216-0774007 HD5470

Part Number 216-0774007 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 17+

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH341A 24 25 Series DVD EEPROM Flash BIOS USB Programmer with Software Driver MA

Product Details:

USB Programmer

Condition: New

Special USB chip CH341A production, check speed about 2-3 mbit per minute

Support WIN 98, WINME, WIN2K, WINXP, VISTA, WIN7-32 system

Using USB port power supply

Support chip list

AMIC:

A25L05P,A25L10P,A25L20P,A25L40P,A25L80P,A25L16P

ATMEL:

AT25DF041A,AT25DF321,AT25F004,AT25F512A,AT25F2048,AT25F4096,AT25F1024A,AT25FS010,AT25FS040,AT26DF081A,

AT26DF161A,AT26DF321,AT26F004

EON:

EN25B05,EN25P05,EN25B10,EN25P10,EN25BF20,EN25P20,EN25F20,EN25B40,EN25P40,EN25F40,EN25B80,

EN25P80,EN25F80,EN25T80,EN25B16,EN25P16,EN25B32,EN25P32,EN25B64,EN25P64

Excel Semiconductor Inc.

ES25P10,ES25P20,ES25P40??ES25P80,ES25P16,ES25P32

ST:

M25P05A,M25P10A,M25P20,M25P40,M25P80,M25P16,M25P32,M25P64,M25PE10,M25PE20,M25PE40,

M25PE80,M25PE16,M25PE32,M45PE10,M45PE20,M45PE40,M45PE80,M45PE16,M45PE32

MXIC:

MX25L512,MX25L1005,MX25L2005,MX25L4005,MX25L8005,MX25L1605,MX25L3205,MX25L6405 MX25L6445,MX25L6405(SOP16)

NexFlash:

NX25P80,NX25P16,NX25P32

Chingis Technology Corporation

Pm25LV512,Pm25LV010,Pm25LV020,Pm25LV040,Pm25LV080,Pm25LV016,Pm25LV032,Pm25LV064

Saifun Semiconductors

SA25F005,SA25F010,SA25F020,SA25F040,SA25F080,SA25F160,SA25F320,

WINBOND:

W25P10,W25X10,W25Q10,W25P20,W25X20,W25Q20,W25P40,W25X40,W25Q40,W25P80,W25X80,W25Q80,

W25P16, W25X16,W25Q16,W25P32,W25X32,W25Q32,W25P64,W25X64,W25Q64

8 pin serial BIOS chips can erase, can read and write

Color is shown as pictures

PLS NOTE that due to lighting effects, monitor's brightness/ contrass settings ect, there could be some slight differences in the color tone of the pictures and the actual item!

Package Included:

1 x USB Programmer

SR405

Part Number SR405 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

215CDABKA15FG

Part Number AC82GL40 SLGGM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1139

Package/Case 500 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX1004-1 Adapter for XELTEK SuperPro 6100N

N17E-G1-A1 GTX1060

Part Number N17E-G1-A1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

G86-731-A2 8400MGS

Part Number G86-731-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1206

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

KESS V2 OBD2 Manager Tuning Kit without Token Limitation

Top 6 Reasons To Get KESS V2

1. It's Master Version

2. Software Version: V5.017 EU Version SW V2.53

3. Update by CD

4. No Token Limitation: can be used unlimitedly,no need to worry about tokens any more.

5. With Coverage of All Major Brands and Protocols including Line, CAN, EDC17 and MED17 and Ford J1850

6. Supported Languages: English, German, Spanish, Italian, Portuguese, French

Notice:

1. Please do not update this tool online, or It will get damaged

2. Please Do remember disconnect internet when you use it

Kess V2 OBD2 Connection Picture

Kess V2 Boot Connection Picture

Kess V2 has several built in features and safeguards including:

1. Check of the battery voltage in real-time

2. Full Recovery function in case of problems

3. Automatic correction of the Checksum, (where available)

4 Boot-Loader mode supported

5. Management of the programming counters

6. ScanTool function to remove DTC

7. Several options of reading/writing speed

8. Option to write full file/section of the map

9. Full integration with ECM Titanium,which means it can work with ECM Titanium perfectly

Detail vehicle model KESS V2 can do please download from this webpage.

FAQ: Frequently Asked Questions

Q: KESS V2 is master version or slave version?

A: It is master version.

Q: KEES V2 just can be installed on windows XP system?

A: KESS V2 can install it on Windows 7 and Windows XP.

Q: What is the difference Between KESS V2 and K-TAG?

A: KESS V2 has OBD function, but Ktag does not have this function.

Q: Can KESS V2 update?

A: Please don't update it, or it will damage the firmware of kess v2, you just can ship back to us for repair.

Q: What is the difference Between KESS V2 and Fgtech V53?

A: They both can do many cars, but they do cars via different ways. Fgtech V53 has BDM function, but KESS V2 does not have. Kess V2 has Anti-mediation lock module, it can do new and encrypted cars better than Fgtech V53.

Q: Customer told us that KESS V2 can not do EDC17 well, such as Bosch EDC 17 (cp04-CP14-CAN-Med17.X ) and Bosch Bosch EDC 17 C54( Passat, Golf,Crafter,Oct?via,Yeti-VW). EDC16 all ok.

A: Yes, Kess V2 can not do EDC17 at present. It can do EDC16 well, but when you do it, you need to connect the Anti-mediation lock module to read and write data for vehicles. Becuase new style vihicles have new encrypted ways.

Q: How to do checksum for kess v2? Does the kess v2 automatically re-write it? Kess V2 can do trucks? such as Mercedes MP1/MP2/MP3 or MAN TGA?

A: After reading the software, the device will automatically do checksums. KESS V2 can not do truks, it will damage the firmware of kess v2. But KTAG can do trucks.

Q: If you encountered the problem for checksum error when reading the ecu? how to solve it?

A: One of our customer tested by this way: please search the software " microsoft visual C++ 2005,2008,2010" on google, then install it on your computer, then it can solve this problem.

Product Description

Package includes: 1PCS X TSOP48-DIP48 Socket (TSOP-48-0.5-OTS04B)

TSOP48-DIP48 adapter will work on all programmers

Type: 18.4 Width 0.5 Pitch

Stock: in stock

Condition: NEW

G92-751-B1

Part Number G92-751-B1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Limit frame specification: 11*9mm

AM5000IBJ44HM A4-5000

Part Number AM5000IBJ44HM Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1303

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock