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DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

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GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

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DC Power Jack Part PJ085

Alienware M14x Series DC Power Jack Connector: M14x

Alienware M17x Series DC Power Jack Connector: M17x R1, M17x R2

Alienware M18x Series DC Power Jack Connector: M18x

Dell Precision Mobile WorkStation M4700 DC Power Jack Connector: M4700

Dell Precision Mobile WorkStation M6400 DC Power Jack Connector: M6400

Dell Precision Mobile WorkStation M6500 DC Power Jack Connector: M6500

Dell Precision Mobile WorkStation M6600 DC Power Jack Connector: M6600

Dell Precision Mobile WorkStation M6700 DC Power Jack Connector: M6700

CH002412
€7.27

DC Power Jack, Part #PJ085

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2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

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N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

DC Power Jack Part PJ061

Asus EEE PC 1001 Series DC Power Jack Connector: 1001HA, 1001HAG, 1001HT, 1001P, 1001PD, 1001PG, 1001PQ, 1001PQD, 1001PX. 1001PXB, 1001PXD

Asus EEE PC 1002 Series DC Power Jack Connector: 1002H, 1002HA, 1002HAE, 1002SA

Asus EEE PC 1003 Series DC Power Jack Connector: 1003H, 1003HA, 1003HAG

Asus EEE PC 1004 Series DC Power Jack Connector: 1004DN

Asus EEE PC 1005 Series DC Power Jack Connector: 1005, 1005HA, 1005HA_GG, 1005HAB, 1005HAG, 1005HE, 1005HR, 1005P, 1005PE, 1005PEG, 1005PG, 1005PR, 1005PX, 1005PXD

Asus EEE PC 1008 Series DC Power Jack Connector: 1008HA, 1008HAG, 1008P, 1008PB, 1008PGO

Asus EEE PC 1015 Series DC Power Jack Connector: 1015, 1015P, 1015PD, 1015PDG, 1015PDT, 1015PE, 1015PEB, 1015PED, 1015PEG, 1015PEM, 1015PN, 1015T

Asus EEE PC 1101 Series DC Power Jack Connector: 1101, 1101HA, 1101HA_GG, 1101HAB, 1101HAG

Asus EEE PC 1201 Series DC Power Jack Connector: 1201HA, 1201HAB, 1201HAG, 1201K, 1201N, 1201NB, 1201NE, 1201NL, 1201PN, 1201PNG, 1201T, 1201X

Asus EEE PC 1215 Series DC Power Jack Connector: 1215N, 1215P, 1215T

CH002382
€7.21

DC Power Jack, Part #PJ061

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N3450 SR2Z6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000488
€7.71

N3450 SR2Z6 Stencil Template

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Compare

GF100375A3 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000494
€5.59

GF100-375-A3 Stencil Template

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GM107400A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000498
€5.40

GM107-400-A2 Stencil Template

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2150669065 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000501
€5.40

215-0669065 Stencil Template

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Compare

DC Power Jack Part PJ085

Alienware M14x Series DC Power Jack Connector: M14x

Alienware M17x Series DC Power Jack Connector: M17x R1, M17x R2

Alienware M18x Series DC Power Jack Connector: M18x

Dell Precision Mobile WorkStation M4700 DC Power Jack Connector: M4700

Dell Precision Mobile WorkStation M6400 DC Power Jack Connector: M6400

Dell Precision Mobile WorkStation M6500 DC Power Jack Connector: M6500

Dell Precision Mobile WorkStation M6600 DC Power Jack Connector: M6600

Dell Precision Mobile WorkStation M6700 DC Power Jack Connector: M6700

CH002412
€7.27

DC Power Jack, Part #PJ085

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2160810084 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000507
€5.40

216-0810084 Stencil Template

wishlist
Compare

N11PGEA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000509
€5.40

N11P-GE-A1 Stencil Template

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Compare
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