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  • Categories: BGA Reballing Kits, Stencils
  • Categories: DC Jacks, Connector
  • Categories: Laptop used parts, scrap parts
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DC Power Jack Part PJ089

Acer Aspire 1430 1430G 1430Z Series DC Power Jack Connector: 1430 AS1430, 1430-xxxx AS1430-xxxx, 1430-4857 AS1430-4857, 1430G AS1430G, 1430G-xxxx AS1430G-xxxx, 1430Z AS1430Z, 1430Z-xxxx AS1430Z-xxxx, 1430Z-4677 AS1430Z-4677

Acer Aspire TimelineX 1830 Series DC Power Jack Connector: 1830 AS1830, 1830-xxxx AS1830-xxxx, 1830-3595 AS1830-3595, 1830T-3337 AS1830T-3337, 1830T-3425 AS1830T-3425, 1830T-3505 AS1830T-3505, 1830T-3721 AS1830T-3721, 1830T-3927 AS1830T-3927, 1830T-4549 AS1830T-4549, 1830T-6478 AS1830T-6478, 1830T-6651 AS1830T-6651, 1830T-7618 AS1830T-7618

CH000352
€14.42

DC Power Jack, Part #PJ089

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Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

For sale, a brand new DC Power Jack Socket Connector for Lenovo Flex IdeaPad 10 Series laptops.

Fixes issues caused by faulty Socket :

Device does not power on or receives intermittent power

You have to "hold" or move the AC adapter plug tip to gain a power connection

Device randomly shuts down without any warning

The power jack wiggles & feels loose

The device runs only on a charged battery

The battery will not charge

CH000353
€7.46

Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

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J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

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LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

DC Power Jack Part PJ089

Acer Aspire 1430 1430G 1430Z Series DC Power Jack Connector: 1430 AS1430, 1430-xxxx AS1430-xxxx, 1430-4857 AS1430-4857, 1430G AS1430G, 1430G-xxxx AS1430G-xxxx, 1430Z AS1430Z, 1430Z-xxxx AS1430Z-xxxx, 1430Z-4677 AS1430Z-4677

Acer Aspire TimelineX 1830 Series DC Power Jack Connector: 1830 AS1830, 1830-xxxx AS1830-xxxx, 1830-3595 AS1830-3595, 1830T-3337 AS1830T-3337, 1830T-3425 AS1830T-3425, 1830T-3505 AS1830T-3505, 1830T-3721 AS1830T-3721, 1830T-3927 AS1830T-3927, 1830T-4549 AS1830T-4549, 1830T-6478 AS1830T-6478, 1830T-6651 AS1830T-6651, 1830T-7618 AS1830T-7618

CH000352
€14.42

DC Power Jack, Part #PJ089

wishlist
Compare

Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

For sale, a brand new DC Power Jack Socket Connector for Lenovo Flex IdeaPad 10 Series laptops.

Fixes issues caused by faulty Socket :

Device does not power on or receives intermittent power

You have to "hold" or move the AC adapter plug tip to gain a power connection

Device randomly shuts down without any warning

The power jack wiggles & feels loose

The device runs only on a charged battery

The battery will not charge

CH000353
€7.46

Lenovo IdeaPad Flex 10 Series TouchScreen DC Power Jack Socket Connector

wishlist
Compare

J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

wishlist
Compare

LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

wishlist
Compare
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