMC169 adapter seat reading and writing seat mobile phone repair seat

Limit frame specification: 11.5*13mm, 11*10mm, 12*16mm, 14*18mm

Buy Limit Frame: * 11*10mm, 12*16mm, 14*18mm

88E1145-BBM MARVELL

Part Number 88E1145-BBM Manufacturer MARVELL

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Login to Download: Download software Device List

Field of application:

This programmer can read and write the bios chips of DVD,TV,PC,harddisk,etc.

Features:

1. USB 2.0 interface, the speed is 12Mbps.

2. The speed of reading and writing is fast.

3. Auto detect chip modles.

4. Auto select power votage.

5. Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

6. Small shape.

7. Windows XP, Windows Vista, Win7,WIN8,WIN10.

List:

1. Programmer 1

2. Usb cable 1

3. CD 1

4. Manual(a file on CD) 1

5. Simple socket for SMD chips 2

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SA636 Adapter for XELTEK SuperPro 610P 611S

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Supports all 24C02 programmers to read and write

2015 the latest design base without the need to replace the plug can burn to write LCD LED code ( Note : do not support Chi Mei screen)

Now many brands of notebooks for the same type of screen after the black screen and so on, almost all of the code to replace

To this end, we specially designed to read and write a piece of code on the computer tool to facilitate the maintenance staff to improve work efficiency

The screen is almost all 24C02 so as long as you are a programmer to support 24C02, then on behalf of the screen can be used on your programmer

For T809H, you need to reset it: