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PS30A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 65

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH002322
€179.02

PS-30A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 6.5

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G98730U2 9200MGS

G98-730-U2 9200MGS

Part Number G98-730-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1031

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002323
€15.72

G98-730-U2 9200MGS

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2150807018 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002324
€5.40

215-0807018 Stencil Template

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RICHTEK RT8152E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002325
€3.45

RICHTEK RT8152E

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45W Magsafe2 Power Adapter for Apple MacBook Air 11 13A1374 A1369 A1466

Description:

Input: AC 100-240V, 50-60Hz

Output: 14.85V 3.05A

Power: 45W

Connecter size: Magsafe "T "TIP 5 PIN

Condition: Brand New Replacement AC Adapter

Note: Brand New Replacement Product, works as genuine parts, 100% Compatible!!

Compatible Part Number:

A1435, A1465, A1436, A1466, MD223, MD224, MD231, MD232,MD592

Compatible Models:

MacBookAir5,1 Mid 2012: MD223LL/A (1.7 GHz Core i5)

MacBookAir5,1 Mid 2012: MD224LL/A (1.7 GHz Core i5)

MacBookAir5,1 Mid 2012: MD224LL/A (2.0 GHz Core i7)

MacBookAir6,1 Mid 2013: MD711LL/A (1.3 GHz Core i5)

MacBookAir6,1 Mid 2013: MD712LL/A (1.3 GHz Core i5)

MacBookAir6,1 Mid 2013: MD712LL/A (1.7 GHz Core i7)

MacBookAir6,1 Early 2014: MD711LL/B (1.4 GHz Core i5)

MacBookAir6,1 Early 2014: MD712LL/B (1.4 GHz Core i5)

MacBookAir6,1 Early 2014: MD712LL/B (1.7 GHz Core i7)

MacBookAir7,1 Early 2015: MJVM2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,1 Early 2015: MJVP2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBook Air 13" A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Mid 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Mid 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Mid 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBook Air MD592LL/A (Newest Version)

MacBook Air (11-inch, Early 2015)

MacBook Air (13-inch, Early 2015)

MacBook Air (11-inch, Early 2014)

MacBook Air (13-inch, Early 2014)

MacBook Air (11-inch, Mid 2013)

MacBook Air (13-inch, Mid 2013)

MacBook Air (11-inch, Mid 2012)

MacBook Air (13-inch, Mid 2012)

CH002326
€32.95

45W Magsafe2 Power Adapter for Apple MacBook Air 11 13A1374 A1369 A1466

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i5520E SLBXK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002328
€5.40

i5-520E SLBXK Stencil Template

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Compare
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N13MGEBA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002329
€5.40

N13M-GE-B-A3 Stencil Template

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Maxim MAX17015A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002331
€3.45

Maxim MAX17015A

wishlist
Compare
Quickview

BD82HM67 SLJ4N Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002332
€5.40

BD82HM67 SLJ4N Stencil Template

PS30A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 65

Login to Download: * Manual Download

Product Description

The ultrasonic cleaner is a microprocessor-controlled device that uses ultrasonic or high frequency sound waves to clean jewelry and other delicate items. Ultrasonic cleaning is based on the cavitation effect caused by high frequency ultrasonic wave vibration signals in fluid. Microscopic bubbles that expand and rapidly collapse cause cavitation, which creates an effective cleaning action on the surface of object being cleaned. Additionally, the bubbles are small enough to penetrate even microscopic crevices, cleaning them thoroughly and consistently.

High efficiency saves cleaning solvent, thermal energy, work place and labor!

Six sets of built-in powerful transducers can strengthen the ultrasonic power and make superior cleaning outcome. It is utilization of digital program in ultrasonic cleaner to control the unit, according to the quantity and condition of the items to be cleaned to choose a working cycle time. As a result, it is more convenient and efficient than hand wash, steam cleaners, high pressure water jet cleaning or other machines.

Advanced Brushed Stainless Steel Cleaning Tank to avoid corrosion water stain and keep the tank looking always new.

(In comparison, the common stainless steel cleaning tanks will be dirty yellow corrosion water stain on the surface after a long time of using, and it's hard to be removed.)

Application

Professional Use:

Medical and Dental Clinics, Tattoo Shops, Scientific Labs and Golf Clubs.

Jewelers, Opticians, Watchmakers, Antique Dealers and Electronics Workshops etc.

Personal or Home Use:

Jewelry: Earrings, Necklace, Rings, Bracelets and Diamonds.

Glasses and Timepieces: Glasses, Sunglasses, Optical Lenses, Contact Lens Accessories, Watch Chains and Waterproof Watches.

Commodities: Tattoo Guns and Tubes, Electric Shaver Heads, Razor Blades, Dentures, Combs and Toothbrushes.

Stationery: Pen-heads, Printer-heads, Inkjet Cartridges and Seals.

Metal Articles: Ancient Coins, Badges, Valves, Machine Nozzles, Electronics Components and Mechanical Parts.

Metal Dishware: Forks, Knives, Spoons and Other Small Silverwares etc.

CH002322
€179.02

PS-30A Digital Ultrasonic Cleaner Stainless Steel Heater Timer Industrial Grade 6.5

wishlist
Compare

G98730U2 9200MGS

G98-730-U2 9200MGS

Part Number G98-730-U2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1031

Package/Case 360 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002323
€15.72

G98-730-U2 9200MGS

wishlist
Compare

2150807018 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002324
€5.40

215-0807018 Stencil Template

wishlist
Compare

RICHTEK RT8152E

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002325
€3.45

RICHTEK RT8152E

wishlist
Compare

45W Magsafe2 Power Adapter for Apple MacBook Air 11 13A1374 A1369 A1466

Description:

Input: AC 100-240V, 50-60Hz

Output: 14.85V 3.05A

Power: 45W

Connecter size: Magsafe "T "TIP 5 PIN

Condition: Brand New Replacement AC Adapter

Note: Brand New Replacement Product, works as genuine parts, 100% Compatible!!

Compatible Part Number:

A1435, A1465, A1436, A1466, MD223, MD224, MD231, MD232,MD592

Compatible Models:

MacBookAir5,1 Mid 2012: MD223LL/A (1.7 GHz Core i5)

MacBookAir5,1 Mid 2012: MD224LL/A (1.7 GHz Core i5)

MacBookAir5,1 Mid 2012: MD224LL/A (2.0 GHz Core i7)

MacBookAir6,1 Mid 2013: MD711LL/A (1.3 GHz Core i5)

MacBookAir6,1 Mid 2013: MD712LL/A (1.3 GHz Core i5)

MacBookAir6,1 Mid 2013: MD712LL/A (1.7 GHz Core i7)

MacBookAir6,1 Early 2014: MD711LL/B (1.4 GHz Core i5)

MacBookAir6,1 Early 2014: MD712LL/B (1.4 GHz Core i5)

MacBookAir6,1 Early 2014: MD712LL/B (1.7 GHz Core i7)

MacBookAir7,1 Early 2015: MJVM2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,1 Early 2015: MJVP2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBook Air 13" A1466

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD231LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (1.8 GHz Core i5)

MacBookAir5,2 Mid 2012: MD232LL/A (2.0 GHz Core i7)

MacBookAir6,2 Mid 2013: MD760LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.3 GHz Core i5)

MacBookAir6,2 Mid 2013: MD761LL/A (1.7 GHz Core i7)

MacBookAir6,2 Mid 2014: MD760LL/B (1.4 GHz Core i5)

MacBookAir6,2 Mid 2014: MD761LL/B (1.4 GHz Core i5)

MacBookAir6,2 Mid 2014: MD761LL/B (1.7 GHz Core i7)

MacBookAir7,2 Early 2015: MJVE2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBookAir7,2 Early 2015: MJVG2LL/A (1.6 GHz Core i5 or 2.2 GHz Core i7)

MacBook Air MD592LL/A (Newest Version)

MacBook Air (11-inch, Early 2015)

MacBook Air (13-inch, Early 2015)

MacBook Air (11-inch, Early 2014)

MacBook Air (13-inch, Early 2014)

MacBook Air (11-inch, Mid 2013)

MacBook Air (13-inch, Mid 2013)

MacBook Air (11-inch, Mid 2012)

MacBook Air (13-inch, Mid 2012)

CH002326
€32.95

45W Magsafe2 Power Adapter for Apple MacBook Air 11 13A1374 A1369 A1466

wishlist
Compare

i5520E SLBXK Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002328
€5.40

i5-520E SLBXK Stencil Template

wishlist
Compare

N13MGEBA3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002329
€5.40

N13M-GE-B-A3 Stencil Template

wishlist
Compare

Maxim MAX17015A

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002331
€3.45

Maxim MAX17015A

wishlist
Compare

BD82HM67 SLJ4N Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002332
€5.40

BD82HM67 SLJ4N Stencil Template

wishlist
Compare
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