Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

SMD muRata GRM31 series: * SMD muRata GRM31 series

1206 SMD capacitors

Japanese muRata (Murata) GRM31 series

80 models, 25 for each, 2000 in total. Products list:

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel

Gauge Evaluator

Login to Download: * EV2300a Device Driver Installer Multilanguage

Model No: EV2300 HPA002

Included:

1 x Texas Instruments EV2300 HPA002 NEW USB Interface Battery Fuel Gauge Evaluator

Description:

The EV2300 is a USB-based interface board for a PC that can be used to evaluate battery fuel gauge circuits designed with Texas Instruments' ICs. The EV2300 has connections on it for a USB cable and also accepts inputs from a battery fuel gauge circuit's communication port (SMBus or HDQ). By running the appropriate PC software for the correspondingfuel gauge IC, the EV2300 interface board allows the user to evaluate the battery fuel gauge circuit. Note: The driver on this page is for 32 bit Windows. See the 64 bit driver e2e post for 64 bit Windows 7 driver information.

Feature:

USB-based interface board for evaluation of battery fuel gauge circuits developed with fuel gauge ICs using the HDQ and SMBus communication protocol

Provides interface between intelligent battery circuit and a Windows-based PC

Connects to the USB port of a PC

Allows for on screen display and programming of gas gauge register functions when used with the appropriate PC software

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

DX3003 Adapter for XELTEK SuperPro 6100N

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Description:

LA1010 is a logic analyzer product with high cost performance. It has 16 input channels and the sample rate is up to 100MHz.

Along with the PC software KingstVIS, 16 channels of digital signal could be sampled at the same time, and then they could be

converted to digital waveform and displayed on the PC screen. The signal could be analyzed with many standard protocols,

to get more straightforward communication data. It helps a lot in testing and analyzing digital system(MCU/ARM/FPGA, etc.),

developing and debugging several communication programs, or monitoring and recording some digital signals for a long time.

Software and user manual: http://www.kingst.org/download/?fl=vis.zip

Features:

Portable and lightweight

Max sampling rate: 100M@3channels, 50M@6channels, 32M@9channels, 16M@16channels

Large sampling depth and support compression

The built-in PWM generator

Compatible USB2.0/3.0 interface

Powerful software and easy to use

Support online upgrade automatically

Specifications:

Input channels number: 16

Max sampling rate: 100M

Measurement bandwidth: 20M

Min pulse width can be captured: 20ns

Max sampling depth: 10G/channel

Input voltage range: -50V ~ +50V

Input impedance: 220KO, 12pF

Adjustable threshold voltage: -4V ~ +4V, step: 0.01V

PWM channels number: 2

PWM frequency range: 0.1 ~ 10MHz

PWM frequency adjust step: 10ns

PWM pulse width adjust step: 10ns

PWM output voltage: +3.3V

PWM output impedance: 50O

Standby current: 100mA

Max operating current: 150mA

Dimensions: 95mm * 55mm * 23mm

Supported OS: Windows XP, Vista, Windows 7/8/10(32/64bit)

Supported standard protocols: UART/RS-232/485, I2C, SPI, CAN, DMX512, HDMI CEC, I2S/PCM, JTAG,

LIN, Manchester, Modbus, 1-Wire, UNI/O, SDIO, SMBus, USB1.1, PS/2, NEC InfraRed, Parallel, etc...

Package included:

1 x LA1010 Host

2 x 9P Flat Cable

1 x 2P Flat Cable

20 x Test Hook

1 x USB Cable

1 x CD

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

Product use:

The universal programming block and universal test stand are used to write and test the IC chip of QFN32

Applicable package:

MLF32/QFN32, pin spacing 0.5mm; support chip at the bottom of the package with pin function

Test Adapters:

QFN-32 (40) BT-0.5-02

Characteristic:

Draw all PIN from both sides; compatible with 2.54mm universal board; use special long head to support wire or insert user board; test seat belt center pin

Product description:

Pin spacing e (mm): 0.5

Pin: 32

D*E(mm): 5*5

A(mm): 1