• Show Sidebar

There are 5250 products.

Active filters

NIKOS P1403EV8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002456
€3.45

NIKOS P1403EV8

Maxim MAX8770GTL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002457
€3.45

Maxim MAX8770GTL

SR1W2 N3530

SR1W2 N3530

Part Number SR1W2 N3530 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Original new

SR1W2 N3530 FH8065301728501 Intel Pentium CPU BGA1170 2.16 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002458
€57.44

SR1W2 N3530

ITE IT8502E KXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002459
€3.45

ITE IT8502E (KXA)

2150798006

215-0798006

Part Number 215-0798006 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002460
€95.78

215-0798006

i54210H SR1Q0 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002461
€8.70

i5-4210H SR1Q0 Stencil Template

SIS M661GX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002462
€10.33

SIS M661GX

2150910052 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002463
€17.23

215-0910052 Stencil Template 90*90

TNM5000 USB fast ISP EEPROM universal Programmer TSOP48 TSOP56 adapter set IC socket

TNM5000 Universal Programmer Introduction

Login to Download: * Programmer latest Software

User Manual Device List Nand Software Utility Software for RS232 & USB Bl a ster Emulation

? 23000 Supported Devices Flash Memory (Parallel / Nand /Serial) , EPROM , EEPROM , Serial EEPROM , Microcontroller , NVRAM , FRAM , CPLD , PLD , FPGA).

? 48-Pins ZIF Socket with Pin Continuity tester & 10-Pins ISP/JTAG Connector.

? USB 2.0 High Speed ,Program 1 Gbit Nand Flash less than 50 sec , Reading Serial Flash memory with 6 Mbit/Sec Speed.

? Auto detection of all flash Memories/Microcontrollers with Device ID.

? User friendly software for Windows XP/VISTA/7/8 (32,64 bits).

? Multiple Programming is possible by attaching 2 or more Programmers to one PC.

? Very low cost Main Unit & Low cost adaptors.

? Special Abilities like, Altera US,B-B.l*a*s.ter Emulation for Quartus Software, Serial Port Emulation , Vehicle ECU , Immoblizer & Dashboard microcontroller Support.

Parallel Flash Memories: up to 56 pins parallel flash memories are supported by TNM5000. it Supports different kind of packages (PLCC , TSOP1 , TSOP2 ,VSOP & ...).

All Flashes can be automatically detected by software in case of unreadable device names. By using a single adaptor for all 32-48 pins TSOP flashes , user only need 1 adaptor for over 2000 flash chips.

Nand Flash Memories: TNM5000 has an additional Nand+ software , specially designed for Nand flash memories. Nand+ Software has one of the most complete list of Nand flash Memories with algorithms for correction of bad data in MLC Nand Flashes. TNM5000 is one of the fastest Nand Programmers in the world with Read & Write Speed up to 8 MegaByte per Second. All Nand Flashes can be automatically detected by software in case of unreadable or remarked device names.

Serial Flash Memories: All 8-16 Pins Serial SPI flash memories are supported by TNM5000. All SPI flash Memories can be detected automatically by software in case of unreadable device names. It reads & programs SPi flashes with maximum safe speed on ZIF (6-7 Mbit/second) . Also it Unprotects the write protected flashes before writing data to it.

Microcontrollers:

ATMEL: All AVR 8 bits chips (ATMEGA/ATTINY/AT90S) are supported on ZIF Scocket & by ISP cable. High Voltage Parallel on ZIF Programming of AVR up to 64 pins is supported. newly introduced ATXMEGA Series are supported by both PDI & JTAG Method. Old C51 series & new single cycle C51 series are completely supported. All the above series can be detected automatically by TNM5000. ARM7 programming by JTAG is supported.

Microchip: One of the most complete device list for microchip PIC microcontrollers including all PIC12F /PIC12C /PIC16C / PIC16F / PIC18F / DPIC33F / J & K Series. Devices up to 40 Pins can be programmed on ZIF , All PICs can be detected automatically & programmed by ISP cable.

Others: ST, SST, Philips (NXP) , Motorola , Syncmos, Silicon Lab , ICSI , Infineon , Intel , Winbond & ...

Automotive MCUS: Supporting of ST10F & TMS370 Series by ISP cable for many BOSCH/VALEO/SAGEM ECUs (complete ST10F support of XPROG-m programmer device list). supporting of siemense & infineon SAK-C167 connected to 44 or 48 pins flash (Siemense/BOSCH/SAGEM S2000 ECU) like HSE FlasHit Programmer. Supporting NEC & Motorola Devices for Dashboards.

PLD/CPLD/FPGA: Supporting All ALTERA JTAG Devices by emulation of USB B l a s t e r Programmer in Quartus Software. Supporting of Xilinx CPLD/FPGA with jed file. Fast Xilinx FPGA configuration with bit file. Supporting of GAL/PALCE Devices with special option for PALCE unlocking.

Software: With multiple language support (English / Chinese / Russian /polska /Arabic / French /FARSI). More languages & Devices can be added by customer request. You Can Download Software & run it in Demo mode to evaluate it.

Package List:

1 x TNM5000 Programmer

1 x TSOP56 adapter set IC socket (5PCS)

1 x TSOP48 adapter set IC socket

1 x usb cable

1 x software CD

CH002464
€439.01

TNM5000 USB fast ISP EEPROM universal Programmer + TSOP48 TSOP56 adapter set IC socket

BD82HM67 SLJ4N Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002465
€17.14

BD82HM67 SLJ4N Stencil Template 90*90

DH82Z87 SR176

DH82Z87 SR176

Part Number DH82Z87 SR176 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002466
€39.06

DH82Z87 SR176

LGA775 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002467
€4.35

LGA775 Stencil Template

NIKOS P1403EV8

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002456
€3.45

NIKOS P1403EV8

Maxim MAX8770GTL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002457
€3.45

Maxim MAX8770GTL

SR1W2 N3530

SR1W2 N3530

Part Number SR1W2 N3530 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 360 PCS Description Original new

SR1W2 N3530 FH8065301728501 Intel Pentium CPU BGA1170 2.16 GHz Cores4

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002458
€57.44

SR1W2 N3530

ITE IT8502E KXA

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002459
€3.45

ITE IT8502E (KXA)

2150798006

215-0798006

Part Number 215-0798006 Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002460
€95.78

215-0798006

i54210H SR1Q0 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002461
€8.70

i5-4210H SR1Q0 Stencil Template

SIS M661GX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002462
€10.33

SIS M661GX

2150910052 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002463
€17.23

215-0910052 Stencil Template 90*90

TNM5000 USB fast ISP EEPROM universal Programmer TSOP48 TSOP56 adapter set IC socket

TNM5000 Universal Programmer Introduction

Login to Download: * Programmer latest Software

User Manual Device List Nand Software Utility Software for RS232 & USB Bl a ster Emulation

? 23000 Supported Devices Flash Memory (Parallel / Nand /Serial) , EPROM , EEPROM , Serial EEPROM , Microcontroller , NVRAM , FRAM , CPLD , PLD , FPGA).

? 48-Pins ZIF Socket with Pin Continuity tester & 10-Pins ISP/JTAG Connector.

? USB 2.0 High Speed ,Program 1 Gbit Nand Flash less than 50 sec , Reading Serial Flash memory with 6 Mbit/Sec Speed.

? Auto detection of all flash Memories/Microcontrollers with Device ID.

? User friendly software for Windows XP/VISTA/7/8 (32,64 bits).

? Multiple Programming is possible by attaching 2 or more Programmers to one PC.

? Very low cost Main Unit & Low cost adaptors.

? Special Abilities like, Altera US,B-B.l*a*s.ter Emulation for Quartus Software, Serial Port Emulation , Vehicle ECU , Immoblizer & Dashboard microcontroller Support.

Parallel Flash Memories: up to 56 pins parallel flash memories are supported by TNM5000. it Supports different kind of packages (PLCC , TSOP1 , TSOP2 ,VSOP & ...).

All Flashes can be automatically detected by software in case of unreadable device names. By using a single adaptor for all 32-48 pins TSOP flashes , user only need 1 adaptor for over 2000 flash chips.

Nand Flash Memories: TNM5000 has an additional Nand+ software , specially designed for Nand flash memories. Nand+ Software has one of the most complete list of Nand flash Memories with algorithms for correction of bad data in MLC Nand Flashes. TNM5000 is one of the fastest Nand Programmers in the world with Read & Write Speed up to 8 MegaByte per Second. All Nand Flashes can be automatically detected by software in case of unreadable or remarked device names.

Serial Flash Memories: All 8-16 Pins Serial SPI flash memories are supported by TNM5000. All SPI flash Memories can be detected automatically by software in case of unreadable device names. It reads & programs SPi flashes with maximum safe speed on ZIF (6-7 Mbit/second) . Also it Unprotects the write protected flashes before writing data to it.

Microcontrollers:

ATMEL: All AVR 8 bits chips (ATMEGA/ATTINY/AT90S) are supported on ZIF Scocket & by ISP cable. High Voltage Parallel on ZIF Programming of AVR up to 64 pins is supported. newly introduced ATXMEGA Series are supported by both PDI & JTAG Method. Old C51 series & new single cycle C51 series are completely supported. All the above series can be detected automatically by TNM5000. ARM7 programming by JTAG is supported.

Microchip: One of the most complete device list for microchip PIC microcontrollers including all PIC12F /PIC12C /PIC16C / PIC16F / PIC18F / DPIC33F / J & K Series. Devices up to 40 Pins can be programmed on ZIF , All PICs can be detected automatically & programmed by ISP cable.

Others: ST, SST, Philips (NXP) , Motorola , Syncmos, Silicon Lab , ICSI , Infineon , Intel , Winbond & ...

Automotive MCUS: Supporting of ST10F & TMS370 Series by ISP cable for many BOSCH/VALEO/SAGEM ECUs (complete ST10F support of XPROG-m programmer device list). supporting of siemense & infineon SAK-C167 connected to 44 or 48 pins flash (Siemense/BOSCH/SAGEM S2000 ECU) like HSE FlasHit Programmer. Supporting NEC & Motorola Devices for Dashboards.

PLD/CPLD/FPGA: Supporting All ALTERA JTAG Devices by emulation of USB B l a s t e r Programmer in Quartus Software. Supporting of Xilinx CPLD/FPGA with jed file. Fast Xilinx FPGA configuration with bit file. Supporting of GAL/PALCE Devices with special option for PALCE unlocking.

Software: With multiple language support (English / Chinese / Russian /polska /Arabic / French /FARSI). More languages & Devices can be added by customer request. You Can Download Software & run it in Demo mode to evaluate it.

Package List:

1 x TNM5000 Programmer

1 x TSOP56 adapter set IC socket (5PCS)

1 x TSOP48 adapter set IC socket

1 x usb cable

1 x software CD

CH002464
€439.01

TNM5000 USB fast ISP EEPROM universal Programmer + TSOP48 TSOP56 adapter set IC socket

BD82HM67 SLJ4N Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002465
€17.14

BD82HM67 SLJ4N Stencil Template 90*90

DH82Z87 SR176

DH82Z87 SR176

Part Number DH82Z87 SR176 Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 14+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002466
€39.06

DH82Z87 SR176

LGA775 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002467
€4.35

LGA775 Stencil Template