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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
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i53317U SR0N8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000533
€5.40

i5-3317U SR0N8 Stencil Template

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A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8800 MC375LLA

PO000073
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8800 MC375LL/A

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N13PGLRA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000539
€5.40

N13P-GLR-A1 Stencil Template

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A1278 EMC 2419 Bios Chip EFI Firmware 820-2936 Early 2011 13 Core i5 I52415M MC700LLA

PO000074
€18.00 €22.50

A1278 EMC 2419 Bios EFI Firmware 820-2936 Early 2011 13 Core i5 I5-2415M MC700LL/A

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A1278 EMC 2419 Bios Chip EFI Firmware 820-2936 Early 2011 13 Core i7 I72620M MC724LLA

PO000075
€18.00 €22.50

A1278 EMC 2419 Bios EFI Firmware 820-2936 Early 2011 13 Core i7 I7-2620M MC724LL/A

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GF106150A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000544
€5.40

GF106-150-A1 Stencil Template

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A1278 EMC 2555 Bios Chip EFI Firmware 820-2936 Late 2011 13 Core i5 I52435M MD313LLA

PO000076
€18.00 €22.50

A1278 EMC 2555 Bios EFI Firmware 820-2936 Late 2011 13 Core i5 I5-2435M MD313LL/A

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i73517U SR0N6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000545
€5.40

i7-3517U SR0N6 Stencil Template

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A1278 EMC 2555 Bios Chip EFI Firmware 820-2936 Late 2011 13 Core i7 I72640M MD314LLA

PO000077
€18.00 €22.50

A1278 EMC 2555 Bios EFI Firmware 820-2936 Late 2011 13 Core i7 I7-2640M MD314LL/A

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GK110425B1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000552
€6.22

GK110-425-B1 Stencil Template

  • -20%
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A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i5 I53210M MD101LLA

PO000078
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i5 I5-3210M MD101LL/A

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i32310M SR04S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000556
€5.40

i3-2310M SR04S Stencil Template

i53317U SR0N8 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000533
€5.40

i5-3317U SR0N8 Stencil Template

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A1278 EMC 2351 Bios Chip EFI Firmware 820-2879 Mid2010 13 Core 2 Duo P8800 MC375LLA

PO000073
€18.00 €22.50

A1278 EMC 2351 Bios EFI Firmware 820-2879 Mid-2010 13 Core 2 Duo P8800 MC375LL/A

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N13PGLRA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000539
€5.40

N13P-GLR-A1 Stencil Template

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  • -20%

A1278 EMC 2419 Bios Chip EFI Firmware 820-2936 Early 2011 13 Core i5 I52415M MC700LLA

PO000074
€18.00 €22.50

A1278 EMC 2419 Bios EFI Firmware 820-2936 Early 2011 13 Core i5 I5-2415M MC700LL/A

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  • -20%

A1278 EMC 2419 Bios Chip EFI Firmware 820-2936 Early 2011 13 Core i7 I72620M MC724LLA

PO000075
€18.00 €22.50

A1278 EMC 2419 Bios EFI Firmware 820-2936 Early 2011 13 Core i7 I7-2620M MC724LL/A

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GF106150A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000544
€5.40

GF106-150-A1 Stencil Template

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  • -20%

A1278 EMC 2555 Bios Chip EFI Firmware 820-2936 Late 2011 13 Core i5 I52435M MD313LLA

PO000076
€18.00 €22.50

A1278 EMC 2555 Bios EFI Firmware 820-2936 Late 2011 13 Core i5 I5-2435M MD313LL/A

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i73517U SR0N6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000545
€5.40

i7-3517U SR0N6 Stencil Template

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Compare
  • -20%

A1278 EMC 2555 Bios Chip EFI Firmware 820-2936 Late 2011 13 Core i7 I72640M MD314LLA

PO000077
€18.00 €22.50

A1278 EMC 2555 Bios EFI Firmware 820-2936 Late 2011 13 Core i7 I7-2640M MD314LL/A

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Compare

GK110425B1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000552
€6.22

GK110-425-B1 Stencil Template

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Compare
  • -20%

A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i5 I53210M MD101LLA

PO000078
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i5 I5-3210M MD101LL/A

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i32310M SR04S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000556
€5.40

i3-2310M SR04S Stencil Template

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