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High Speed PCIe 1X4x Card to NGFF M2 M Key LM141XV10 PCIe Slot Adapter

Sale High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

Description:

PCI-e X4 to M.2 NGFF Adapter

M.2 Specification Revision 0.9-3

Serial ATA Spec. Reversion 3.2

Support 2260/2280 type M.2 SSD module slot

Only Supports an M.2 Socket 3 PCI-e-based slot

Micro SATA Cables PN # M2-PCIE-1X4X

Quantity:1 Set

Features:

PCI Express PCI-E 4X Female to NGFF M.2 M Key Male Adapter Converter Card with Power Cable Allows users to use standard

PCI-e 1x/4x card in an M.2 NGFF M key slot in the Desktop or Laptop. Transparent to the operating system and does not require any software drivers

Supports data transfer up to 4.0GB/s. Supports socket 3 (M Key). One PCI-E 4X female socket and one NGFF M.2 Key M male connector available

Floppy 4 pin power connector available for stable power. 2 screw holes 2260/2280 available. Easy installation & no driver required. Supports any OS, like Windows, WinCE & Linux etc.

Function:

Allows users to use standard PCI-e 4x card in an M.2 NGFF M key slot in the Desktop or Laptop

Transparent to the operating system and does not require any software drivers

Package Included:

1 x PCI-E 4X to NGFF M.2 B+M Key Adapter Card

1 x Floppy 4 Pin to Molex Power Cable

1 x Screw

CH002247
€6.09

High Speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

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2160731004

216-0731004

Part Number 216-0731004 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002249
€26.12

216-0731004

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BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002250
€9.70

BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

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TI BQ24725A Texas

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002251
€3.45

TI BQ24725A Texas

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KB9012 simple PCB Board for RT80x809H Programmer

RT809F RT809H optional accessories - KB9012 offline read-write adapter board, this is a piece, including PCB, 4 PIN needle row 2 groups.

Need to prepare the following materials and weld: 0603 package piece resistance one, resistance value 47K or 51K, bit number R1; 0603 package piece capacity two, 0.1uF, bit number C3 and C4; 10uF or 22uF capacitor one, package 0603 or 1206, bit number C1 or C2, install one. (Capacitor withstand voltage can be regardless, greater than 5V can be)

CH002252
€2.70

KB9012 simple PCB Board for RT809F RT809H Programmer

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RT8243AZQG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002254
€3.45

RT8243AZQG

wishlist
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VT1316MAFA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002256
€3.45

VT1316MAFA

wishlist
Compare
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i74760HQ SR1BM Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002258
€8.70

i7-4760HQ SR1BM Stencil Template

High Speed PCIe 1X4x Card to NGFF M2 M Key LM141XV10 PCIe Slot Adapter

Sale High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

High speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

Description:

PCI-e X4 to M.2 NGFF Adapter

M.2 Specification Revision 0.9-3

Serial ATA Spec. Reversion 3.2

Support 2260/2280 type M.2 SSD module slot

Only Supports an M.2 Socket 3 PCI-e-based slot

Micro SATA Cables PN # M2-PCIE-1X4X

Quantity:1 Set

Features:

PCI Express PCI-E 4X Female to NGFF M.2 M Key Male Adapter Converter Card with Power Cable Allows users to use standard

PCI-e 1x/4x card in an M.2 NGFF M key slot in the Desktop or Laptop. Transparent to the operating system and does not require any software drivers

Supports data transfer up to 4.0GB/s. Supports socket 3 (M Key). One PCI-E 4X female socket and one NGFF M.2 Key M male connector available

Floppy 4 pin power connector available for stable power. 2 screw holes 2260/2280 available. Easy installation & no driver required. Supports any OS, like Windows, WinCE & Linux etc.

Function:

Allows users to use standard PCI-e 4x card in an M.2 NGFF M key slot in the Desktop or Laptop

Transparent to the operating system and does not require any software drivers

Package Included:

1 x PCI-E 4X to NGFF M.2 B+M Key Adapter Card

1 x Floppy 4 Pin to Molex Power Cable

1 x Screw

CH002247
€6.09

High Speed PCI-e 1X/4x Card to NGFF M.2 M Key LM-141X-V1.0 PCIe Slot Adapter

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DC Power Jack Part PJ084

Dell Inspiron One Series DC Power Jack Connector: 2020, 2120, 2205, 2301, 2305, 2320

Dell Vostro All-in-One Series DC Power Jack Connector: 360

CH002248
€7.21

DC Power Jack, Part #PJ084

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2160731004

216-0731004

Part Number 216-0731004 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 09+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002249
€26.12

216-0731004

wishlist
Compare

BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002250
€9.70

BGA96 U3100 CD3215A CD3215C00 CD3215B01 CD3215B03 74ABJLW Stencil Template

wishlist
Compare

TI BQ24725A Texas

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002251
€3.45

TI BQ24725A Texas

wishlist
Compare

KB9012 simple PCB Board for RT80x809H Programmer

RT809F RT809H optional accessories - KB9012 offline read-write adapter board, this is a piece, including PCB, 4 PIN needle row 2 groups.

Need to prepare the following materials and weld: 0603 package piece resistance one, resistance value 47K or 51K, bit number R1; 0603 package piece capacity two, 0.1uF, bit number C3 and C4; 10uF or 22uF capacitor one, package 0603 or 1206, bit number C1 or C2, install one. (Capacitor withstand voltage can be regardless, greater than 5V can be)

CH002252
€2.70

KB9012 simple PCB Board for RT809F RT809H Programmer

wishlist
Compare

RT8243AZQG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002254
€3.45

RT8243AZQG

wishlist
Compare

VT1316MAFA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002256
€3.45

VT1316MAFA

wishlist
Compare

i74760HQ SR1BM Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002258
€8.70

i7-4760HQ SR1BM Stencil Template

wishlist
Compare
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