• Show Sidebar

There are 1279 products.

Active filters

  • Categories: BGA Reballing Kits, Stencils
  • Categories: Bios Chip Programming
  • Categories: Programmer Spare Part
wishlist
Compare
Quickview

GK110425B1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000552
€6.22

GK110-425-B1 Stencil Template

  • -20%
wishlist
Compare
Quickview

A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i5 I53210M MD101LLA

PO000078
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i5 I5-3210M MD101LL/A

wishlist
Compare
Quickview

i32310M SR04S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000556
€5.40

i3-2310M SR04S Stencil Template

  • -20%
wishlist
Compare
Quickview

A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i7 I73520M MD102LLA

PO000079
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i7 I7-3520M MD102LL/A

wishlist
Compare
Quickview

N16EGXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000557
€9.97

N16E-GX-A1 Stencil Template 90*90

wishlist
Compare
Quickview

BD82NM70 ALJTA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000567
€5.40

BD82NM70 ALJTA Stencil Template

wishlist
Compare
Quickview

21508390x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000577
€9.97

215-0839097 Stencil Template 90*90

  • -20%
wishlist
Compare
Quickview

A1425 EMC 2557 Bios Chip EFI Firmware 820-3462 Retina Late 2012 Core i7 I73520M ME116LLA

PO000081
€18.00 €22.50

A1425 EMC 2557 Bios EFI Firmware 820-3462 Retina Late 2012 Core i7 I7-3520M ME116LL/A

wishlist
Compare
Quickview

GFGO7600HNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000578
€5.40

GF-GO7600-H-N-A2 Stencil Template

  • -20%
wishlist
Compare
Quickview

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

  • -20%
wishlist
Compare
Quickview

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

wishlist
Compare
Quickview

N13PGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000588
€5.40

N13P-GT-W-A2 Stencil Template

GK110425B1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000552
€6.22

GK110-425-B1 Stencil Template

wishlist
Compare
  • -20%

A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i5 I53210M MD101LLA

PO000078
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i5 I5-3210M MD101LL/A

wishlist
Compare

i32310M SR04S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000556
€5.40

i3-2310M SR04S Stencil Template

wishlist
Compare
  • -20%

A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i7 I73520M MD102LLA

PO000079
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i7 I7-3520M MD102LL/A

wishlist
Compare

N16EGXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000557
€9.97

N16E-GX-A1 Stencil Template 90*90

wishlist
Compare

BD82NM70 ALJTA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000567
€5.40

BD82NM70 ALJTA Stencil Template

wishlist
Compare

21508390x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000577
€9.97

215-0839097 Stencil Template 90*90

wishlist
Compare
  • -20%

A1425 EMC 2557 Bios Chip EFI Firmware 820-3462 Retina Late 2012 Core i7 I73520M ME116LLA

PO000081
€18.00 €22.50

A1425 EMC 2557 Bios EFI Firmware 820-3462 Retina Late 2012 Core i7 I7-3520M ME116LL/A

wishlist
Compare

GFGO7600HNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000578
€5.40

GF-GO7600-H-N-A2 Stencil Template

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

wishlist
Compare
  • -20%

A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

wishlist
Compare

N13PGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000588
€5.40

N13P-GT-W-A2 Stencil Template

wishlist
Compare
Back to top