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N16EGXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000557
€9.97

N16E-GX-A1 Stencil Template 90*90

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BD82NM70 ALJTA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000567
€5.40

BD82NM70 ALJTA Stencil Template

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IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001543
€2.70

IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

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21508390x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000577
€9.97

215-0839097 Stencil Template 90*90

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Lattice USB download line FPGA CPLD ISP download simulation HWUSBN2A

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

CH001589
€21.01

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

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GFGO7600HNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000578
€5.40

GF-GO7600-H-N-A2 Stencil Template

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N13PGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000588
€5.40

N13P-GT-W-A2 Stencil Template

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GM204650KDA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000597
€7.46

GM204-650-KD-A1 Stencil Template

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Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software

CH001659
€128.05

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

N16EGXA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000557
€9.97

N16E-GX-A1 Stencil Template 90*90

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Compare

BD82NM70 ALJTA Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000567
€5.40

BD82NM70 ALJTA Stencil Template

wishlist
Compare

IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001543
€2.70

IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

wishlist
Compare

21508390x9090

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000577
€9.97

215-0839097 Stencil Template 90*90

wishlist
Compare

Lattice USB download line FPGA CPLD ISP download simulation HWUSBN2A

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

CH001589
€21.01

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

wishlist
Compare

GFGO7600HNA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000578
€5.40

GF-GO7600-H-N-A2 Stencil Template

wishlist
Compare

N13PGTWA2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000588
€5.40

N13P-GT-W-A2 Stencil Template

wishlist
Compare

GM204650KDA1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000597
€7.46

GM204-650-KD-A1 Stencil Template

wishlist
Compare

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software

CH001659
€128.05

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

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Compare
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