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  • Categories: BGA Reballing Kits, Stencils
  • Categories: Programmer socket
  • Brand: Chipsetpro.com
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A1989 Rom Socket Assistant U2890 Notebook Chip W25Q80DVUXIE Adapter USON 2x3 0.5

Socket of ROM Chip W25Q80DV, size 3x2 U2890

You can read backup and modify of U2890 Rom Chip from 2018 to 2020 Year.

In package:  1pcs x Socket 3x2, 0.5 pitch 

Compatible U2890 for this models:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000160
€52.00

Rom Socket Adapter Assistant USON 2x3 For U2890 W25Q80DVUXIE 

In package: 1pcs x USON 2x3, 0.5 pitch socket

Compatible:

A2251 820-01949

A2289 820-01987

A2141 820-01700

A2159 820-01598

A1990 820-01041

A1989 820-00850

A1932 820-01521

A2179 820-01958

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BGA100 BGA64 BGA153 BGA169 Socket Adapter EMMC DDR CPU Flash IC Adapter RT809H

In package included: 

 

1pcs x BGA64 Socket 

1pcs x frame 11*13 mm, compatible S29GL512 S29GL256 S29GL128 S29GL064 S29GL032

1pcs x frame 10*13 mm, compatible 28F640, 28F128

1pcs x frame 10*15 mm, compatible 28F256

1pcs x frame 9*9

 

1pcs x BGA153/169 Socket 

1pcs x frame 11*10 mm

1pcs x frame 11.5*13 mm 

1pcs x frame 12*16 mm

1pcs x frame 12*18 mm

1pcs x frame 14*18 mm

 

1pcs x BGA100 Socket 

1pcs x frame 14*18 mm

  

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000163
€196.00

BGA64

BGA100

BGA153/169

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J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

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LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

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i5520E SLBP6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000189
€5.40

i5-520E SLBP6 Stencil Template

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216LQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
€5.40

216LQA6AVA12FG Stencil Template

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i72675QM SR02S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
€5.40

i7-2675QM SR02S Stencil Template

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GK107250A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
€5.40

GK107-250-A2 Stencil Template

A1989 Rom Socket Assistant U2890 Notebook Chip W25Q80DVUXIE Adapter USON 2x3 0.5

Socket of ROM Chip W25Q80DV, size 3x2 U2890

You can read backup and modify of U2890 Rom Chip from 2018 to 2020 Year.

In package:  1pcs x Socket 3x2, 0.5 pitch 

Compatible U2890 for this models:

A2251 820-01949
A2289 820-01987
A2141 820-01700
A2159 820-01598
A1990 820-01041
A1989 820-00850
A1932 820-01521
A2179 820-01958

 

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000160
€52.00

Rom Socket Adapter Assistant USON 2x3 For U2890 W25Q80DVUXIE 

In package: 1pcs x USON 2x3, 0.5 pitch socket

Compatible:

A2251 820-01949

A2289 820-01987

A2141 820-01700

A2159 820-01598

A1990 820-01041

A1989 820-00850

A1932 820-01521

A2179 820-01958

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BGA100 BGA64 BGA153 BGA169 Socket Adapter EMMC DDR CPU Flash IC Adapter RT809H

In package included: 

 

1pcs x BGA64 Socket 

1pcs x frame 11*13 mm, compatible S29GL512 S29GL256 S29GL128 S29GL064 S29GL032

1pcs x frame 10*13 mm, compatible 28F640, 28F128

1pcs x frame 10*15 mm, compatible 28F256

1pcs x frame 9*9

 

1pcs x BGA153/169 Socket 

1pcs x frame 11*10 mm

1pcs x frame 11.5*13 mm 

1pcs x frame 12*16 mm

1pcs x frame 12*18 mm

1pcs x frame 14*18 mm

 

1pcs x BGA100 Socket 

1pcs x frame 14*18 mm

  

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

 

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

Si no eres de Europa, consulta sobre el impuesto de aduanas, el IVA de tu país.

CH000163
€196.00

BGA64

BGA100

BGA153/169

wishlist
Compare

J2850 SR1LM Stencil Template

J2850 SR1LM Stencil Template

Part Number intel CPU Stencil Manufacturer ATK

Stencil Template Direct heating Metal 304 Stainless steel

Package/Case 1 PCS Description Buik new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000186
€6.22

J2850 SR1LM Stencil Template

wishlist
Compare

LE82GM965 SLA5T Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000188
€5.40

LE82GM965 SLA5T Stencil Template

wishlist
Compare

i5520E SLBP6 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000189
€5.40

i5-520E SLBP6 Stencil Template

wishlist
Compare

216LQA6AVA12FG Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000192
€5.40

216LQA6AVA12FG Stencil Template

wishlist
Compare

i72675QM SR02S Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000195
€5.40

i7-2675QM SR02S Stencil Template

wishlist
Compare

GK107250A2 Stencil Template

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000198
€5.40

GK107-250-A2 Stencil Template

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