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  • Categories: CPU and Graphic Chips
  • Categories: Laptop Parts, Repair tool
  • Categories: Other BGA Chips & ICs
  • Categories: Programmer socket
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EM1200GBB22GV E11200

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000220
€32.55

EM1200GBB22GV E1-1200

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RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

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DH82Z97 SR1JJ

DH82Z97 SR1JJ

Part Number DH82Z97 SR1JJ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000226
€35.28

DH82Z97 SR1JJ

  • -€8.26
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SMD SPI IC Socket Adapter WSON 8 QFN 8 PIN 6x5mm, 6x8mm Flash Chips 25x 24x DFN

<<<<Price For Both Socket's>>>> 

In package included:

1pcs : WSON 6x8

1pcs : WSON 6x5

Compatible with programmer: RT809H, SVOD , TNM, TL866, XGECU

------------------------------------------

Type:QFN8 MLF8 MLP8 To DIP8

Adapter Model: CNV-QFN8-DIP

Chip Pin Pitch:1.27mm 

Number Of Pins: 8 (4x2 Side)

Chip Size (mm): 8x6mm

DIP Pin Header Pitch: 2.54mm

------------------------------------------

Type:QFN8 MLF8 MLP8 To DIP8

Adapter Model: CNV-QFN8-DIP

Chip Pin Pitch:1.27mm 

Number Of Pins: 8 (4x2 Side)

Chip Size (mm): 6x5mm

DIP Pin Header Pitch: 2.54mm

 

Shipping details:
You can select shipping option in checkout:  Economy or Expedited

Economy via Deutsche Post

Expedited - DHL courier / DPD courier

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

SE000010
€46.74 €55.00

WSON8 QFN8 Socket 6x5

WSON8 QFN8 Socket 6x8

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BGA24 DIP8 Adapter Flash socket SVOD TNM Willem SKYPRO RT809H RT809F TL866II EZP

Packing list:

1pcs BGA24 socket

1pcs Frame 5x5 (6x8)

Compatible programmers: SVOD programmer, Willem, TNM, SKYPRO, TL866, TNM, RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013, SuperPro, GZUT XPRO and so on.

Can be supported the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 5x5 size of the standards

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

 

CH000072
€42.00

Packing list:

1pcs BGA24 socket
1pcs Frame 5x5 (6x8)

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GL82HM175 SR30W

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000227
€57.44

GL82HM175 SR30W

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1.5m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000203
€6.22

1.5m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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INTEL LE82GME965 SLA9F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
€22.24

INTEL LE82GME965 SLA9F

EM1200GBB22GV E11200

EM1200GBB22GV E1-1200

Part Number EM1200GBB22GV Manufacturer AMD

BGA Alloy No Pb/Lead Free Date Code 13+

Package/Case 360 Description Original new

EM1200GBB22GV E1-1200 Processor for Laptop AMD E1 BGA413 1.4 GHz CPU

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000220
€32.55

EM1200GBB22GV E1-1200

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RALINK RT3050F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000191
€3.45

RALINK RT3050F

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NT71209FG810

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000193
€3.45

NT71209FG-810

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DH82Z97 SR1JJ

DH82Z97 SR1JJ

Part Number DH82Z97 SR1JJ Manufacturer Intel

BGA Alloy No Pb/Lead Free Date Code 16+

Package/Case 1 PCS Description Brand new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000226
€35.28

DH82Z97 SR1JJ

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  • -€8.26

SMD SPI IC Socket Adapter WSON 8 QFN 8 PIN 6x5mm, 6x8mm Flash Chips 25x 24x DFN

<<<<Price For Both Socket's>>>> 

In package included:

1pcs : WSON 6x8

1pcs : WSON 6x5

Compatible with programmer: RT809H, SVOD , TNM, TL866, XGECU

------------------------------------------

Type:QFN8 MLF8 MLP8 To DIP8

Adapter Model: CNV-QFN8-DIP

Chip Pin Pitch:1.27mm 

Number Of Pins: 8 (4x2 Side)

Chip Size (mm): 8x6mm

DIP Pin Header Pitch: 2.54mm

------------------------------------------

Type:QFN8 MLF8 MLP8 To DIP8

Adapter Model: CNV-QFN8-DIP

Chip Pin Pitch:1.27mm 

Number Of Pins: 8 (4x2 Side)

Chip Size (mm): 6x5mm

DIP Pin Header Pitch: 2.54mm

 

Shipping details:
You can select shipping option in checkout:  Economy or Expedited

Economy via Deutsche Post

Expedited - DHL courier / DPD courier

Information for customer / Información para el cliente:

if you are not from Europe, please inquire about customs tax, VAT of your country.

We send products in Russia only via registered POST (12-20 days).

Colombia, Paraguay, Brazil, Mexico, Peru - before placing an order, please to ask your customs about tax and duties.

Colombia, Paraguay, Brazil, Mexico, Peru - antes de realizar un pedido, consulte con la aduana sobre la cantidad de impuestos y aranceles.

SE000010
€46.74 €55.00

WSON8 QFN8 Socket 6x5

WSON8 QFN8 Socket 6x8

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BGA24 DIP8 Adapter Flash socket SVOD TNM Willem SKYPRO RT809H RT809F TL866II EZP

Packing list:

1pcs BGA24 socket

1pcs Frame 5x5 (6x8)

Compatible programmers: SVOD programmer, Willem, TNM, SKYPRO, TL866, TNM, RT809H RT809F TL966CS TL866A TL866II EZP2010 EZP2013, SuperPro, GZUT XPRO and so on.

Can be supported the body of spi flash, for example, W25Q16, W25Q32, W25Q64, W25Q128, W25Q256 5x5 size of the standards

You can select shipping option in checkout:  Economy or Expedited

Economy: 10-35 working days (Europe and Worldwide)

Expedited : 5-10 working days  (Europe and Worldwide)

If you are not from Europe, please inquire about customs tax, VAT of your country.

We do not ship products to Australia with economy Post, only Express.

We do not ship any products to Russia.

Counties: Colombia, Paraguay, Brazil, Mexico, India, UK, Canada and ect - before placing an order, please to ask your customs about tax and duties.

 

CH000072
€42.00

Packing list:

1pcs BGA24 socket
1pcs Frame 5x5 (6x8)

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GL82HM175 SR30W

GL82HM175 SR30W

Part Number GL82HM175 SR30W Manufacturer INTEL

BGA Alloy No Pb/Lead Free Date Code 15+

Package/Case 1 PCS Description Original new

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000227
€57.44

GL82HM175 SR30W

wishlist
Compare

1.5m OMEGA KTYPE Thermocouple TTK30SLE

OMEGA thermocouple line

Model: temperature range: -200? ~260? (PTFE material) -200-500? (glass fiber material)

Wire diameter: 2*F0.127mm 2*0.255MM

Core material: nickel chromium / nickel silicon (K) copper / constantan (T) iron / copper nickel (J)

Color mark: red is negative / yellow is positive

The thermocouple temperature line for any K type imported and domestic use temperature recording instrument, used in the laboratory, aerospace engineering, shipbuilding, petrochemical, machinery fittings (reflow) etc.

CH000203
€6.22

1.5m OMEGA K-TYPE Thermocouple TT-K-30-SLE

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Compare

INTEL LE82GME965 SLA9F

Technical Support

BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING

BGA Chips is MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125C x 24 hours or 80C x 48 hours

Pay attention to the difference between

leaded (Pb) balls and lead free (No Pb) balls.

Lead-free/No Pb BGA chips:

245C-260C(Maximun)

Leaded/Pb BGA chips:

180C-205C(Maximun)

Sufficient Stock

CH000196
€22.24

INTEL LE82GME965 SLA9F

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