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i74700HQ SR15E Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002495
€6.47

i7-4700HQ SR15E Stencil Template

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G8453A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002496
€5.40

G84-53-A2 Stencil Template

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RICHTEK RT8250

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002497
€3.45

RICHTEK RT8250

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NPCT411IAOWX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002498
€7.94

NPCT411IAOWX

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Mechanic VC04 VCC power supply short circuit delector

A. Welcome To Choose The Production-MECHANIC

This manual will guide you how to use the production. MECHANIC reserves the right of final interpretation, including the manual, the three-package certificate and related materials.

Executive standard:DL/T 856-2018,GB/T 17478-2004

Information in this manual is subject to change without notice.

B. Product List

? Host *1

? Type-C Cable *1

? Insulated Crocodile Clips/Multimeter Pen Probe Test Cable *1

? Instructions *1

C. Function Description

This product develops a safe and efficient detector according to the maintenance master's understanding of the mainboard circuit power supply system, in which quickly troubleshooting for short circuit components of power supply cable in mainboard circuit, it contains four models (1.2V/1.8V/3.0V/3.8V) accurate voltage, current display,Built-in lithium battery, external charging port, It is a necessary tool for maintenance master to test the circuit of mobile phone.

D. Parameter

(Host Size) :85*55*35mm

(Voltage Mode) : 1.2V/1.8V/3.0V/3.8V (4 Types)

(Current): 25A (Max)

(Power) :100W (Max)

(Charging Port): Type-C(DC 5V/1A.4 hrs full charge)

(Work Time) :168 hrs

E. Operation Method

1. Turn on the power.

2. Select testing model(1.2V/1.8V/3.0V/3.8V).

3. The black crocodile clamps the negative electrode and positive connection test circuit.

4. Press the start button to complete.

F. Attention

Please pay attention to low voltage circuit, do not use overload voltage for circuit test, high voltage test low voltage circuit, may burn low voltage circuit components, please use similar or the same voltage gear for circuit test.

G. Warranty

Thank you for choosing this type of products, please read the following terms before using:

1. From purchasing date within 7 days, under normal use(Non-artificial damage),new package,not be disassemble and repaired .enjoy replacement service.

2. From purchasing date within one year, under normal use, if there are quality problem, not bedisassemble and repaired .enjoy free repair service.

3. For more than warranty, we provide a lifetime warranty service, free of labor costs, chargeonly spare parts costs.

4. Failure to present warranty card during warranty period, the company will not be a free service.

5. Users need warranty service, please contact your original sales unit.

6. When users need warranty service, please provide warranty card and purchase invoice, orreceipt of the certificate of the company seal.

7. Warranty does not include transportation costs and provide on-site service.

Note: This product contains a built-in battery

CH002499
€51.97

Mechanic VC04 VCC power supply short circuit delector

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N13EGS1LPA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002500
€17.14

N13E-GS1-LP-A1 Stencil Template 90*90

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GK110425A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002501
€6.22

GK110-425-A1 Stencil Template

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Universal Mobile Phone Battery Charging Activate Repair For Apple iPad Air Mini iPhone HUAWEI OPPO VIVO SAMSUNG

Universal Mobile Phone Battery Charging Activate Repair For Apple iPad Air Mini iPhone HUAWEI OPPO VIVO SAMSUNG

Characteristics:

Activation

?charging plate with red / black power cable, insulated cushion of sponge and USB update of the extension project, it is used to activate safely and rapidly charge the battery or batteries get old dead people back to life.

?with motherboard design, is convenient to replace and disassemble.

?fun??o of automatic discharge, when the battery is fully charged, it will automatic unloading to prevent overheating.

The plate

?the will automatically adjust the module of the display of voltage and current.

?a dual display: the current display, the display voltage.

Specification:

?g. W: 125g.

?packing size: 180 * 110 * 30MM.

?compat?vel: for iPhone 4G, 5g, 4S, 5S, 6, 6 plus / 6 S / 6 s plus /, 7 / 7 plus, 8 / 8 plus / X for iPad, for Samsung, for me, for Huawei, alive, to the opposite, and most of the mobile phones in China.

Package includes:

1 * mother of loading plate of activation.

4 * single shipment of activation.

1 * RED / black power cable

2 * Micro USB cable

CH002502
€27.23

Universal Mobile Phone Battery Charging Activate Repair For Apple iPad Air Mini iPhone HUAWEI OPPO VIVO SAMSUNG

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Maxim MAX1540

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002503
€3.45

Maxim MAX1540

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ISL6227CAZ INTERSIL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002504
€3.45

ISL6227CAZ INTERSIL

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i57300HQ SR32S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002505
€6.84

i5-7300HQ SR32S Stencil Template

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2180660017 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002506
€5.40

218-0660017 Stencil Template

i74700HQ SR15E Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002495
€6.47

i7-4700HQ SR15E Stencil Template

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Compare

G8453A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002496
€5.40

G84-53-A2 Stencil Template

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Compare

RICHTEK RT8250

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002497
€3.45

RICHTEK RT8250

wishlist
Compare

NPCT411IAOWX

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002498
€7.94

NPCT411IAOWX

wishlist
Compare

Mechanic VC04 VCC power supply short circuit delector

A. Welcome To Choose The Production-MECHANIC

This manual will guide you how to use the production. MECHANIC reserves the right of final interpretation, including the manual, the three-package certificate and related materials.

Executive standard:DL/T 856-2018,GB/T 17478-2004

Information in this manual is subject to change without notice.

B. Product List

? Host *1

? Type-C Cable *1

? Insulated Crocodile Clips/Multimeter Pen Probe Test Cable *1

? Instructions *1

C. Function Description

This product develops a safe and efficient detector according to the maintenance master's understanding of the mainboard circuit power supply system, in which quickly troubleshooting for short circuit components of power supply cable in mainboard circuit, it contains four models (1.2V/1.8V/3.0V/3.8V) accurate voltage, current display,Built-in lithium battery, external charging port, It is a necessary tool for maintenance master to test the circuit of mobile phone.

D. Parameter

(Host Size) :85*55*35mm

(Voltage Mode) : 1.2V/1.8V/3.0V/3.8V (4 Types)

(Current): 25A (Max)

(Power) :100W (Max)

(Charging Port): Type-C(DC 5V/1A.4 hrs full charge)

(Work Time) :168 hrs

E. Operation Method

1. Turn on the power.

2. Select testing model(1.2V/1.8V/3.0V/3.8V).

3. The black crocodile clamps the negative electrode and positive connection test circuit.

4. Press the start button to complete.

F. Attention

Please pay attention to low voltage circuit, do not use overload voltage for circuit test, high voltage test low voltage circuit, may burn low voltage circuit components, please use similar or the same voltage gear for circuit test.

G. Warranty

Thank you for choosing this type of products, please read the following terms before using:

1. From purchasing date within 7 days, under normal use(Non-artificial damage),new package,not be disassemble and repaired .enjoy replacement service.

2. From purchasing date within one year, under normal use, if there are quality problem, not bedisassemble and repaired .enjoy free repair service.

3. For more than warranty, we provide a lifetime warranty service, free of labor costs, chargeonly spare parts costs.

4. Failure to present warranty card during warranty period, the company will not be a free service.

5. Users need warranty service, please contact your original sales unit.

6. When users need warranty service, please provide warranty card and purchase invoice, orreceipt of the certificate of the company seal.

7. Warranty does not include transportation costs and provide on-site service.

Note: This product contains a built-in battery

CH002499
€51.97

Mechanic VC04 VCC power supply short circuit delector

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Compare

N13EGS1LPA1 Stencil Template 90x90

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002500
€17.14

N13E-GS1-LP-A1 Stencil Template 90*90

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Compare

GK110425A1 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002501
€6.22

GK110-425-A1 Stencil Template

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Compare

Universal Mobile Phone Battery Charging Activate Repair For Apple iPad Air Mini iPhone HUAWEI OPPO VIVO SAMSUNG

Universal Mobile Phone Battery Charging Activate Repair For Apple iPad Air Mini iPhone HUAWEI OPPO VIVO SAMSUNG

Characteristics:

Activation

?charging plate with red / black power cable, insulated cushion of sponge and USB update of the extension project, it is used to activate safely and rapidly charge the battery or batteries get old dead people back to life.

?with motherboard design, is convenient to replace and disassemble.

?fun??o of automatic discharge, when the battery is fully charged, it will automatic unloading to prevent overheating.

The plate

?the will automatically adjust the module of the display of voltage and current.

?a dual display: the current display, the display voltage.

Specification:

?g. W: 125g.

?packing size: 180 * 110 * 30MM.

?compat?vel: for iPhone 4G, 5g, 4S, 5S, 6, 6 plus / 6 S / 6 s plus /, 7 / 7 plus, 8 / 8 plus / X for iPad, for Samsung, for me, for Huawei, alive, to the opposite, and most of the mobile phones in China.

Package includes:

1 * mother of loading plate of activation.

4 * single shipment of activation.

1 * RED / black power cable

2 * Micro USB cable

CH002502
€27.23

Universal Mobile Phone Battery Charging Activate Repair For Apple iPad Air Mini iPhone HUAWEI OPPO VIVO SAMSUNG

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Maxim MAX1540

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002503
€3.45

Maxim MAX1540

wishlist
Compare

ISL6227CAZ INTERSIL

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002504
€3.45

ISL6227CAZ INTERSIL

wishlist
Compare

i57300HQ SR32S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002505
€6.84

i5-7300HQ SR32S Stencil Template

wishlist
Compare

2180660017 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH002506
€5.40

218-0660017 Stencil Template

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Compare
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