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RENESAS EZCUBE development tool artificial device rl78 r8c3x lx 78k0r 78k 0 v850jx3

Login to Download: »» Download Renesas emulator software «

Product Description

EZ-CUBE chip debugging emulator

EZ-CUBE is the chip debugging emulator, with flash memory programming function. Can be used for debugging programs or burn the program into theinternal flash micro controller.

- chip debugging

To debug is connected to the microcontroller target board.

- flash programmer

The program can be written to the built-in flash memory controller.

USB connection

Connecting to host through USB port 2.

The use of USB power supply operation. No additional power supply.

Supports a large number of products

EZ-CUBE can support Renesas Electronics 8 bit to 32 bit internal flash microcontroller.

78K0 micro controller

78K0R micro controller

RL78 micro controller

R8C micro controller

V850 micro controller

CH001516
€85.00

RENESAS EZ-CUBE development tool artificial device rl78 r8c3x lx 78k0r 78k 0 v850jx3
»» Download Renesas emulator software «

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2160842009 HD8730M

216-0842009 HD8730M

Part Number 216-0842009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1234

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001251
€67.04

216-0842009 HD8730M

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IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001543
€2.70

IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

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N15VGMSA2

N15V-GM-S-A2

Part Number N15V-GM-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001262
€24.62

N15V-GM-S-A2

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FH82HM370 SR40B

FH82HM370 SR40B

Part Number SR408 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001266
€62.36

FH82HM370 SR40B

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Lattice USB download line FPGA CPLD ISP download simulation HWUSBN2A

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

CH001589
€21.01

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

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QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
€21.33

QD-FX-350MT-N-A3

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G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
€24.62

G73-VZA-N-A2

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N13PGSWKBA2

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001291
€46.77

N13P-GS-W-KB-A2

RENESAS EZCUBE development tool artificial device rl78 r8c3x lx 78k0r 78k 0 v850jx3

Login to Download: »» Download Renesas emulator software «

Product Description

EZ-CUBE chip debugging emulator

EZ-CUBE is the chip debugging emulator, with flash memory programming function. Can be used for debugging programs or burn the program into theinternal flash micro controller.

- chip debugging

To debug is connected to the microcontroller target board.

- flash programmer

The program can be written to the built-in flash memory controller.

USB connection

Connecting to host through USB port 2.

The use of USB power supply operation. No additional power supply.

Supports a large number of products

EZ-CUBE can support Renesas Electronics 8 bit to 32 bit internal flash microcontroller.

78K0 micro controller

78K0R micro controller

RL78 micro controller

R8C micro controller

V850 micro controller

CH001516
€85.00

RENESAS EZ-CUBE development tool artificial device rl78 r8c3x lx 78k0r 78k 0 v850jx3
»» Download Renesas emulator software «

wishlist
Compare

2160842009 HD8730M

216-0842009 HD8730M

Part Number 216-0842009 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 1234

Package/Case 360 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001251
€67.04

216-0842009 HD8730M

wishlist
Compare

IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001543
€2.70

IC Chip Extractor Rework Station Hot Motherboard Circuit Board Component Puller Tweezer Tool for Welding Solder Soldering Iron

wishlist
Compare

N15VGMSA2

N15V-GM-S-A2

Part Number N15V-GM-S-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001262
€24.62

N15V-GM-S-A2

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Compare

FH82HM370 SR40B

FH82HM370 SR40B

Part Number SR408 Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001266
€62.36

FH82HM370 SR40B

wishlist
Compare

Lattice USB download line FPGA CPLD ISP download simulation HWUSBN2A

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

Login to Download: Download software

Features:

1. Using Lattice original design, to ensure the use of stable and reliable;

2. Support wide target voltage 1.2V- 5V;

3.USB power supply, no external power supply alone;

4. Supports all LATTICE development environments (LSC ISPVM, LATTICE DEMIOND, LATTICE ISPEVER, and LATTICE PROGRAMMER);

Supports a full range of Lattice FPGAs such as SC (M) / XP / XP2 / ECP2 (M) / ECP3 / ECP5 (G) / MachXO / MachXO2 / MachXO3 / ICE40 series;

6. Support Lattice full range of CPLDs, such as 1000/2000/4000 / ispMACH series;

7. Support JTAG, internal FLASH, SPI FLASH programming mode;

8. No need to install a separate driver, direct support for Diamond / ispLever6.x / 7.x / classic / ispVM various versions of drivers;

9. Has a current-limit input, ESD protection measures to ensure that the download line is complete;

10. Using Lattice official 2 * 5Pin pitch 2.54mm JTAG interface;

11. Support operating system Win2000 / XP, Windows7 / 8/10, Linux and so on

Download Wire Pin Description:

1.SCLK / TCK: connect with chip's SCLK / TCK pin;

2.GND: Downloader and the target board of the public, its internal 2,4-pin connection, in use, need to be a 2,4 feet connected to the target board;

3.MODE / TMS: with the chip's MODE / TMS pin connection;

4.GND: Downloader and the target board of the public, the internal 2,4-pin connection, in the need to use these two in a 2,4 feet connected to the target board;

5. SDI / TDI: SDI / TDI pin connection with the chip;

6.VCC: Used to detect whether the target board connected to the downloader is powered on or not used to power the target board. The official downloader does not have the ability to supply power to the target board. This needs attention;

7.SDO / TDO: SDO / TDO pin connection with the chip;

8.INTI: need to connect INTI pins when downloading and debugging some chips, not every chip needs to be connected;

9.TRST: In some chip download debugging need to connect TRST pin, not every chip needs to connect;

10.ispEN / Enable / PROG: It is necessary to connect the ispEN / Enable / PROG pins when downloading and debugging some chips, and not every chip needs to be connected.

Shipping list:

1.Lattice USB download cable (1)

2.USB 2.0 data cable (1)

3.10P 2.54MM spacing of the cable (1)

4.10P high-quality lattice special fly line (1)

5.2.54mm pitch 2X5 turn 8P standard definition line (1)

CH001589
€21.01

Lattice USB download line FPGA CPLD ISP download simulation HW-USBN-2A

wishlist
Compare

QDFX350MTNA3

QD-FX-350MT-N-A3

Part Number QD-FX-350MT-N-A3 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 0952

Package/Case 600 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001277
€21.33

QD-FX-350MT-N-A3

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Compare

G73VZANA2

G73-VZA-N-A2

Part Number G73-VZA-N-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 1018

Package/Case 240 Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001286
€24.62

G73-VZA-N-A2

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Compare

N13PGSWKBA2

N13P-GS-W-KB-A2

Part Number N13P-GS-W-KB-A2 Manufacturer NVIDIA

BGA Alloy No Pb/Lead Free Date Code 12+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH001291
€46.77

N13P-GS-W-KB-A2

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Compare
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