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XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

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2160772034 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000437
€9.97

216-0772034 Stencil Template 90*90

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FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

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TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

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OBDSTAR RT100 Remote Tester FrequencyInfrared

OBDSTAR RT100 Remote Tester Frequency/Infrared

OBDSTAR RT100 Remote Tester Frequency Infrared (IR) can detect frequency of car remote control as well as the infrared is working or not, which helps a lot in key programming and car maintenance.

OBDSTAR RT100 Features:

1. Portable Design

2. Easy Operation

3. Screen Display

4. Reliable Data

OBDSTAR RT100 Frequency Test Range:

300Mhz-320Mhz

434Mhz

868Mhz

Way to Test Frequency:

1. Power on the device

2. Put the remote control close to the device

3. Press any button on the remote control

4. The lit indicator shows the frequency

Way to Test Infrared Working or not:

The infrared works well if the indicator lits up after pressing the key button,otherwise,it is in malfunction

Package includes:

1pc x OBDSTAR RT100 Remote Tester Frequency/Infrared

CH001126
€49.48

OBDSTAR RT100 Remote Tester Frequency/Infrared

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i72677M SR0D2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
€5.40

i7-2677M SR0D2 Stencil Template

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BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

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Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

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iphone5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000445
€5.72

iphone5 Stencil Template

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD CMod XC2C64A D

Login to Download: * User manual

Feature:

1. Support all Xilinx devices:

All Virtex FPGA families;

All Spartan FPGA families;

XC9500/XC9500XL/XC9500XV CPLDs;

CoolRunner XPLA3/CoolRunner-II CPLDs;

XC18V00 IPS Proms;

XCF00S/XCF00P Platform Flash PROMS;

XC4000 series FPGAs.

2. Supported on Windows and Red Hat Enterprise Linux.

3. Work with impact,chipscope pro and microblaze embedded processer debugging.

4. Support target system using 5.0V TTL,3.3V LVTTL/LVCMOS,2.5V,1.8V,1.5V.

5. Apply to Xilinx CPLD/FPGA chips download debugging.

6. Support JTAG,Slave Serial,SPI download mode,can configure all Xilinx devices.

7. Xilinx Platform with USB Cable fully compatible.

8. Target device to download the clock options,up to 24MHz.

9. Support Impact and ChipScope.

10. Firmware can be updated automatically.

Package included:

1 x Xilinx Platform Cable USB

1 x 10-pin 2.54mm pitch 15cm flat cable

1 x 14-pin 2.0mm pitch 15cm flat cable

1 x 14-pin 2.54mm pitch 15cm flat cable

1 x 7-pin fly duppont cables

1 x Adapter plate

1 x 6-pin cable

1 x USB Cable

CH001109
€24.74

XILINX Platform USB Download Cable Jtag Programmer for FPGA CPLD C-Mod XC2C64A D

wishlist
Compare

2160772034 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000437
€9.97

216-0772034 Stencil Template 90*90

wishlist
Compare

FUJITSU MB39A404

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000474
€6.35

FUJITSU MB39A404

wishlist
Compare

TI TPS720105_son

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000476
€3.45

TI TPS720105_son

wishlist
Compare

OBDSTAR RT100 Remote Tester FrequencyInfrared

OBDSTAR RT100 Remote Tester Frequency/Infrared

OBDSTAR RT100 Remote Tester Frequency Infrared (IR) can detect frequency of car remote control as well as the infrared is working or not, which helps a lot in key programming and car maintenance.

OBDSTAR RT100 Features:

1. Portable Design

2. Easy Operation

3. Screen Display

4. Reliable Data

OBDSTAR RT100 Frequency Test Range:

300Mhz-320Mhz

434Mhz

868Mhz

Way to Test Frequency:

1. Power on the device

2. Put the remote control close to the device

3. Press any button on the remote control

4. The lit indicator shows the frequency

Way to Test Infrared Working or not:

The infrared works well if the indicator lits up after pressing the key button,otherwise,it is in malfunction

Package includes:

1pc x OBDSTAR RT100 Remote Tester Frequency/Infrared

CH001126
€49.48

OBDSTAR RT100 Remote Tester Frequency/Infrared

wishlist
Compare

i72677M SR0D2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000440
€5.40

i7-2677M SR0D2 Stencil Template

wishlist
Compare

BROADCOM BCM5784MKMLG

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000477
€3.45

BROADCOM BCM5784MKMLG

wishlist
Compare

Intersil ISL6532

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000478
€3.45

Intersil ISL6532

wishlist
Compare

iphone5 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000445
€5.72

iphone5 Stencil Template

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Compare
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