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  • Categories: Bios Chip Programming
  • Categories: CPU and Graphic Chips
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G86741A2 8400MGS

G86-741-A2 8400MGS

Part Number G86-741-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1207

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001230
€54.97

G86-741-A2 8400MGS

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A1278 EMC 2555 Bios Chip EFI Firmware 820-2936 Late 2011 13 Core i5 I52435M MD313LLA

PO000076
€18.00 €22.50

A1278 EMC 2555 Bios EFI Firmware 820-2936 Late 2011 13 Core i5 I5-2435M MD313LL/A

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N13EGS1A1

N13E-GS1-A1

Part Number N13E-GS1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1213

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001242
€124.72

N13E-GS1-A1

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MCP67MVA2

MCP67MV-A2

Part Number MCP67MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001247
€73.85

MCP67MV-A2

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A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i5 I53210M MD101LLA

PO000078
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i5 I5-3210M MD101LL/A

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2160842009 HD8730M

216-0842009 HD8730M

Part Number 216-0842009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1234

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001251
€67.04

216-0842009 HD8730M

  • -20%
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A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i7 I73520M MD102LLA

PO000079
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i7 I7-3520M MD102LL/A

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N15VGMSA2

N15V-GM-S-A2

Part Number N15V-GM-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001262
€24.62

N15V-GM-S-A2

  • -20%
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A1425 EMC 2557 Bios Chip EFI Firmware 820-3462 Retina Late 2012 Core i7 I73520M ME116LLA

PO000081
€18.00 €22.50

A1425 EMC 2557 Bios EFI Firmware 820-3462 Retina Late 2012 Core i7 I7-3520M ME116LL/A

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FH82HM370 SR40B

FH82HM370 SR40B

Part Number SR408 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001266
€62.36

FH82HM370 SR40B

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QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
€21.33

QD-FX-350MT-N-A3

  • -20%
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

G86741A2 8400MGS

G86-741-A2 8400MGS

Part Number G86-741-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1207

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001230
€54.97

G86-741-A2 8400MGS

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A1278 EMC 2555 Bios Chip EFI Firmware 820-2936 Late 2011 13 Core i5 I52435M MD313LLA

PO000076
€18.00 €22.50

A1278 EMC 2555 Bios EFI Firmware 820-2936 Late 2011 13 Core i5 I5-2435M MD313LL/A

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N13EGS1A1

N13E-GS1-A1

Part Number N13E-GS1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1213

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001242
€124.72

N13E-GS1-A1

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MCP67MVA2

MCP67MV-A2

Part Number MCP67MV-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 10+

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001247
€73.85

MCP67MV-A2

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A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i5 I53210M MD101LLA

PO000078
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i5 I5-3210M MD101LL/A

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2160842009 HD8730M

216-0842009 HD8730M

Part Number 216-0842009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1234

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001251
€67.04

216-0842009 HD8730M

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  • -20%

A1278 EMC 2554 Bios Chip EFI Firmware 820-3115 Mid2012 13 Core i7 I73520M MD102LLA

PO000079
€18.00 €22.50

A1278 EMC 2554 Bios EFI Firmware 820-3115 Mid-2012 13 Core i7 I7-3520M MD102LL/A

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N15VGMSA2

N15V-GM-S-A2

Part Number N15V-GM-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001262
€24.62

N15V-GM-S-A2

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A1425 EMC 2557 Bios Chip EFI Firmware 820-3462 Retina Late 2012 Core i7 I73520M ME116LLA

PO000081
€18.00 €22.50

A1425 EMC 2557 Bios EFI Firmware 820-3462 Retina Late 2012 Core i7 I7-3520M ME116LL/A

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FH82HM370 SR40B

FH82HM370 SR40B

Part Number SR408 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001266
€62.36

FH82HM370 SR40B

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QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
€21.33

QD-FX-350MT-N-A3

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i5 I53230M ME662LLA

PO000082
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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