• Show Sidebar

There are 5250 products.

Active filters

LCD Screen Adhesive Strip Sticker Tape 2012 2013 201415 Apple iMac A1418 215

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

CH002334
€6.09

LCD Screen Adhesive Strip Sticker Tape 2012 2013 2014-15 Apple iMac A1418 21.5

Intersil ISL6534CR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002335
€3.45

Intersil ISL6534CR

NH820801GBM SL8YB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002337
€5.40

NH820801GBM SL8YB Stencil Template

SILEGO SLG8SP626V

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002338
€3.45

SILEGO SLG8SP626V

TI BQ20869

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002339
€5.56

TI BQ20869

G86613A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002340
€5.40

G86-613-A2 Stencil Template

TI TPS51123

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002342
€3.45

TI TPS51123

Intersil ISL95870B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002343
€3.45

Intersil ISL95870B

G86603A2 8400MGS

G86-603-A2 8400MGS

Part Number G86-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002344
€16.08

G86-603-A2 8400MGS

LCD Screen Adhesive Strip Sticker Tape 2012 2013 201415 Apple iMac A1418 215

This high quality LCD screen adhesive strip sticker tape is perfect adhesive for iMac A1418 21.5 recommended to use when opening or repairing the screen.

Removing the display requires cutting through the adhesive around the perimeter of the screen. After the adhesive is cut, it cannot be used to re-seal the display in place, so you'll need to apply a new set of adhesive strips.

These adhesive stickers are designed for A1418 and will NOT work for A1419.

Compatible with:

? iMac 21.5 A1418

? iMac13,1 Late 2012: MD093LL/A (2.7 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (2.9 GHz Core i5)

? iMac13,1 Late 2012: MD094LL/A (3.1 GHz Core i7)

? iMac13,1 Early 2013: ME699LL/A (3.3 GHz Core i3)

? iMac14,3 Late 2013: ME086LL/A (2.7 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (2.9 GHz Core i5)

? iMac14,3 Late 2013: ME087LL/A (3.1 GHz Core i7)

? iMac14,4 Mid 2014: MF883LL/A (1.4 GHz Core i5)

? iMac16,1 Late 2015: MK142LL/A (1.6 GHz Core i5)

? iMac16,2 Late 2015: MK442LL/A (2.8 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.1 GHz Core i5)

? iMac16,2 Retina 4K Late 2015: MK542LL/A (3.3 GHz Core i7)

Includes:

1 x Set of Adhesive Strips

Important Note:

Opening your Device will void your Warranty; BisLinks cannot be held responsible for any damage occurred during your repair process. Please feel free to contact us for further information.

CH002334
€6.09

LCD Screen Adhesive Strip Sticker Tape 2012 2013 2014-15 Apple iMac A1418 21.5

Intersil ISL6534CR

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002335
€3.45

Intersil ISL6534CR

NH820801GBM SL8YB Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002337
€5.40

NH820801GBM SL8YB Stencil Template

SILEGO SLG8SP626V

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002338
€3.45

SILEGO SLG8SP626V

TI BQ20869

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002339
€5.56

TI BQ20869

G86613A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002340
€5.40

G86-613-A2 Stencil Template

TI TPS51123

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002342
€3.45

TI TPS51123

Intersil ISL95870B

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002343
€3.45

Intersil ISL95870B

G86603A2 8400MGS

G86-603-A2 8400MGS

Part Number G86-603-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1245

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002344
€16.08

G86-603-A2 8400MGS