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  • Categories: CPU and Graphic Chips
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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
€24.62

G73-VZA-N-A2

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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N13PGSWKBA2

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001291
€46.77

N13P-GS-W-KB-A2

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2160841009 HD8690M

216-0841009 HD8690M

Part Number 216-0841009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+ 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001294
€24.03

216-0841009 HD8690M

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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2160674008

216-0674008

Part Number 216-0674008 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001295
€27.51

216-0674008

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000087
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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N10PGV2C1

N10P-GV2-C1

Part Number N10P-GV2-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001310
€25.93

N10P-GV2-C1

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

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2160835063

216-0835063

Part Number 216-0835063 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001312
€60.95

216-0835063

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BD82HM76 SLJ8E

BD82HM76 SLJ8E

Part Number BD82HM76 SLJ8E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1324

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001326
€45.95

BD82HM76 SLJ8E

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3190 Retina Early 2013 Core i7 I73540M BTOCTO

PO000083
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3190 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
€24.62

G73-VZA-N-A2

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000084
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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N13PGSWKBA2

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001291
€46.77

N13P-GS-W-KB-A2

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2160841009 HD8690M

216-0841009 HD8690M

Part Number 216-0841009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+ 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001294
€24.03

216-0841009 HD8690M

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i5 I53230M ME662LLA

PO000086
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i5 I5-3230M ME662LL/A

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2160674008

216-0674008

Part Number 216-0674008 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 07+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001295
€27.51

216-0674008

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A1425 EMC 2672 Bios Chip EFI Firmware 820-3462 Retina Early 2013 Core i7 I73540M BTOCTO

PO000087
€18.00 €22.50

A1425 EMC 2672 Bios EFI Firmware 820-3462 Retina Early 2013 Core i7 I7-3540M BTO/CTO

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N10PGV2C1

N10P-GV2-C1

Part Number N10P-GV2-C1 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 2011

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001310
€25.93

N10P-GV2-C1

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A1502 EMC 2678 Bios Chip EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I54258U ME864LLA

PO000088
€18.00 €22.50

A1502 EMC 2678 Bios EFI Firmware 820-3536 Retina Late 2013 13 Core i5 I5-4258U ME864LL/A

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2160835063

216-0835063

Part Number 216-0835063 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Bulk new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001312
€60.95

216-0835063

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Compare

BD82HM76 SLJ8E

BD82HM76 SLJ8E

Part Number BD82HM76 SLJ8E Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 1324

Package/Case 240 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001326
€45.95

BD82HM76 SLJ8E

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