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  • Categories: Programmer & Sockets
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EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit and Adapter Socket

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Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
€22.01

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit and Adapter Socket

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J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

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LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 3264bit and Adapter Socket

Login to Download: Download software

Product Description:

Software and firmware update.

Surpport 25 FLASH, 24 EEPROM, 25 EEPROM, 93 EEPROM,etc.

Small shape. small size and weight light and low power loss.

Working with Windows 2000, Windows XP, Windows Vista, Windows 7(32bit & 64bit).

USB 2.0 interface, the speed is 12Mbps.

The speed of reading and writing is very fast.

Auto select power votage.

Auto detect chip modles.

Auto off-line chip copy.

Read and Write the bios chips of DVD,TV,PC,harddisk,etc.

Package include:

1* EZP2013 Programmer

1* USB2.0 12Mbps Interface

1* CD with PDF file and install file

1* 150mil SOP8 to DIP8 Socket

1* 200-208mil SOP8 to DIP8 Socket

1* SOP16-DIP8 (300mil)

2* Simple SMD PIN8 DIP

1* 1.8V Conversion adapter

CH000249
€22.01

EZP2013 USB Programmer SPI 24 25 93 EEPROM Flash Bios win8 32/64bit and Adapter Socket

wishlist
Compare

J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

wishlist
Compare

LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

wishlist
Compare
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